Japan Semiconductor Manufacturing Equipment Market Report by Equipment Type, Product Type, Dimension, Supply Chain Participant, and Region 2024-2032
일본의 반도체 제조 장비 시장의 시장 규모는 2023년에 59억 달러에 달했습니다. 향후 IMARC Group은 시장이 2032년까지 133억 달러에 달하며, 2024-2032년 9.50%의 성장률(CAGR)을 보일 것으로 예측하고 있습니다. 커넥티드 디바이스의 보급과 함께 디바이스의 소형화의 인기가 높아지고 있는 것이 주로 시장 성장의 원동력이 되고 있습니다.
본 리포트에서 답변하는 주요 질문
- 일본의 반도체 제조 장비 시장은 지금까지 어떻게 추이하며, 향후 어떻게 추이하는가?
- 일본의 반도체 제조 장비 시장에 COVID-19가 미친 영향은?
- 일본의 반도체 제조 장비 시장의 장비 유형별 내역은?
- 일본의 반도체 제조 장비 시장의 제품 유형별 내역은?
- 일본의 반도체 제조 장비 시장의 디멘션별 내역은?
- 일본의 반도체 제조 장비 시장의 공급망 참여 기업별 내역은?
- 일본의 반도체 제조 장비 시장의 밸류체인에는 어떤 단계가 있는가?
- 일본의 반도체 제조 장비의 주요 촉진요인과 과제는?
- 일본의 반도체 제조 장비 시장의 구조와 주요 기업은?
- 일본의 반도체 제조 장비 시장에서 경쟁의 정도는?
목차
제1장 서문
제2장 조사 범위와 조사 방법
- 조사의 목적
- 이해관계자
- 데이터 소스
- 시장 추정
- 조사 방법
제3장 개요
제4장 일본의 반도체 제조 장비 시장 : 서론
제5장 일본의 반도체 제조 장비 시장 구도
- 과거 및 현재 시장 동향(2018-2023년)
- 시장 예측(2024-2032년)
제6장 일본의 반도체 제조 장비 시장 : 장비 유형별 내역
제7장 일본의 반도체 제조 장비 시장 : 제품 유형별 내역
- 메모리
- 로직 컴포넌트
- 마이크로프로세서
- 아날로그 컴포넌트
- 광전자 부품
- 개별 컴포넌트
- 기타
제8장 일본의 반도체 제조 장비 시장 : 디멘션별 내역
제9장 일본의 반도체 제조 장비 시장 : 공급망 참여 기업별 내역
제10장 일본의 반도체 제조 장비 시장 : 경쟁 구도
- 개요
- 시장 구조
- 시장 기업 포지셔닝
- 주요 성공 전략
- 경쟁 대시보드
- 기업 평가 상한
제11장 주요 기업의 개요
제12장 일본의 반도체 제조 장비 시장 : 업계 분석
- 촉진요인·억제요인·기회
- Porter's Five Forces 분석
- 밸류체인 분석
제13장 부록
KSA
Japan semiconductor manufacturing equipment market size reached US$ 5.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 13.3 Billion by 2032, exhibiting a growth rate (CAGR) of 9.50% during 2024-2032. The rising popularity of device miniaturization, along with the widespread adoption of connected devices, is primarily driving the market growth.
Semiconductor manufacturing equipment encompass the machinery employed in the production of a wide range of electronic components and integrated circuits (ICs). Among the commonly utilized devices are the front-end and back-end equipment. In addition to this, the front-end category comprises machines used in silicon-wafer fabrication, photolithography, deposition, etching, ion implantation, and mechanical polishing. In contrast, the back-end category involves machinery used in the assembly, packaging, and testing of integrated circuits. These machines offer numerous advantages, including streamlined production processes, enhanced yield and reliability, reduction in design and manufacturing errors, and improved workplace safety. Consequently, they have found widespread applications in the manufacturing of various products across industries such as automotive, electronics, robotics, etc.
Japan Semiconductor Manufacturing Equipment Market Trends:
The Japan market for semiconductor manufacturing equipment is primarily being propelled by the burgeoning electronics sector, given the widespread use of semiconductors in consumer electronics like smartphones, tablets, and laptops. Furthermore, the increasing demand for hybrid and electric vehicles (H/EVs) stands as another significant driver of growth. Besides this, these manufacturing equipment is instrumental in the assembly of multiple semiconductors onto a single chip, reducing electronic interference and enhancing the protection of electronic devices, which is positively influencing the regional market. Additionally, several key market players are introducing advanced product variations in a bid to broaden their customer base. This, combined with various technological advancements, such as the integration of artificial intelligence (AI) solutions and the incorporation of connected devices into the Internet of Things (IoT), is exerting a positive impact on market growth. Apart from this, manufacturers are employing silicon-based sensors in their manufacturing equipment. These sensors provide the ability to remotely monitor intricate circuit boards. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are among the other factors expected to drive market growth in the forthcoming years in Japan.
Japan Semiconductor Manufacturing Equipment Market Segmentation:
Equipment Type Insights:
- Front-End
- Lithography
- Deposition
- Cleaning
- Wafer Surface Conditioning
- Others
- Back-End
- Testing
- Assembly and Packaging
- Dicing
- Bonding
- Metrology
- Others
- Fab Facility Equipment
- Automation
- Chemical Control
- Gas Control
- Others
Product Type Insights:
- Memory
- Logic Components
- Microprocessor
- Analog Components
- Optoelectronic Components
- Discrete Components
- Others
Dimension Insights:
Supply Chain Participant Insights:
- IDM Firms
- OSAT Companies
- Foundries
Competitive Landscape:
The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.
Key Questions Answered in This Report:
- How has the Japan semiconductor manufacturing equipment market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the Japan semiconductor manufacturing equipment market?
- What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of equipment type?
- What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of product type?
- What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of dimension?
- What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of supply chain participant?
- What are the various stages in the value chain of the Japan semiconductor manufacturing equipment market?
- What are the key driving factors and challenges in the Japan semiconductor manufacturing equipment?
- What is the structure of the Japan semiconductor manufacturing equipment market and who are the key players?
- What is the degree of competition in the Japan semiconductor manufacturing equipment market?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Japan Semiconductor Manufacturing Equipment Market - Introduction
- 4.1 Overview
- 4.2 Market Dynamics
- 4.3 Industry Trends
- 4.4 Competitive Intelligence
5 Japan Semiconductor Manufacturing Equipment Market Landscape
- 5.1 Historical and Current Market Trends (2018-2023)
- 5.2 Market Forecast (2024-2032)
6 Japan Semiconductor Manufacturing Equipment Market - Breakup by Equipment Type
- 6.1 Front-End
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2018-2023)
- 6.1.3 Market Segmentation
- 6.1.3.1 Lithography
- 6.1.3.2 Deposition
- 6.1.3.3 Cleaning
- 6.1.3.4 Wafer Surface Conditioning
- 6.1.3.5 Others
- 6.1.4 Market Forecast (2024-2032)
- 6.2 Back-End
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2018-2023)
- 6.2.3 Market Segmentation
- 6.2.3.1 Testing
- 6.2.3.2 Assembly and Packaging
- 6.2.3.3 Dicing
- 6.2.3.4 Bonding
- 6.2.3.3 Metrology
- 6.2.3.4 Others
- 6.2.4 Market Forecast (2024-2032)
- 6.3 Fab Facility Equipment
- 6.3.1 Overview
- 6.3.2 Historical and Current Market Trends (2018-2023)
- 6.3.3 Market Segmentation
- 6.3.3.1 Automation
- 6.3.3.2 Chemical Control
- 6.3.3.3 Gas Control
- 6.3.3.4 Others
- 6.3.4 Market Forecast (2024-2032)
7 Japan Semiconductor Manufacturing Equipment Market - Breakup by Product Type
- 7.1 Memory
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2018-2023)
- 7.1.3 Market Forecast (2024-2032)
- 7.2 Logic Components
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2018-2023)
- 7.2.3 Market Forecast (2024-2032)
- 7.3 Microprocessor
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2018-2023)
- 7.3.3 Market Forecast (2024-2032)
- 7.4 Analog Components
- 7.4.1 Overview
- 7.4.2 Historical and Current Market Trends (2018-2023)
- 7.4.3 Market Forecast (2024-2032)
- 7.5 Optoelectronic Components
- 7.5.1 Overview
- 7.5.2 Historical and Current Market Trends (2018-2023)
- 7.5.3 Market Forecast (2024-2032)
- 7.6 Discrete Components
- 7.6.1 Overview
- 7.6.2 Historical and Current Market Trends (2018-2023)
- 7.6.3 Market Forecast (2024-2032)
- 7.7 Others
- 7.7.1 Historical and Current Market Trends (2018-2023)
- 7.7.2 Market Forecast (2024-2032)
8 Japan Semiconductor Manufacturing Equipment Market - Breakup by Dimension
- 8.1 2D
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2018-2023)
- 8.1.3 Market Forecast (2024-2032)
- 8.2 2.5D
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2018-2023)
- 8.2.3 Market Forecast (2024-2032)
- 8.3 3D
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2018-2023)
- 8.3.3 Market Forecast (2024-2032)
9 Japan Semiconductor Manufacturing Equipment Market - Breakup by Supply Chain Participant
- 9.1 IDM Firms
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2018-2023)
- 9.1.3 Market Forecast (2024-2032)
- 9.2 OSAT Companies
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2018-2023)
- 9.2.3 Market Forecast (2024-2032)
- 9.3 Foundries
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2018-2023)
- 9.3.3 Market Forecast (2024-2032)
10 Japan Semiconductor Manufacturing Equipment Market - Competitive Landscape
- 10.1 Overview
- 10.2 Market Structure
- 10.3 Market Player Positioning
- 10.4 Top Winning Strategies
- 10.5 Competitive Dashboard
- 10.6 Company Evaluation Quadrant
11 Profiles of Key Players
- 11.1 Company A
- 11.1.1 Business Overview
- 11.1.2 Product Portfolio
- 11.1.3 Business Strategies
- 11.1.4 SWOT Analysis
- 11.1.5 Major News and Events
- 11.2 Company B
- 11.2.1 Business Overview
- 11.2.2 Product Portfolio
- 11.2.3 Business Strategies
- 11.2.4 SWOT Analysis
- 11.2.5 Major News and Events
- 11.3 Company C
- 11.3.1 Business Overview
- 11.3.2 Product Portfolio
- 11.3.3 Business Strategies
- 11.3.4 SWOT Analysis
- 11.3.5 Major News and Events
- 11.4 Company D
- 11.4.1 Business Overview
- 11.4.2 Product Portfolio
- 11.4.3 Business Strategies
- 11.4.4 SWOT Analysis
- 11.4.5 Major News and Events
- 11.5 Company E
- 11.5.1 Business Overview
- 11.5.2 Product Portfolio
- 11.5.3 Business Strategies
- 11.5.4 SWOT Analysis
- 11.5.5 Major News and Events
12 Japan Semiconductor Manufacturing Equipment Market - Industry Analysis
- 12.1 Drivers, Restraints, and Opportunities
- 12.1.1 Overview
- 12.1.2 Drivers
- 12.1.3 Restraints
- 12.1.4 Opportunities
- 12.2 Porters Five Forces Analysis
- 12.2.1 Overview
- 12.2.2 Bargaining Power of Buyers
- 12.2.3 Bargaining Power of Suppliers
- 12.2.4 Degree of Competition
- 12.2.5 Threat of New Entrants
- 12.2.6 Threat of Substitutes
- 12.3 Value Chain Analysis
13 Appendix
