¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : Àç·á À¯Çü, Çü»ó, ±â¼ú, ÃÖÁ¾ ÀÌ¿ë »ê¾÷, ¿ëµµº° - ¼¼°è ¿¹Ãø(2025-2030³â)
Epoxy Molding Compound Market by Materials Type, Form, Technology, End-Use Industry, Application - Global Forecast 2025-2030
»óǰÄÚµå : 1718227
¸®¼­Ä¡»ç : 360iResearch Private Limited
¹ßÇàÀÏ : 2025³â 04¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 181 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 3,939 £Ü 5,458,000
PDF, Excel & 1 Year Online Access (Single User License) help
PDF ¹× Excel º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÅØ½ºÆ® µîÀÇ º¹»ç ¹× ºÙ¿©³Ö±â, ÀμⰡ °¡´ÉÇÕ´Ï´Ù. ¿Â¶óÀÎ Ç÷§Æû¿¡¼­ 1³â µ¿¾È º¸°í¼­¸¦ ¹«Á¦ÇÑÀ¸·Î ´Ù¿î·ÎµåÇÒ ¼ö ÀÖÀ¸¸ç, Á¤±âÀûÀ¸·Î ¾÷µ¥ÀÌÆ®µÇ´Â Á¤º¸µµ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. (¿¬ 3-4ȸ Á¤µµ ¾÷µ¥ÀÌÆ®)
US $ 4,249 £Ü 5,888,000
PDF, Excel & 1 Year Online Access (2-5 User License) help
PDF ¹× Excel º¸°í¼­¸¦ µ¿Àϱâ¾÷ ³» 5¸í±îÁö ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÅØ½ºÆ® µîÀÇ º¹»ç ¹× ºÙ¿©³Ö±â, ÀμⰡ °¡´ÉÇÕ´Ï´Ù. ¿Â¶óÀÎ Ç÷§Æû¿¡¼­ 1³â µ¿¾È º¸°í¼­¸¦ ¹«Á¦ÇÑÀ¸·Î ´Ù¿î·ÎµåÇÒ ¼ö ÀÖÀ¸¸ç, Á¤±âÀûÀ¸·Î ¾÷µ¥ÀÌÆ®µÇ´Â Á¤º¸µµ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. (¿¬ 3-4ȸ Á¤µµ ¾÷µ¥ÀÌÆ®)
US $ 5,759 £Ü 7,980,000
PDF, Excel & 1 Year Online Access (Site License) help
PDF ¹× Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ ³» µ¿ÀÏ Áö¿ª »ç¾÷ÀåÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÅØ½ºÆ® µîÀÇ º¹»ç ¹× ºÙ¿©³Ö±â, ÀμⰡ °¡´ÉÇÕ´Ï´Ù. ¿Â¶óÀÎ Ç÷§Æû¿¡¼­ 1³â µ¿¾È º¸°í¼­¸¦ ¹«Á¦ÇÑÀ¸·Î ´Ù¿î·ÎµåÇÒ ¼ö ÀÖÀ¸¸ç, Á¤±âÀûÀ¸·Î ¾÷µ¥ÀÌÆ®µÇ´Â Á¤º¸µµ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. (¿¬ 3-4ȸ Á¤µµ ¾÷µ¥ÀÌÆ®)
US $ 6,969 £Ü 9,657,000
PDF, Excel & 1 Year Online Access (Enterprise User License) help
PDF ¹× Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÅØ½ºÆ® µîÀÇ º¹»ç ¹× ºÙ¿©³Ö±â, ÀμⰡ °¡´ÉÇÕ´Ï´Ù. ¿Â¶óÀÎ Ç÷§Æû¿¡¼­ 1³â µ¿¾È º¸°í¼­¸¦ ¹«Á¦ÇÑÀ¸·Î ´Ù¿î·ÎµåÇÒ ¼ö ÀÖÀ¸¸ç, Á¤±âÀûÀ¸·Î ¾÷µ¥ÀÌÆ®µÇ´Â Á¤º¸µµ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. (¿¬ 3-4ȸ Á¤µµ ¾÷µ¥ÀÌÆ®)


¤± Add-on °¡´É: °í°´ÀÇ ¿äû¿¡ µû¶ó ÀÏÁ¤ÇÑ ¹üÀ§ ³»¿¡¼­ CustomizationÀÌ °¡´ÉÇÕ´Ï´Ù. ÀÚ¼¼ÇÑ »çÇ×Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.
¤± º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼Û±âÀÏÀº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

Çѱ۸ñÂ÷

¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀåÀº 2023³â¿¡ 22¾ï 3,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾úÀ¸¸ç, 2024³â¿¡´Â 23¾ï 5,000¸¸ ´Þ·¯, CAGR 5.66%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 32¾ï 8,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁØ ¿¬µµ 2023³â 22¾ï 3,000¸¸ ´Þ·¯
ÃßÁ¤ ¿¬µµ 2024³â 23¾ï 5,000¸¸ ´Þ·¯
¿¹Ãø ¿¬µµ 2030³â 32¾ï 8,000¸¸ ´Þ·¯
CAGR(%) 5.66%

ºü¸£°Ô ¹ßÀüÇϴ ÷´Ü Àç·á Áß ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå´Â Çö´ë Á¦Á¶ ±â¼ú Çõ½ÅÀ» Áö¿øÇÏ´Â Áß¿äÇÑ ºÎǰÀ¸·Î ºÎ»óÇß½À´Ï´Ù. Àü ¼¼°è »ê¾÷°è°¡ °í¼º´É, °í³»±¸¼º, °í½Å·Ú¼º ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡ÇÔ¿¡ µû¶ó ¿¡Æø½Ã ¼ºÇü ÄÄÆÄ¿îµå´Â ´Ù¾çÇÑ ÀÀ¿ë ºÐ¾ß¿¡¼­ ³Î¸® »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ¿ì¼öÇÑ Àü±â Àý¿¬¼º, ¶Ù¾î³­ ±â°èÀû °­µµ, ¶Ù¾î³­ ¿­ ¾ÈÁ¤¼ºÀ» Á¦°øÇÏ´Â ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµåÀÇ ±âº» ´É·ÂÀº ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ¿¡¼­ °¡Àü, ÇコÄɾ À̸£±â±îÁö ´Ù¾çÇÑ ºÐ¾ß¿¡¼­ ºÎȰÀ» À̲ø¾ú½À´Ï´Ù. Áö³­ 10³â°£ ÁøÈ­ÇÏ´Â Àç·á °úÇаú Çõ½ÅÀûÀÎ ¹èÇÕ ±â¼úÀº ½ÃÀåÀ» À籸¼ºÇϰí R&D ÅõÀÚ¿Í »ý»ê ¹æ½ÄÀÇ º¯È­¸¦ ÁÖµµÇØ ¿Ô½À´Ï´Ù.

ÀÌ Á¾ÇÕÀûÀÎ ºÐ¼®Àº ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµåÀÇ Àü·«Àû ¿ªÇÒ°ú ±â¼úÀû Áøº¸¸¦ ÀÌÇØÇÏ´Â µ¥ µµ¿òÀÌ µÉ °ÍÀÔ´Ï´Ù. ½ÃÀå ºÐ¼®ÀÇ º¹À⼺, ±â¼ú Çõ½Å, Áö¿ª µ¿Çâ, ÀÌ ¿ªµ¿ÀûÀÎ ½ÃÀåÀÇ ÁøÈ­¸¦ ÁÖµµÇÏ´Â ÁÖ¿ä ±â¾÷µé¿¡ ´ëÇØ ÀÚ¼¼È÷ »ìÆìº¾´Ï´Ù. µ¥ÀÌÅÍ¿¡ ±â¹ÝÇÑ ÀλçÀÌÆ®¿Í ¹Ì·¡ÁöÇâÀûÀÎ ºÐ¼®À» ÅëÇØ ¿À´Ã³¯ÀÇ µµÀü°úÁ¦¿Í ¾ÕÀ¸·ÎÀÇ ±âȸ¸¦ ¼³¸íÇÕ´Ï´Ù. Á¦Á¶ °øÁ¤ÀÌ °íµµÈ­µÇ°í ÃÖÁ¾»ç¿ëÀÚÀÇ ±â´ëÄ¡°¡ ³ô¾ÆÁü¿¡ µû¶ó, ¼¼°è ½ÃÀå¿¡¼­ °æÀï·ÂÀ» À¯ÁöÇϰíÀÚ ÇÏ´Â ÀÇ»ç°áÁ¤±ÇÀÚ¿¡°Ô´Â ÀÌ·¯ÇÑ È­ÇÕ¹°¿¡ ´ëÇÑ ±íÀº ÀÌÇØ°¡ ÇʼöÀûÀÔ´Ï´Ù. ÀÌ ¼Ò°³¿¡¼­´Â ¾÷°è¸¦ ÀçÆíÇϰí ÀÖ´Â ½ÃÀå ¿ªÇÐ ¹× Àü·«Àû ¿ä±¸ »çÇ×À» ÀÚ¼¼È÷ »ìÆìº¾´Ï´Ù.

¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀåÀÇ º¯È­

Àç·á °úÇаú »ý»ê ±â¼úÀÇ Çõ½ÅÀº ¿¡Æø½Ã ¼öÁö ¼ºÇü È­ÇÕ¹°À» µÑ·¯½Ñ ȯ°æ¿¡ Å« º¯È­¸¦ °¡Á® ¿Ô½À´Ï´Ù. ÃÖ±Ù ¸î ³â µ¿¾È ¿¡Æø½Ã ¼öÁö ÄÄÆÄ¿îµåÀÇ Æ¯¼º°ú ¿ëµµ´Â ³î¶ó¿î ÁøÈ­¸¦ ÀÌ·ç¾úÀ¸¸ç, ±× ¿øµ¿·ÂÀº ±â¼úÀû Çõ½Å°ú ½ÃÀå ¾Ð·ÂÀÇ »óÈ£ ÀÛ¿ëÀÔ´Ï´Ù. ȯ°æ Áö¼Ó°¡´É¼º ¹× ¼º´É ±âÁØ °­È­¿Í °ü·ÃµÈ ±ÔÁ¦ Á¤Ã¥ÀÇ º¯È­´Â ±âÁ¸ Àç·á¿¡¼­ °í±Þ ¿¡Æø½Ã ¹èÇÕÀ¸·ÎÀÇ ÀüȯÀ» ´õ¿í °¡¼ÓÈ­Çϰí ÀÖ½À´Ï´Ù.

ƯÈ÷ Ã˸Å, °æÈ­Á¦, ÃæÀüÀçÀÇ ¹ßÀüÀº Á¦Ç° ¼º´ÉÀ» ÀçÁ¤ÀÇÇϰí ÀÖ½À´Ï´Ù. Á¦Á¶¾÷üµéÀº ¾ÐÃà ¼ºÇü, »çÃâ ¼ºÇü ¹× Àü»ç ¼ºÇü ±â¼úÀ» Ȱ¿ëÇÏ¿© ¿ì¼öÇÑ Á¤¹Ðµµ¿Í Àϰü¼ºÀ» °®Ãá ÄÄÆÄ¿îµå¸¦ »ý»êÇϱâ À§ÇØ Á¡Á¡ ´õ Á¤±³ÇÑ °øÁ¤À¸·Î ÀüȯÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ±â¼ú ÀüȯÀº »ý»ê È¿À²À» ³ôÀÏ »Ó¸¸ ¾Æ´Ï¶ó Ư¼öÇÑ ÃÖÁ¾ »ç¿ë »ê¾÷À» À§ÇÑ ¸ÂÃãÇü Á¦Ç°À» »ý»êÇÒ ¼ö ÀÖ°Ô ÇØÁÝ´Ï´Ù.

Á¦Á¶ÀÇ µðÁöÅÐÈ­, ÀÚµ¿È­¸¦ ÅëÇÑ Ç°Áú °ü¸® °­È­, °ø±Þ¸Á ÅëÇÕ °³¼±°ú °°Àº »õ·Î¿î Æ®·»µå´Â Çõ½ÅÀÇ ÃþÀ» ´õ¿í µÎ²®°Ô ¸¸µé°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¿ªµ¿ÀûÀΠȯ°æ¿¡¼­ ÀÌÇØ°ü°èÀÚµéÀº ÀÌ·¯ÇÑ Çõ½ÅÀû ±â¼úÀÇ ÀÌÁ¡À» Ȱ¿ëÇϱâ À§ÇØ Áö¼ÓÀûÀ¸·Î ÇÁ·Î¼¼½º¸¦ Æò°¡Çϰí ÀûÀÀ½ÃÄÑ¾ß ÇÕ´Ï´Ù. ±× °á°ú, ÀÌ ¾÷°è´Â ¼º´É, Áö¼Ó°¡´É¼º, È¿À²¼ºÀ» µ¿µîÇÏ°Ô ¿ì¼±½ÃÇÏ´Â Çö´ëÈ­°¡ ½Ã±ÞÈ÷ ¿ä±¸µÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÁøÈ­´Â ¿À´Ã³¯ °æÀïÀÌ Ä¡¿­ÇÑ ¼¼°è ½ÃÀåÀÇ ±î´Ù·Î¿î ¿ä±¸ »çÇ×À» ÃæÁ·Çϱâ À§ÇØ ÀüÅëÀûÀÎ Á¦Á¶ ¹æ¹ýÀÌ ¾î¶»°Ô À籸¼ºµÇ°í ÀÖ´ÂÁö¸¦ º¸¿©ÁÝ´Ï´Ù.

¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀåÀÇ ÁÖ¿ä ¼¼ºÐÈ­ ÀλçÀÌÆ®

½ÃÀå ¼¼ºÐÈ­¸¦ ÀÚ¼¼È÷ »ìÆìº¸¸é ¿¡Æø½Ã ¼öÁö ¼ºÇü È­ÇÕ¹° ½ÃÀåÀÇ º¹À⼺ÀÌ µå·¯³³´Ï´Ù. Àç·á À¯Çüº° ¼¼ºÐÈ­´Â ÷°¡Á¦, ¿¡Æø½Ã ¼öÁö, ÇÊ·¯, °æÈ­Á¦ ¶Ç´Â °æÈ­Á¦¸¦ Æ÷ÇÔÇÑ ´Ù°¢ÀûÀÎ ·»Á ÅëÇØ ½ÃÀåÀ» Á¶»çÇϰí ÀÖÀ½À» º¸¿©ÁÝ´Ï´Ù. ÇÊ·¯¸¸ º¸´õ¶óµµ ¾Ë·ç¹Ì³ª, ¼®¿µ, ½Ç¸®Ä«, Áö¸£ÄÚ´½ ½Ç¸®ÄÉÀÌÆ®, ±Ô»êÁö¸£ÄÚ´½ µîÀÌ ÀÖÀ¸¸ç, °¢ Àç·á´Â È­ÇÕ¹°ÀÇ ¼º´ÉÀ» Çâ»ó½ÃŰ´Â µ¥ °íÀ¯ÇÑ Æ¯¼ºÀ» °¡Áö°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Àç·á ºÐ·ù´Â Á¦Á¶¾÷ü°¡ ´Ù¾çÇÑ ¿ëµµÀÇ ±î´Ù·Î¿î ±âÁØ¿¡ °¡Àå ÀûÇÕÇÑ ¹èÇÕÀ» ¸ÂÃãÈ­ÇÒ ¼ö ÀÖµµ·ÏÇÔÀ¸·Î½á ±â¼ú Çõ½ÅÀÇ Åä´ë¸¦ Çü¼ºÇÕ´Ï´Ù.

¶Ç ´Ù¸¥ Áß¿äÇÑ ¼¼ºÐÈ­´Â ÇüÅ¿¡ µû¶ó ¼¼ºÐÈ­µÇ¸ç, ½ÃÀåÀº °ú¸³Çü, ¾×üÇü, ºÐ¸»ÇüÀ¸·Î ±¸ºÐµË´Ï´Ù. ÀÌ·¯ÇÑ Á¦Á¦´Â °¢°¢ ¶Ñ·ÇÇÑ ¿ªÇÒÀ» ´ã´çÇϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î, °ú¸³Çü È­ÇÕ¹°Àº ¾ÈÁ¤¼º°ú Ãë±Þ ¿ëÀ̼ºÀ¸·Î ÀÎÇØ ¼±È£µÇ¸ç, ¾×ü Á¦Á¦´Â ¿ì¼öÇÑ À¯µ¿¼º°ú »çÃâ °øÁ¤ÀÇ Á¤È®¼ºÀ» Á¦°øÇÕ´Ï´Ù. ¹Ý¸é, ºÐ¸» ÇüÅ´ Àϰü¼º°ú ºü¸¥ °æÈ­°¡ À¯¸®ÇÑ Æ¯Á¤ ¿ëµµ¿¡ ÇʼöÀûÀÔ´Ï´Ù.

±â¼ú ±â¹Ý ¼¼ºÐÈ­´Â ¾ÐÃà ¼ºÇü, »çÃâ ¼ºÇü ¹× Æ®·£½ºÆÛ ¼ºÇü ±â¼úÀ» äÅÃÇÏ¿© »ê¾÷ Çö´ëÈ­¿¡ ´ëÇÑ ¿ì¸®ÀÇ ³ë·ÂÀ» ´õ¿í °­Á¶ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ ´Ù¾çÇÑ ±â¼úÀû Á¢±Ù ¹æ½ÄÀ» ÅëÇØ »ý»êÀÇ º¹À⼺°ú ±Ô¸ð¿¡ µû¶ó °¡°ø Á¶°ÇÀ» ÃÖÀûÈ­Çϰí ÃÖÁ¾ Á¦Ç°ÀÇ È¿À²¼º°ú Àϰü¼ºÀ» º¸ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ÃÖÁ¾ »ç¿ë »ê¾÷º°·Î ¼¼ºÐÈ­ÇÏ¸é ¿¡Æø½Ã ¼ºÇü ÄÄÆÄ¿îµå°¡ »ç¿ëµÇ´Â ´Ù¾çÇÑ ¿ëµµ¿¡ ´ëÇÑ Áß¿äÇÑ ÀλçÀÌÆ®¸¦ ¾òÀ» ¼ö ÀÖ½À´Ï´Ù. Ç×°ø¿ìÁÖ ¹× ¹æÀ§ »ê¾÷ ºÐ¾ß¿¡¼­´Â °í¼º´É ºÎǰÀÌ ¿ì¼±½ÃµÇ¸ç, ÀÚµ¿Â÷ »ê¾÷¿¡¼­´Â ÀüÀÚ Á¦¾î ÀåÄ¡ ¹× ¿£Áø ºÎǰ°ú °°Àº ºÎǰ¿¡ ÁßÁ¡À» µÓ´Ï´Ù. ¼ÒºñÀÚ °¡Àü, ¸ð¹ÙÀÏ ±â±â, ¿þ¾î·¯ºí µîÀÇ ºÐ¾ß¿¡¼­´Â ¼º´É°ú ¼ÒÇüÈ­, ´Ù±â´É¼ºÀ» °âºñÇÑ ¼ÒÀç¿¡ ´ëÇÑ ¿ä±¸°¡ ¹Ý¿µµÇ¾î ÀÖ½À´Ï´Ù. ÇコÄɾî, Àü·Â ¹× ¿¡³ÊÁö, Åë½ÅÀ» Æ÷ÇÔÇÑ ±âŸ »ê¾÷Àº ÀÌ·¯ÇÑ È­ÇÕ¹°ÀÇ ´Ù¾çÇÑ ¿ëµµ¸¦ ´õ¿í Àß º¸¿©ÁÖ°í ÀÖ½À´Ï´Ù.

¸¶Áö¸·À¸·Î, ¿ëµµ¿¡ µû¸¥ ¼¼ºÐÈ­´Â Á¢ÂøÁ¦, ÄÚÆÃ, ĸ½¶È­, Àý¿¬ ¹× ±âŸ ºÐ¾ßÀÇ ½ÃÀå °³¹ßÀ» Ư¡Áþ´Â´Ù. ÀÌ ºÐ·ù´Â ¿¡Æø½Ã ¼öÁö ¼ºÇü È­ÇÕ¹°ÀÇ ´Ù¾çÇÑ ±â´ÉÀû Ư¼ºÀ» °­Á¶ÇÒ »Ó¸¸ ¾Æ´Ï¶ó ºü¸£°Ô ÁøÈ­ÇÏ´Â »ê¾÷ ¿ä±¸ »çÇ׿¡ ¸Â°Ô ¹èÇÕÀ» Á¶Á¤Çϱâ À§ÇÑ Áö¼ÓÀûÀÎ ¿¬±¸ °³¹ßÀÇ Çʿ伺À» °­Á¶ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Á¾ÇÕÀûÀÎ ¼¼ºÐÈ­ ÀλçÀÌÆ®¸¦ ÅëÇØ ¾÷°è ÀÌÇØ°ü°èÀÚµéÀº ½ÃÀå µ¿Çâ¿¡ ¿µÇâÀ» ¹ÌÄ¡´Â ¼ö¸¹Àº ¿äÀÎÀ» ¸íÈ®ÇÏ°Ô ÆÄ¾ÇÇÏ°í ¼ºÀå°ú Çõ½ÅÀ» À§ÇÑ Àü·«Àû ±âȸ¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå °³¿ä

Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

Á¦6Àå ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : Àç·á Á¾·ùº°

Á¦7Àå ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : Çüź°

Á¦8Àå ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : ±â¼úº°

Á¦9Àå ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : ÃÖÁ¾ ÀÌ¿ë »ê¾÷º°

Á¦10Àå ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå : ¿ëµµº°

Á¦11Àå ¾Æ¸Þ¸®Ä«ÀÇ ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå

Á¦12Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå

Á¦13Àå À¯·´, Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ ¿¡Æø½Ã ¸ôµù ÄÄÆÄ¿îµå ½ÃÀå

Á¦14Àå °æÀï ±¸µµ

±â¾÷ ¸®½ºÆ®

ksm
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

The Epoxy Molding Compound Market was valued at USD 2.23 billion in 2023 and is projected to grow to USD 2.35 billion in 2024, with a CAGR of 5.66%, reaching USD 3.28 billion by 2030.

KEY MARKET STATISTICS
Base Year [2023] USD 2.23 billion
Estimated Year [2024] USD 2.35 billion
Forecast Year [2030] USD 3.28 billion
CAGR (%) 5.66%

In the rapidly evolving landscape of advanced materials, epoxy molding compounds have emerged as a critical component that underpins modern manufacturing innovations. As industries worldwide face increasing demands for high-performance, durable, and reliable solutions, these compounds have found widespread adoption across a variety of applications. The fundamental ability of epoxy molding compounds to provide excellent electrical insulation, exceptional mechanical strength, and outstanding thermal stability has led to their resurgence in sectors ranging from automotive and aerospace to consumer electronics and healthcare. Over the past decade, evolving material science and innovative formulation techniques have reshaped the market, driving both R&D investments and transformative shifts in production methodologies.

This comprehensive analysis lays the groundwork for understanding the strategic role and technological advances of epoxy molding compounds. It delves into the intricacies of market segmentation, technological breakthroughs, regional trends, and the key players who are spearheading the evolution of this dynamic market. Drawing upon data-backed insights and forward-thinking analysis, the discussion outlines the contemporary challenges and the opportunities that lie ahead. As manufacturing processes become more sophisticated and end-user expectations continue to mount, a deep understanding of these compounds is essential for decision-makers seeking to maintain a competitive edge in a globalized market. This introduction sets the stage for a detailed exploration of the market dynamics and strategic imperatives that are reshaping the industry.

Transformative Shifts in the Epoxy Molding Compound Landscape

Innovation in material science and production technologies has ushered in transformative shifts in the epoxy molding compound landscape. Recent years have witnessed a remarkable evolution in both the characteristics and applications of these compounds, driven by an interplay of technological breakthroughs and market pressures. Changes in regulatory policies related to environmental sustainability and enhanced performance standards have further accelerated the transition from traditional materials to more advanced epoxy formulations.

Notably, advances in catalyst development, curing agents, and filler materials are redefining product performance. Manufacturers are increasingly turning to sophisticated processes that leverage compression molding, injection molding, and even transfer molding techniques to produce compounds with superior precision and consistency. These technological shifts have not only increased production efficiencies but have also enabled the creation of products tailored to specialized end-use industries.

Emerging trends such as digitalization in manufacturing, enhanced quality control through automation, and improvements in supply chain integration have added additional layers of innovation. This dynamic environment demands that stakeholders continuously evaluate and adapt their processes to capture the benefits of these transformative technologies. Consequently, the industry is witnessing an urgent call for modernization - one that prioritizes performance, sustainability, and efficiency in equal measure. The evolution encapsulates how traditional manufacturing methods are being reconfigured to meet the stringent requirements of today's competitive global market.

Key Segmentation Insights into the Epoxy Molding Compound Market

A deep dive into the segmentation insights reveals the rich complexity of the epoxy molding compound market. Segmentation by materials type indicates that the market is examined through a multifaceted lens that includes additives, epoxy resin, fillers, and hardener or curing agents. Within the scope of fillers alone, further analysis distinguishes among alumina, quartz and silica, and zirconium silicate, each contributing unique properties in enhancing the performance of the compound. These material categorizations form the bedrock of innovation by allowing manufacturers to customize formulations that best fit the stringent criteria of various applications.

Another important segmentation is based on form, where the market is differentiated into granular, liquid, and powder forms. Each of these formulations plays a distinct role; for instance, granular compounds are prized for their stability and ease of handling, while liquid forms offer superior flow and precision in injection processes. Powder forms, on the other hand, are integral in specific applications where consistency and rapid curing are advantageous.

The segmentation based on technology further underscores the industry's commitment to modernization through the adoption of compression molding, injection molding, and transfer molding techniques. These varied technological approaches allow for optimized processing conditions depending on the complexity and size of the production run, ensuring the efficiency and consistency of the final product. Additionally, segmentation by end-use industry provides critical insights into the diverse array of applications where epoxy molding compounds are employed. Sectors such as aerospace and defense prioritize high-performance components, while the automotive industry focuses on components like electronic control units and engine parts. In consumer electronics, the analysis extends to include segments such as home appliances, mobile devices, and wearables, reflecting the need for materials that combine performance with miniaturization and multifunctionality. Other industries including healthcare, power and energy, and telecommunications further illustrate the versatile applications of these compounds.

Finally, segmentation based on application characterizes the market's deployment in areas such as adhesives, coatings, encapsulation, and insulation. This categorization not only highlights the diverse functional attributes of epoxy molding compounds but also reinforces the need for continuous research and development to adapt formulations to rapidly evolving industrial requirements. Through these comprehensive segmentation insights, industry stakeholders gain a clear picture of the myriad factors influencing market trends and can pinpoint strategic opportunities for growth and innovation.

Based on Materials Type, market is studied across Additives, Epoxy Resin, Fillers, and Hardener/ Curing Agent. The Fillers is further studied across Alumina, Quartz & Silica, and Zirconium Silicate.

Based on Form, market is studied across Granular, Liquid, and Powder.

Based on Technology, market is studied across Compression Molding, Injection Molding, and Transfer Molding.

Based on End-Use Industry, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Power & Energy, and Telecommunications. The Automotive is further studied across Electronic Control Units and Engine Components. The Consumer Electronics is further studied across Home Appliances, Mobile Devices, and Wearables.

Based on Application, market is studied across Adhesive, Coating, Encapsulation, and Insulation.

Key Regional Insights Shaping Global Market Opportunities

Regional dynamics play a pivotal role in shaping market opportunities and trends within the epoxy molding compound sector. Insights derived from key regions such as the Americas, Europe, Middle East and Africa, and Asia-Pacific reveal a landscape marked by distinct growth patterns and strategic focal points. The Americas continue to demonstrate robust demand driven by innovations in manufacturing and a strong base of industrial applications. In contrast, the Europe, Middle East and Africa region is characterized by regulatory advancements and a heightened focus on sustainable manufacturing practices, which in turn impel an upgrade in material standards and quality.

Asia-Pacific, on the other hand, emerges as a powerhouse of manufacturing innovation. Rapid industrialization, increased investments in high-tech infrastructure, and a burgeoning consumer electronics market serve as key propellants of demand. Even as regional preferences and regulations vary, these geographies collectively underscore the global impetus to innovate and adapt, thereby providing meaningful opportunities for market players willing to invest in tailored solutions that meet localized needs while also catering to a global audience.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Companies Driving Market Innovation and Competitive Edge

Within the competitive framework of the epoxy molding compound market, a number of key companies have established themselves as industry bellwethers by driving innovation, quality, and market expansion. Global leaders such as Bakelite GmbH and BASF SE have set high standards in research and development, continuously innovating through advanced material chemistry and process optimizations. Pioneers like Caplinq Corporation and Chang Chun Group are recognized for their strategic investments in sustainable practices and efficiency improvements that are redefining traditional manufacturing paradigms.

Eternal Materials Co., Ltd. and Evonik Industries AG have demonstrated a unique ability to integrate advanced composite formulations with environmental considerations, setting benchmarks for product quality and performance. Additionally, major players including Hexion Inc. by Westlake Chemical Corporation, Hitachi Chemical Co., Ltd., and Huntsman International LLC have capitalized on their expansive industry networks and deep market knowledge to forge new pathways in product development and regional market penetration.

Further strengthening the competitive landscape are companies like Jiangsu Zhongpeng New Materials Co., Ltd., KCC Corporation, and KOLON INDUSTRIES, which have steadily invested in technology and operational excellence. The narrative is further enriched by leading innovators such as Kukdo Chemical Co., Ltd., Kyocera Corporation, Mitsubishi Chemical Corporation, and NAGASE & CO., LTD., all striving to maintain a technological edge. Panasonic Holdings Corporation, Resonac Corporation, SAMSUNG SDI Co., Ltd., Sanyu Rec Co., Ltd., Shin-Etsu Chemical Co., Ltd., Solvay S.A., Sumitomo Bakelite Co., Ltd., and Toray Industries, Inc. complete a list of enterprises that are at the forefront of driving competitive differentiation. Collectively, these companies leverage vast research capabilities, robust supply chains, and innovative process technologies to not only meet the current market demands but also to set the stage for future industry advancements.

The report delves into recent significant developments in the Epoxy Molding Compound Market, highlighting leading vendors and their innovative profiles. These include Bakelite GmbH, BASF SE, Caplinq Corporation, Chang Chun Group, Eternal Materials Co., Ltd., Evonik Industries AG, Hexion Inc. by Westlake Chemical Corporation, Hitachi Chemical Co., Ltd., Huntsman International LLC, Jiangsu Zhongpeng New Materials Co., Ltd., KCC Corporation, KOLON INDUSTRIES, Kukdo Chemical Co., Ltd., Kyocera Corporation, Mitsubishi Chemical Corporation, NAGASE & CO., LTD., Panasonic Holdings Corporation, Resonac Corporation, SAMSUNG SDI Co., Ltd., Sanyu Rec Co., Ltd., Shin-Etsu Chemical Co., Ltd., Solvay S.A., Sumitomo Bakelite Co., Ltd., and Toray Industries, Inc.. Actionable Recommendations for Industry Leaders Navigating Market Dynamics

Industry leaders looking to capitalize on the growth opportunities within the epoxy molding compound market should consider a series of actionable recommendations that align with the current technological and market dynamics. First, investing in research and development remains paramount. As innovations in material science and processing techniques evolve, committing resources to next-generation catalysts, advanced curing agents, and optimized filler integrations can create a competitive advantage.

In parallel, enhancing manufacturing processes by adopting state-of-the-art molding technologies such as compression, injection, and transfer molding will improve production efficiency while reducing material wastage. Leaders should also consider forming strategic partnerships that bridge the gap between raw material suppliers, technology providers, and market intermediaries to streamline operations and foster collaborative innovation.

Moreover, companies must maintain a forward-looking approach to sustainability by embracing eco-friendly production practices that not only comply with emerging global regulations but also resonate with an increasingly environmentally conscious customer base. Diversifying the product portfolio to cater to the varying needs of industries-from aerospace and defense to consumer electronics and healthcare-will further enhance market resilience. Finally, a keen focus on regional market nuances and investment in digital transformation initiatives can offer a significant edge in capturing local trends and driving overall growth.

Conclusion: Strategic Outlook for Epoxy Molding Compound Advancements

In conclusion, the evolving market for epoxy molding compounds is marked by groundbreaking technological advancements and shifting industry dynamics. The detailed segmentation analysis-from material types and forms to technologies and end-use industries-offers a nuanced understanding of the forces driving market evolution. The regional insights depict a global landscape where dynamic growth in areas like Asia-Pacific, steady advancements in the Americas, and progressive regulatory environments in Europe, Middle East and Africa collectively pave the way for sustained innovation. Additionally, a diverse group of key companies is charting the course for future market trends by championing technological excellence and strategic market positioning.

This consolidated perspective underscores the importance of continuous investment in R&D, the adoption of advanced manufacturing technologies, and a strategic approach to global market dynamics. As the sector continues to evolve, stakeholders are encouraged to harness these insights to navigate the competitive terrain and drive their businesses forward with confidence and precision.

Table of Contents

1. Preface

2. Research Methodology

3. Executive Summary

4. Market Overview

5. Market Insights

6. Epoxy Molding Compound Market, by Materials Type

7. Epoxy Molding Compound Market, by Form

8. Epoxy Molding Compound Market, by Technology

9. Epoxy Molding Compound Market, by End-Use Industry

10. Epoxy Molding Compound Market, by Application

11. Americas Epoxy Molding Compound Market

12. Asia-Pacific Epoxy Molding Compound Market

13. Europe, Middle East & Africa Epoxy Molding Compound Market

14. Competitive Landscape

Companies Mentioned

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â