¼¼°èÀÇ ¸ð¹ÙÀÏ ±â±â¿ë MEMS ½ÃÀå
MEMS for Mobile Devices
»óǰÄÚµå : 1798955
¸®¼­Ä¡»ç : Global Industry Analysts, Inc.
¹ßÇàÀÏ : 2025³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 187 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 5,850 £Ü 8,233,000
PDF & Excel (Single User License) help
PDF & Excel º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ®ÀÇ º¹»ç ¹× ºÙ¿©³Ö±â´Â °¡´ÉÇÏÁö¸¸, Ç¥/±×·¡ÇÁ µîÀº º¹»çÇÒ ¼ö ¾ø½À´Ï´Ù. Àμâ´Â 1ȸ °¡´ÉÇϸç, Àμ⹰ÀÇ ÀÌ¿ë¹üÀ§´Â ÆÄÀÏ ÀÌ¿ë¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 17,550 £Ü 24,701,000
PDF & Excel (Global License to Company and its Fully-owned Subsidiaries) help
PDF & Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ ¹× 100% ÀÚȸ»çÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÏ½Ç ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â 1Àδç 1ȸ °¡´ÉÇϸç, Àμ⹰ÀÇ ÀÌ¿ë¹üÀ§´Â ÆÄÀÏ ÀÌ¿ë¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


Çѱ۸ñÂ÷

¸ð¹ÙÀÏ ±â±â¿ë MEMS ¼¼°è ½ÃÀåÀº 2030³â±îÁö 139¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸Á

2024³â¿¡ 91¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ¸ð¹ÙÀÏ ±â±â¿ë MEMS ¼¼°è ½ÃÀåÀº 2024³âºÎÅÍ 2030³â±îÁö CAGR 7.3%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 139¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ º¸°í¼­¿¡¼­ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ Áö¹® ¼¾¼­´Â CAGR 9.6%¸¦ ±â·ÏÇÏ¸ç ºÐ¼® ±â°£ Á¾·á±îÁö 42¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. °¡¼Óµµ°è ¼¾¼­ ºÐ¾ßÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£ µ¿¾È CAGR 5.9%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 25¾ï ´Þ·¯, Áß±¹Àº CAGR 11.7%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ ¸ð¹ÙÀÏ ±â±â¿ë MEMS ½ÃÀåÀº 2024³â¿¡ 25¾ï ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦ ´ë±¹ÀÎ Áß±¹Àº ºÐ¼® ±â°£ÀÎ 2024-2030³â CAGR 11.7%¸¦ ¼øÇ³¿¡, 2030³â±îÁö 30¾ï ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖ°í, ºÐ¼® ±â°£ µ¿¾È CAGRÀº °¢°¢ 3.5%¿Í 7.1%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR 4.8%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ ¸ð¹ÙÀÏ ±â±â¿ë MEMS ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

½º¸¶Æ®Æù°ú ¿þ¾î·¯ºí¿¡ MEMS µð¹ÙÀ̽ºÀÇ ÅëÇÕÀ» ÃËÁøÇÏ´Â ¿äÀÎÀº ¹«¾ùÀϱî?

¸¶ÀÌÅ©·Î Àü±â ±â°è ½Ã½ºÅÛ(MEMS)Àº ¸ð¹ÙÀÏ ±â±âÀÇ ÁøÈ­¿¡¼­ Á¡Á¡ ´õ Áß½ÉÀûÀÎ ¿ªÇÒÀ» Çϰí ÀÖÀ¸¸ç, ÄÄÆÑÆ®Çϰí Àü·Â È¿À²ÀÌ ³ôÀº Æ÷¸Ë ³»¿¡¼­ °í±Þ ¼¾½Ì, »ç¿ëÀÚ »óÈ£ ÀÛ¿ë ¹× ¸ð¼Ç °¨Áö ±â´ÉÀ» °¡´ÉÇÏ°Ô Çϰí ÀÖ½À´Ï´Ù. ½Ç¸®ÄÜ ±âÆÇ¿¡ ±â°è ¼ÒÀÚ¿Í ÀüÀÚ ¼ÒÀÚ¸¦ °áÇÕÇÑ ÀÌ ¼ÒÇü ºÎǰÀº ½º¸¶Æ®Æù, ÅÂºí¸´, ½º¸¶Æ®¿öÄ¡, ÇÇÆ®´Ï½º Æ®·¡Ä¿¿¡ ³»ÀåµÇ¾î °¡¼Óµµ °¨Áö, ¹æÇâ ÃßÀû, ȯ°æ ¸ð´ÏÅ͸µ, Á¦½ºÃ³ Àνİú °°Àº Áß¿äÇÑ ±â´ÉÀ» ¼öÇàÇÕ´Ï´Ù.

°¡¼Óµµ°è, ÀÚÀ̷νºÄÚÇÁ, ÁöÀڱ⠼¾¼­, ¸¶ÀÌÅ©, ¾Ð·Â ¼¾¼­, MEMS ±â¹Ý RF ½ºÀ§Ä¡´Â ¸ð¹ÙÀÏ ºÐ¾ß¿¡¼­ °¡Àå ³Î¸® µµÀÔµÈ ºÎǰ Áß ÇϳªÀÔ´Ï´Ù. ±× ¿ëµµ´Â ±âº»ÀûÀÎ ¹æÇâ °¨Áö»Ó¸¸ ¾Æ´Ï¶ó 3D °ø°£ ÀνÄ, ÇÇÆ®´Ï½º Æ®·¡Å·, °í±Þ ³»ºñ°ÔÀ̼Ç, °ÔÀÓ ÀÔ·Â µîÀ¸·Î È®´ëµÇ°í ÀÖ½À´Ï´Ù. ¸ÖƼ¸ð´Þ »ýüÀνÄ, À½¼º ÀνÄ, AI ±â¹Ý ÀÎÅÍ·¢¼ÇÀÇ µîÀåÀ¸·Î MEMS ¸¶ÀÌÅ©¿Í ¸ð¼Ç ¼¾¼­°¡ »ç¿ëÀÚ °æÇè ¼³°èÀÇ ÇÙ½ÉÀ¸·Î ºÎ»óÇϰí ÀÖ½À´Ï´Ù. ¼ÒºñÀÚÀÇ ±â´ë°¡ ¸Å²ô·´°í ¸ôÀÔ°¨ ÀÖ°í °Ç°­À» °í·ÁÇÑ ±â¼ú·Î À̵¿ÇÔ¿¡ µû¶ó, MEMS´Â ¹ÝÀÀ¼ºÀÌ ¶Ù¾î³ª°í ÄÁÅØ½ºÆ®¸¦ ÀνÄÇÏ´Â ¸ð¹ÙÀÏ ¾ÖÇø®ÄÉÀ̼ÇÀ» ±¸ÇöÇÏ´Â µ¥ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸® Àâ°í ÀÖ½À´Ï´Ù.

Â÷¼¼´ë ¸ð¹ÙÀÏ Ç÷§ÆûÀÇ ¿ä±¸¸¦ ÃæÁ·½Ã۱â À§ÇØ MEMS ±â¼úÀº ¾î¶»°Ô ÁøÈ­Çϰí Àִ°¡?

MEMS ¼³°è ¹× Á¦Á¶ÀÇ Áö¼ÓÀûÀÎ ¹ßÀüÀ¸·Î ¹èÅ͸® ¼ö¸í°ú ÆûÆÑÅÍ¿¡ Á¦¾àÀÌ ÀÖ´Â ¸ð¹ÙÀÏ Ç÷§ÆûÀÇ Áß¿äÇÑ ¿ä±¸»çÇ×ÀÎ ¼ÒÇüÈ­, °¨µµ Çâ»ó, ÀúÀü·Â ¼Òºñ¸¦ ½ÇÇöÇϰí ÀÖ½À´Ï´Ù. ´ÙÃà MEMS °ü¼ºÃøÁ¤ÀåÄ¡(IMU)´Â °¡¼Óµµ°è, ÀÚÀ̷νºÄÚÇÁ, ÁöÀÚ±â°è¸¦ ÇϳªÀÇ ÆÐŰÁö·Î ¹­¾î ½Ç³» ³»ºñ°ÔÀ̼Ç, Áõ°­Çö½Ç(AR), ¸ð¼Ç Á¦½ºÃ³ Á¦¾î µîÀÇ Ã·´Ü ±â´ÉÀ» Áö¿øÇÕ´Ï´Ù. ¾ÐÀü ¹× Á¤Àü ¿ë·®½Ä °¨Áö ¸ÞÄ¿´ÏÁòÀº Áøµ¿, ¿Âµµ, ³ëÈ­¿¡ ´ëÇÑ ³ôÀº Á¤¹Ðµµ¿Í °ß°í¼ºÀ» ½ÇÇöÇϱâ À§ÇØ °³¼±µÇ¾ú½À´Ï´Ù.

³ôÀº ½ÅÈ£ ´ë ÀâÀ½ºñ(SNR)¿Í ³ÐÀº ´ÙÀ̳ª¹Í ·¹ÀÎÁö¸¦ °¡Áø MEMS ¸¶ÀÌÅ©´Â À½¼º ÅëÈ­, °¡»ó ºñ¼­, ³ëÀÌÁî ĵ½½¸µ ÇìµåÆùÀÇ À½ÁúÀ» Çâ»ó½Ã۰í ÀÖ½À´Ï´Ù. ±¤ÇÐ MEMS´Â AR/VR Çìµå¼ÂÀ̳ª ½º¸¶Æ®ÆùÀÇ ¼ÒÇü ÇÁ·ÎÁ§¼Ç ½Ã½ºÅÛ ¹× 3D ¼¾½ÌÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. AI ¹× ±â°è ÇнÀ ¾Ë°í¸®Áò°úÀÇ ÅëÇÕÀ» ÅëÇØ MEMS ¼¾¼­´Â ÄÁÅØ½ºÆ® ½ÅÈ£¸¦ ÇØ¼®Çϰí, ½º¸¶Æ® ¿þÀÌÅ© ¿Â ¸ð¼Ç, ÀûÀÀÇü »ç¿îµå ó¸®, »ç¿ëÀÚ È°µ¿ ºÐ·ù¸¦ °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù.

µ¿½Ã¿¡ ¿þÀÌÆÛ ·¹º§ ÆÐŰ¡(WLP), ½Ã½ºÅÛ ÀÎ ÆÐŰÁö(SiP) ÅëÇÕ, ½Ç¸®ÄÜ °üÅë Àü±Ø(TSV)À» ÅëÇØ Á¦Á¶ È¿À²ÀÌ Çâ»óµÇ°í, ¾ÖÇø®ÄÉÀÌ¼Ç ÇÁ·Î¼¼¼­ ¹× ¿¬°á ¸ðµâ°úÀÇ °øµ¿ ÆÐŰ¡ÀÌ ¿ëÀÌÇØÁ³½À´Ï´Ù. ÀÌ·¯ÇÑ Çõ½ÅÀº ¿þ¾î·¯ºí, Á¢À̽Ä, ÃʹÚÇü ¸ð¹ÙÀÏ ±â±â¿¡ ÇʼöÀûÀÎ °ø°£°ú ¿­ ºÎÇϸ¦ ÁÙÀ̸鼭 ´õ ³ôÀº ¼öÁØÀÇ ±â´É ÁýÀûÈ­¸¦ °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù.

MEMS ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ´Â ¸ð¹ÙÀÏ ¾ÖÇø®ÄÉÀÌ¼Ç ¹× ¼ÒºñÀÚ ½ÃÀåÀº?

MEMS µð¹ÙÀ̽º´Â °ÅÀÇ ¸ðµç Ãֽнº¸¶Æ®Æù¿¡ ³»ÀåµÇ¾î ÀÖÀ¸¸ç, ÀÚµ¿ ȸÀü, °ÉÀ½ ¼ö ÃßÀû, ±â¾Ð ±â¹Ý °íµµ °¨Áö, À½¼º ¸í·É ÀÔ·Â µîÀÇ ±â´ÉÀ» Áö¿øÇÕ´Ï´Ù. Ç÷¡±×½Ê ÈÞ´ëÆù¿¡´Â 10-20°³ÀÇ MEMS ¼¾¼­°¡ ³»ÀåµÇ¾î ÀÖ¾î »çÁøÀÇ ¼Õ¶³¸² º¸Á¤, À§Ä¡ Á¤º¸ Á¤±³È­, ÅëÈ­ ǰÁú ÃÖÀûÈ­, °í±Þ UI/UX ±â´É µîÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. ¿þ¾î·¯ºí ±â±â¿¡¼­ MEMS ¼¾¼­´Â »ýü ½ÅÈ£, µ¿ÀÛ, ¼ö¸é ÁÖ±â, ÁÖº¯ »óȲÀ» ¸ð´ÏÅ͸µÇϰí, À£´Ï½º ¹× ÇÇÆ®´Ï½º Ç÷§Æû¿¡ µ¥ÀÌÅ͸¦ °ø±ÞÇϱâ À§ÇØ ÇʼöÀûÀÔ´Ï´Ù.

°ÔÀÓ ¹× AR/VR ¾ÖÇø®ÄÉÀ̼ǿ¡¼­´Â MEMS ÀÚÀ̷νºÄÚÇÁ¿Í °¡¼Óµµ°è¸¦ »ç¿ëÇÏ¿© ½Ç½Ã°£ ¸ð¼Ç Æ®·¡Å·°ú ¸ôÀÔÇü ÄÁÆ®·ÑÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù. ±â¾Ð ¼¾¼­°¡ žÀçµÈ ½º¸¶Æ®ÆùÀº ½Ç³» ÃøÀ§ ¹× °è´Ü ¼ö °è»ê ±â´ÉÀ» Áö¿øÇÕ´Ï´Ù. MEMS ¸¶ÀÌÅ©´Â À½¼º ºñ¼­, TWS(True Wireless Stereo) À̾îÆùÀÇ ¼ÒÀ½ ¾ïÁ¦ ¹× ÇÚÁîÇÁ¸® Åë½ÅÀÇ Áß½ÉÀÌ µÇ°í ÀÖ½À´Ï´Ù. Á¢ÀÌ½Ä ÈÞ´ëÆù, °Ç°­ ÁöÇâÀû À̾îÆù, IoT ÅëÇÕ ÀåÄ¡ÀÇ ÃâÇöÀ¸·Î ÃʼÒÇü ÀúÀü·Â MEMS ¼Ö·ç¼ÇÀÇ »õ·Î¿î »ç¿ë »ç·Ê°¡ »ý°Ü³ª°í ÀÖ½À´Ï´Ù.

Áö¿ªº°·Î´Â Áß±¹, Çѱ¹, ÀϺ», ´ë¸¸ÀÇ ÀüÀÚ±â±â Á¦Á¶ °ÅÁ¡µéÀÌ ÁÖµµÇÏ´Â ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ ¸ð¹ÙÀÏ ¾ÖÇø®ÄÉÀ̼ǿë MEMS µð¹ÙÀ̽ºÀÇ »ý»ê°ú ¼Òºñ ¸ðµÎ¿¡¼­ ´ëºÎºÐÀ» Â÷ÁöÇϰí ÀÖ½À´Ï´Ù. ºÏ¹Ì¿Í À¯·´Àº ƯÈ÷ MEMS ¼³°è, IP, Å×½ºÆ® ºÐ¾ß¿¡¼­ ¿©ÀüÈ÷ °­·ÂÇÑ Çõ½ÅÀÇ Áß½ÉÁöÀÔ´Ï´Ù. 5GÀÇ ±Þ¼ÓÇÑ º¸±Þ, ¿þ¾î·¯ºí ´Ü¸»±âÀÇ ÃâÇÏ·® Áõ°¡, Àεµ, µ¿³²¾Æ½Ã¾Æ, ¶óƾ¾Æ¸Þ¸®Ä« µîÀÇ ½ÃÀå¿¡¼­ À½¼º ¿ì¼± ´Ü¸»±â¿Í ¼¾¼­°¡ dzºÎÇÑ ´Ü¸»±âÀÇ º¸±ÞÀ¸·Î MEMS °ø±Þ¾÷ü°¡ ´ëÀÀÇÒ ¼ö ÀÖ´Â ½ÃÀåÀÌ È®´ëµÇ°í ÀÖ½À´Ï´Ù.

¸ð¹ÙÀÏ ±â±â¿ë MEMS ½ÃÀåÀÇ ¼¼°è ¼ºÀå ¿øµ¿·ÂÀº?

¼¼°è ¸ð¹ÙÀÏ ±â±â¿ë MEMS ½ÃÀåÀÇ ¼ºÀåÀº ¸ð¹ÙÀÏ »ç¿ëÀÚ ÀÎÅÍÆäÀ̽ºÀÇ º¹À⼺ Áõ°¡, °Ç°­ °¨Áö ¹× ¸ð¼Ç °¨Áö¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, ¸ð¹ÙÀÏ Ç÷§Æû ³» Åë½Å, ÄÄÇ»ÆÃ ¹× »óȲÀνÄÀÇ Áö¼ÓÀûÀÎ À¶ÇÕ µî ¿©·¯ ¿äÀÎÀ¸·Î ÀÎÇØ °¡Á®¿À°í ÀÖ½À´Ï´Ù. MEMS´Â ¸ð¹ÙÀÏ °æÇèÀÇ ¸ðµç °èÃþ¿¡ ¼¾½ÌÀ» ÅëÇÕÇÏ´Â µ¥ ÇÊ¿äÇÑ Å©±â, È®À强 ¹× È¿À²¼ºÀ» Á¦°øÇÕ´Ï´Ù.

»ýü ½ÅÈ£ °¨Áö, °ø°£ ¿Àµð¿À, ¿ø°Ý °Ç°­ ¸ð´ÏÅ͸µ, ¿§Áö AI µî »õ·Î¿î ÀÀ¿ë ºÐ¾ß·Î ÀÎÇØ MEMSÀÇ ±â´É ¹üÀ§´Â ±âÁ¸ÀÇ ¿òÁ÷ÀÓ°ú ¼Ò¸® °¨Áö ¿Ü¿¡µµ È®ÀåµÇ°í ÀÖ½À´Ï´Ù. dzºÎÇÑ ¼¾¼­ ¾î·¹ÀÌ, ¹èÅ͸® ¼ö¸í ¿¬Àå, ¸ôÀÔÇü °æÇèÀ» Á¦°øÇÏ´Â Â÷¼¼´ë ½º¸¶Æ®Æù°ú ¿þ¾î·¯ºíÀÇ µµÀÔÀ¸·Î °í¼º´É, ¼ÒÇüÈ­µÈ MEMS ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

ÆÄ¿îµå¸®, Ĩ ¼³°èÀÚ, OEMÀÇ Àü·«Àû ÆÄÆ®³Ê½ÊÀ» ÅëÇØ MEMS Áö¿ø Çõ½ÅÀÇ ½ÃÀå Ãâ½Ã ½Ã°£À» ´ÜÃàÇϰí ÀÖ½À´Ï´Ù. Á¢ÀÌ½Ä ´Ü¸»±â, ¼¾¼­°¡ žÀçµÈ À̾îÆù, AI¸¦ Ȱ¿ëÇÑ ¸ð¹ÙÀÏ ¾î½Ã½ºÅÏÆ® µîÀÇ µîÀåÀ¸·Î Á¦Á¶»çµéÀº MEMS¸¦ Â÷º°È­ÀÇ ÇÙ½ÉÀ¸·Î äÅÃÇÏÁö ¾ÊÀ» ¼ö ¾ø°Ô µÇ¾ú½À´Ï´Ù. ¸ð¹ÙÀÏ »ýŰ谡 Ãʰ³ÀÎÈ­, ºñÁ¢ÃË½Ä ÀÎÅÍÆäÀ̽º, ÁÖº¯ Áö´ÉÀ¸·Î À̵¿ÇÔ¿¡ µû¶ó Â÷¼¼´ë µð¹ÙÀ̽ºÀÇ °¨°¢ ÆÐºê¸¯À¸·Î¼­ MEMS ¼¾¼­ÀÇ ¿ªÇÒÀº ¹Ì·¡ Çõ½Å°ú ¼¼°è ½ÃÀå ¼ºÀåÀ» ÁÖµµÇÏ´Â µ¥ ÀÖ¾î ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÒ °ÍÀÔ´Ï´Ù. ¹Ì·¡ Çõ½Å°ú ¼¼°è ½ÃÀå ¼ºÀåÀ» ÃËÁøÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÒ °ÍÀÔ´Ï´Ù.

ºÎ¹®

¼¾¼­ À¯Çü(Áö¹® ¼¾¼­, °¡¼Óµµ°è ¼¾¼­, ÀÚÀ̷νºÄÚÇÁ ¼¾¼­, ¾Ð·Â ¼¾¼­, BAW ¼¾¼­, ¸¶ÀÌÅ© ¼¾¼­, ±âŸ ¼¾¼­ À¯Çü)

Á¶»ç ´ë»ó ±â¾÷ »ç·Ê

AI ÅëÇÕ

Global Industry Analysts´Â °ËÁõµÈ Àü¹®°¡ ÄÁÅÙÃ÷¿Í AI ÅøÀ» ÅëÇØ ½ÃÀå°ú °æÀï Á¤º¸¸¦ Çõ½ÅÇϰí ÀÖ½À´Ï´Ù.

Global Industry Analysts´Â LLM ¹× ¾÷°è °íÀ¯ÀÇ SLMÀ» Á¶È¸ÇÏ´Â ÀϹÝÀûÀÎ ±Ô¹üÀ» µû¸£´Â ´ë½Å ºñµð¿À Æ®·£½ºÅ©¸³Æ®, ºí·Î±×, °Ë»ö ¿£Áø Á¶»ç, ±â¾÷, Á¦Ç°/¼­ºñ½º ¹× ½ÃÀå µ¥ÀÌÅÍ ¹æ´ëÇÑ ¾çÀ» Æ÷ÇÔÇÑ, ¼¼°è µµ¸ÞÀÎ Àü¹®°¡°¡ ¼±º°ÇÑ ÄÁÅÙÃ÷ ¸®Æ÷ÁöÅ丮¸¦ ±¸ÃàÇß½À´Ï´Ù.

°ü¼¼ ¿µÇâ °è¼ö

Global Industry Analysts´Â º»»ç ¼ÒÀçÁö, Á¦Á¶°ÅÁ¡, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±âÁØÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È­¸¦ ¿¹ÃøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ¸ÅÃâ¿ø°¡(COGS) Áõ°¡, ¼öÀͼº Ç϶ô, °ø±Þ¸Á ÀçÆí µî ¹Ì½ÃÀû, °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼­µµ ƯÈ÷ °æÀï»çµé¿¡°Ô ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¸ñÂ÷

Á¦1Àå Á¶»ç ¹æ¹ý

Á¦2Àå ÁÖ¿ä ¿ä¾à

Á¦3Àå ½ÃÀå ºÐ¼®

Á¦4Àå °æÀï

KSM
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

Global MEMS for Mobile Devices Market to Reach US$13.9 Billion by 2030

The global market for MEMS for Mobile Devices estimated at US$9.1 Billion in the year 2024, is expected to reach US$13.9 Billion by 2030, growing at a CAGR of 7.3% over the analysis period 2024-2030. Fingerprint Sensor, one of the segments analyzed in the report, is expected to record a 9.6% CAGR and reach US$4.2 Billion by the end of the analysis period. Growth in the Accelerometer Sensor segment is estimated at 5.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.5 Billion While China is Forecast to Grow at 11.7% CAGR

The MEMS for Mobile Devices market in the U.S. is estimated at US$2.5 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.0 Billion by the year 2030 trailing a CAGR of 11.7% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 3.5% and 7.1% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.8% CAGR.

Global MEMS for Mobile Devices Market - Key Trends & Drivers Summarized

What Is Driving the Integration of MEMS Devices in Smartphones and Wearables?

Micro-Electro-Mechanical Systems (MEMS) are increasingly central to the evolution of mobile devices, enabling sophisticated sensing, user interaction, and motion detection features within compact, power-efficient formats. These miniature components, combining mechanical and electronic elements on a silicon substrate, are embedded in smartphones, tablets, smartwatches, and fitness trackers to perform critical functions such as acceleration sensing, orientation tracking, environmental monitoring, and gesture recognition.

Accelerometers, gyroscopes, magnetometers, microphones, pressure sensors, and MEMS-based RF switches are among the most widely deployed components in the mobile segment. Their usage has expanded beyond basic orientation sensing to include 3D spatial awareness, fitness tracking, advanced navigation, and gaming input. The rise of multimodal biometrics, voice activation, and AI-driven interaction has placed MEMS microphones and motion sensors at the core of user experience design. As consumer expectations shift toward seamless, immersive, and health-aware technologies, MEMS are becoming indispensable in enabling responsive, context-aware mobile applications.

How Are MEMS Technologies Evolving to Meet the Demands of Next-Generation Mobile Platforms?

Ongoing advances in MEMS design and fabrication are enabling greater miniaturization, improved sensitivity, and lower power consumption-key requirements for mobile platforms constrained by battery life and form factor. Multi-axis MEMS inertial measurement units (IMUs) combine accelerometers, gyroscopes, and magnetometers in a single package, supporting advanced features such as indoor navigation, augmented reality (AR), and motion gesture control. Piezoelectric and capacitive sensing mechanisms are being refined to deliver high precision and robustness against vibration, temperature, and aging.

MEMS microphones with high signal-to-noise ratio (SNR) and wide dynamic range are enhancing audio quality in voice calls, virtual assistants, and noise-canceling headphones. Optical MEMS are enabling miniature projection systems and 3D sensing in AR/VR headsets and smartphones. Integration with AI and machine learning algorithms allows MEMS sensors to interpret contextual signals, enabling smart wake-on-motion, adaptive sound processing, and user activity classification.

In parallel, wafer-level packaging (WLP), system-in-package (SiP) integration, and through-silicon vias (TSVs) are improving manufacturing efficiency and facilitating co-packaging with application processors and connectivity modules. These innovations are enabling higher levels of functional integration while reducing space and thermal load, critical for wearables, foldables, and ultra-slim mobile devices.

Which Mobile Applications and Consumer Markets Are Expanding Demand for MEMS Components?

MEMS devices are embedded in nearly every modern smartphone, supporting features such as auto-rotation, step tracking, air pressure-based altitude sensing, and voice command input. Flagship mobile phones incorporate an array of 10 to 20 MEMS sensors to enable photography stabilization, location refinement, call quality optimization, and advanced UI/UX functionalities. In wearables, MEMS sensors are critical to monitoring vital signs, movement, sleep cycles, and ambient conditions, feeding data into wellness and fitness platforms.

Gaming and AR/VR applications use MEMS gyroscopes and accelerometers to deliver real-time motion tracking and immersive controls. Smartphones with barometric sensors support indoor positioning and stair-counting features. MEMS microphones are central to voice-activated assistants, noise suppression in TWS (true wireless stereo) earbuds, and hands-free communication. The emergence of foldable phones, health-focused earbuds, and IoT-integrated devices is creating new use cases for ultra-miniaturized, low-power MEMS solutions.

Regionally, Asia-Pacific dominates both production and consumption of MEMS devices for mobile applications, led by electronics manufacturing hubs in China, South Korea, Japan, and Taiwan. North America and Europe remain strong centers of innovation, particularly in MEMS design, IP, and testing. Rapid adoption of 5G, growth in wearable shipments, and the proliferation of voice-first and sensor-rich devices across markets like India, Southeast Asia, and Latin America are widening the addressable market for MEMS suppliers.

What Is Fueling Growth in the MEMS for Mobile Devices Market Globally?

The growth in the global MEMS for mobile devices market is driven by several factors, including the escalating complexity of mobile user interfaces, rising demand for health and motion sensing, and ongoing convergence of communication, computing, and context-awareness within mobile platforms. MEMS offer the size, scalability, and efficiency needed to integrate sensing into every layer of the mobile experience.

Emerging application areas-such as biosignal sensing, spatial audio, remote health monitoring, and edge AI-are expanding MEMS’ functional scope beyond traditional motion and sound detection. The introduction of next-generation smartphones and wearables with richer sensor arrays, extended battery life, and immersive experiences is driving demand for more capable and miniaturized MEMS components.

Strategic partnerships between foundries, chip designers, and OEMs are accelerating time-to-market for MEMS-enabled innovations. The rise of foldables, sensor-rich earbuds, and AI-assisted mobile assistants are compelling manufacturers to adopt MEMS as a core enabler of differentiation. As the mobile ecosystem shifts toward hyper-personalization, contactless interfaces, and ambient intelligence, the role of MEMS sensors as the sensory fabric of next-gen devices will be pivotal in driving future innovation and global market growth.

SCOPE OF STUDY:

The report analyzes the MEMS for Mobile Devices market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Sensor Type (Fingerprint Sensor, Accelerometer Sensor, Gyroscope Sensor, Pressure Sensor, BAW Sensor, Microphone Sensor, Other Sensor Types)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 34 Featured) -

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â