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Global BLE Module Market 2025-2029
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The BLE module market is forecasted to grow by USD 52964.1 million during 2024-2029, accelerating at a CAGR of 19.9% during the forecast period. The report on the BLE module market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing adoption of BLE modules in healthcare applications, augmented use of BLE in retail sector, and growing demand for wearables.

Market Scope
Base Year2025
End Year2029
Series Year2025-2029
Growth MomentumAccelerate
YOY 202517.2%
CAGR19.9%
Incremental Value$52964.1 mn

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's BLE module market is segmented as below:

By Application

By Type

By Device

By Geographical Landscape

This study identifies the growing adoption of bluetooth 5.0 and beyond as one of the prime reasons driving the BLE module market growth during the next few years. Also, the emergence of mesh networking and the integration of BLE modules in edge computing and edge AI will lead to sizable demand in the market.

The report on the BLE module market covers the following areas:

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading BLE module market vendors that include Adafruit Industries LLC, Amphenol Communications Solutions, Avnet Inc., Espressif Systems Shanghai Co. Ltd., Ezurio, FANSTEL Corp., Hyper Tech, Infineon Technologies AG, InsightSIP, Microchip Technology Inc., Murata Manufacturing Co. Ltd., Nordic Semiconductor ASA, NXP Semiconductors NV, Panasonic Holdings Corp., Qualcomm Inc., Renesas Electronics Corp., Silicon Laboratories Inc., STMicroelectronics NV, Telit Cinterion, and Texas Instruments Inc.. Also, the BLE module market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

2 Technavio Analysis

3 Market Landscape

4 Market Sizing

5 Historic Market Size

6 Qualitative Analysis

7 Five Forces Analysis

8 Market Segmentation by Application

9 Market Segmentation by Type

10 Market Segmentation by Device

11 Customer Landscape

12 Geographic Landscape

13 Drivers, Challenges, and Opportunity/Restraints

14 Competitive Landscape

15 Competitive Analysis

16 Appendix

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