Next Generation Memory Market Report by Technology, Wafer Size, Storage Type, Application, and Region 2024-2032
세계의 차세대 메모리 시장 규모는 2023년 61억 달러에 달했습니다. IMARC Group은 향후 2032년에는 428억 달러에 이를 전망이며, 2024년부터 2032년까지 성장률(CAGR)은 23.7%가 될 것으로 예측했습니다.
차세대 메모리는 실리콘 칩보다 더 많은 데이터를 저장할 수 있는 빠르고 효율적이며 비용 효율적인 스토리지 솔루션을 의미합니다. 따라서 세계 통신, 정보기술(IT), 은행 및 금융서비스, 보험(BFSI) 산업에서 폭넓게 이용되고 있습니다. 현재 인공지능(AI), 사물인터넷(IoT), 빅데이터, 기타 기술에 의존하는 고대역폭, 저전력, 고확장성 메모리 디바이스에 대한 요구가 급증하고 있습니다. 이것이 차세대 메모리에 대한 수요를 불러일으키고 있습니다.
차세대 메모리 시장 동향 :
현재 세계적으로 유니버설 메모리의 보급이 현저하고, 이는 급성장하는 일렉트로닉스 산업과 함께 시장의 성장을 뒷받침하는 중요한 요인의 하나가 되고 있습니다. 이 외에도 스마트폰, 태블릿, 유니버설 시리얼 버스(USB) 드라이브, SSD(SSD)의 판매 증가에 따라 데이터 보존에 에너지를 필요로 하지 않는 비휘발성 스토리지 기술의 일종인 NOT-AND(NAND) 플래시 메모리에 대한 수요도 증가하고 있습니다. 이 외에도 그래픽용 차세대 메모리 기술인 고대역폭 메모리(HBM)는 최첨단 그래픽, 네트워킹, 고성능 컴퓨팅(HPC), 인공지능(AI) 시스템으로 빠르게 이용이 진행되고 있습니다. 입니다. 예를 들어, 디코더, 완전 자율 주행 차량, 신경망 설계, 기타 저전력 소비와 엄청난 대역폭을 요구하는 고급 용도에 사용됩니다. 이는 웨어러블 디바이스의 사용률이 증가함에 따라 시장 성장을 가속하고 있습니다. 커넥티드카의 이용 증가와 IT산업의 대폭적인 성장 등 기타 요인들도 향후 수년간 시장에 밝은 전망을 가져올 것으로 예측됩니다.
목차
제1장 서문
제2장 조사 범위 및 조사 방법
- 조사의 목적
- 이해관계자
- 데이터 소스
- 시장 추정
- 조사 방법
제3장 주요 요약
제4장 서문
제5장 세계의 차세대 메모리 시장
- 시장 개요
- 시장 실적
- COVID-19의 영향
- 시장 예측
제6장 시장 분석 : 기술별
- 비휘발성
- 시장 동향
- 주요 부문
- 자기저항 랜덤 액세스 메모리(MRAM)
- 강유전체 RAM(FRAM)
- 저항 랜덤 액세스 메모리(ReRAM)
- 3D X 포인트
- 나노RAM
- 기타 비휘발성 기술(상변화 RAM, STT-RAM, SRAM)
- 시장 예측
- 휘발성
- 시장 동향
- 주요 부문
- 하이브리드 메모리 큐브(HMC)
- 고대역폭 메모리(HBM)
- 시장 예측
제7장 시장 분석 : 웨이퍼 사이즈별
제8장 시장 분석 : 스토리지 유형별
제9장 시장 분석 : 용도별
제10장 시장 분석 : 지역별
- 북미
- 아시아태평양
- 유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 스페인
- 러시아
- 기타
- 라틴아메리카
- 중동 및 아프리카
제11장 SWOT 분석
제12장 밸류체인 분석
제13장 Porter's Five Forces 분석
- 개요
- 구매자의 협상력
- 공급기업의 협상력
- 경쟁도
- 신규 참가업체의 위협
- 대체품의 위협
제14장 가격 분석
제15장 경쟁 구도
- 시장 구조
- 주요 기업
- 주요 기업 프로파일
- Avalanche Technology
- Crossbar Inc.
- Fujitsu Limited
- Honeywell International Inc.
- Infineon Technologies AG
- Intel Corporation
- Micron Technology Inc.
- Nantero Inc.
- Samsung Electronics Co. Ltd.
- SK hynix Inc.
- Spin Memory Inc.
- Taiwan Semiconductor Manufacturing Co. Ltd.
AJY
The global next generation memory market size reached US$ 6.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 42.8 Billion by 2032, exhibiting a growth rate (CAGR) of 23.7% during 2024-2032.
Next generation memory refers to a fast, efficient and cost-effective storage solution that can store more data than silicon chips. It consequently finds extensive applications in the telecommunications, information technology (IT), and banking, financial services and insurance (BFSI) industries across the globe. At present, there is a surge in the requirement for high bandwidth, low power consumption, and highly scalable memory devices that rely on artificial intelligence (AI), the Internet of things (IoT), big data and other technologies. This, in turn, is catalyzing the demand for next generation memory.
Next Generation Memory Market Trends:
There is presently a significant rise in the traction of universal memory worldwide. This, in confluence with the burgeoning electronics industry, represents one of the key factors bolstering the growth of the market. Apart from this, with the growing sales of smartphones, tablets, universal serial bus (USB) drives, and solid-state drives (SSD), the demand for NOT-AND (NAND) flash memory, which is a type of non-volatile storage technology that does not need energy to retain data is also increasing. Besides this, high-bandwidth memory (HBM), a next generation memory technology for graphics, is rapidly being used in leading-edge graphics, networking, high-performance computing (HPC), and artificial intelligence (AI) systems. For instance, it is utilized in decoders, fully autonomous vehicles, neural network designs, and other advanced applications that require low power and enormous bandwidth. This, coupled with the rising usage of wearable devices, is facilitating the growth of the market. Other factors, such as the increasing use of connected cars and considerable growth in the IT industry, are projected to create a positive outlook for the market in the upcoming years.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global next generation memory market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on technology, wafer size, storage type and application.
Breakup by Technology:
Non-Volatile
Magneto-Resistive Random-Access Memory (MRAM)
Ferroelectric RAM (FRAM)
Resistive Random-Access Memory (ReRAM)
3D Xpoint
Nano RAM
Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
Volatile
Hybrid Memory Cube (HMC)
High-Bandwidth Memory (HBM)
Breakup by Wafer Size:
200 mm
300 mm
450 mm
Breakup by Storage Type:
Mass Storage
Embedded Storage
Others
Breakup by Application:
BFSI
Consumer Electronics
Government
Telecommunications
Information Technology
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Avalanche Technology, Crossbar Inc., Fujitsu Limited, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Micron Technology Inc., Nantero Inc., Samsung Electronics Co. Ltd., SK hynix Inc., Spin Memory Inc. and Taiwan Semiconductor Manufacturing Co. Ltd.
Key Questions Answered in This Report:
- How has the global next generation memory market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global next generation memory market?
- What are the key regional markets?
- What is the breakup of the market based on the technology?
- What is the breakup of the market based on the wafer size?
- What is the breakup of the market based on the storage type?
- What is the breakup of the market based on the application?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global next generation memory market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Next Generation Memory Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Technology
- 6.1 Non-Volatile
- 6.1.1 Market Trends
- 6.1.2 Key Segments
- 6.1.2.1 Magneto-Resistive Random-Access Memory (MRAM)
- 6.1.2.2 Ferroelectric RAM (FRAM)
- 6.1.2.3 Resistive Random-Access Memory (ReRAM)
- 6.1.2.4 3D Xpoint
- 6.1.2.5 Nano RAM
- 6.1.2.6 Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
- 6.1.3 Market Forecast
- 6.2 Volatile
- 6.2.1 Market Trends
- 6.2.2 Key Segments
- 6.2.2.1 Hybrid Memory Cube (HMC)
- 6.2.2.2 High-Bandwidth Memory (HBM)
- 6.2.3 Market Forecast
7 Market Breakup by Wafer Size
- 7.1 200 mm
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 300 mm
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 450 mm
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
8 Market Breakup by Storage Type
- 8.1 Mass Storage
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2 Embedded Storage
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3 Others
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
9 Market Breakup by Application
- 9.1 BFSI
- 9.1.1 Market Trends
- 9.1.2 Market Forecast
- 9.2 Consumer Electronics
- 9.2.1 Market Trends
- 9.2.2 Market Forecast
- 9.3 Government
- 9.3.1 Market Trends
- 9.3.2 Market Forecast
- 9.4 Telecommunications
- 9.4.1 Market Trends
- 9.4.2 Market Forecast
- 9.5 Information Technology
- 9.5.1 Market Trends
- 9.5.2 Market Forecast
- 9.6 Others
- 9.6.1 Market Trends
- 9.6.2 Market Forecast
10 Market Breakup by Region
- 10.1 North America
- 10.1.1 United States
- 10.1.1.1 Market Trends
- 10.1.1.2 Market Forecast
- 10.1.2 Canada
- 10.1.2.1 Market Trends
- 10.1.2.2 Market Forecast
- 10.2 Asia-Pacific
- 10.2.1 China
- 10.2.1.1 Market Trends
- 10.2.1.2 Market Forecast
- 10.2.2 Japan
- 10.2.2.1 Market Trends
- 10.2.2.2 Market Forecast
- 10.2.3 India
- 10.2.3.1 Market Trends
- 10.2.3.2 Market Forecast
- 10.2.4 South Korea
- 10.2.4.1 Market Trends
- 10.2.4.2 Market Forecast
- 10.2.5 Australia
- 10.2.5.1 Market Trends
- 10.2.5.2 Market Forecast
- 10.2.6 Indonesia
- 10.2.6.1 Market Trends
- 10.2.6.2 Market Forecast
- 10.2.7 Others
- 10.2.7.1 Market Trends
- 10.2.7.2 Market Forecast
- 10.3 Europe
- 10.3.1 Germany
- 10.3.1.1 Market Trends
- 10.3.1.2 Market Forecast
- 10.3.2 France
- 10.3.2.1 Market Trends
- 10.3.2.2 Market Forecast
- 10.3.3 United Kingdom
- 10.3.3.1 Market Trends
- 10.3.3.2 Market Forecast
- 10.3.4 Italy
- 10.3.4.1 Market Trends
- 10.3.4.2 Market Forecast
- 10.3.5 Spain
- 10.3.5.1 Market Trends
- 10.3.5.2 Market Forecast
- 10.3.6 Russia
- 10.3.6.1 Market Trends
- 10.3.6.2 Market Forecast
- 10.3.7 Others
- 10.3.7.1 Market Trends
- 10.3.7.2 Market Forecast
- 10.4 Latin America
- 10.4.1 Brazil
- 10.4.1.1 Market Trends
- 10.4.1.2 Market Forecast
- 10.4.2 Mexico
- 10.4.2.1 Market Trends
- 10.4.2.2 Market Forecast
- 10.4.3 Others
- 10.4.3.1 Market Trends
- 10.4.3.2 Market Forecast
- 10.5 Middle East and Africa
- 10.5.1 Market Trends
- 10.5.2 Market Breakup by Country
- 10.5.3 Market Forecast
11 SWOT Analysis
- 11.1 Overview
- 11.2 Strengths
- 11.3 Weaknesses
- 11.4 Opportunities
- 11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
- 13.1 Overview
- 13.2 Bargaining Power of Buyers
- 13.3 Bargaining Power of Suppliers
- 13.4 Degree of Competition
- 13.5 Threat of New Entrants
- 13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
- 15.1 Market Structure
- 15.2 Key Players
- 15.3 Profiles of Key Players
- 15.3.1 Avalanche Technology
- 15.3.1.1 Company Overview
- 15.3.1.2 Product Portfolio
- 15.3.2 Crossbar Inc.
- 15.3.2.1 Company Overview
- 15.3.2.2 Product Portfolio
- 15.3.3 Fujitsu Limited
- 15.3.3.1 Company Overview
- 15.3.3.2 Product Portfolio
- 15.3.3.3 Financials
- 15.3.3.4 SWOT Analysis
- 15.3.4 Honeywell International Inc.
- 15.3.4.1 Company Overview
- 15.3.4.2 Product Portfolio
- 15.3.4.3 Financials
- 15.3.4.4 SWOT Analysis
- 15.3.5 Infineon Technologies AG
- 15.3.5.1 Company Overview
- 15.3.5.2 Product Portfolio
- 15.3.5.3 Financials
- 15.3.5.4 SWOT Analysis
- 15.3.6 Intel Corporation
- 15.3.6.1 Company Overview
- 15.3.6.2 Product Portfolio
- 15.3.6.3 Financials
- 15.3.6.4 SWOT Analysis
- 15.3.7 Micron Technology Inc.
- 15.3.7.1 Company Overview
- 15.3.7.2 Product Portfolio
- 15.3.7.3 Financials
- 15.3.7.4 SWOT Analysis
- 15.3.8 Nantero Inc.
- 15.3.8.1 Company Overview
- 15.3.8.2 Product Portfolio
- 15.3.9 Samsung Electronics Co. Ltd.
- 15.3.9.1 Company Overview
- 15.3.9.2 Product Portfolio
- 15.3.9.3 Financials
- 15.3.10 SK hynix Inc.
- 15.3.10.1 Company Overview
- 15.3.10.2 Product Portfolio
- 15.3.10.3 Financials
- 15.3.10.4 SWOT Analysis
- 15.3.11 Spin Memory Inc.
- 15.3.11.1 Company Overview
- 15.3.11.2 Product Portfolio
- 15.3.12 Taiwan Semiconductor Manufacturing Co. Ltd.
- 15.3.12.1 Company Overview
- 15.3.12.2 Product Portfolio
- 15.3.12.3 Financials
- 15.3.12.4 SWOT Analysis
