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Smartphone System on Chip (SoC)
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½º¸¶Æ®Æù ½Ã½ºÅÛ ¿Â Ĩ(SoC) ¼¼°è ½ÃÀåÀº 2030³â±îÁö 18¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸Á

2024³â¿¡ 6¾ï 6,230¸¸ ´Þ·¯·Î ÃßÁ¤µÇ´Â ½º¸¶Æ®Æù ½Ã½ºÅÛ ¿Â Ĩ(SoC) ¼¼°è ½ÃÀåÀº2024-2030³â ºÐ¼® ±â°£ µ¿¾È CAGR 17.9%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 18¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ º¸°í¼­¿¡¼­ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ µà¾ó ÄÚ¾î SoC´Â CAGR 15.3%¸¦ ±â·ÏÇÏ¸ç ºÐ¼® ±â°£ Á¾·á±îÁö 7¾ï 5,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. Äõµå ÄÚ¾î SoC ºÎ¹®ÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£ µ¿¾È CAGR 20.5%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 1¾ï 7,410¸¸ ´Þ·¯·Î ÃßÁ¤, Áß±¹Àº CAGR 17.0%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ ½º¸¶Æ®Æù ½Ã½ºÅÛ ¿Â Ĩ(SoC) ½ÃÀåÀº 2024³â¿¡ 1¾ï 7,410¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦ ´ë±¹ÀÎ Áß±¹Àº ºÐ¼® ±â°£ÀÎ 2024-2030³â CAGR 17.0%·Î 2030³â±îÁö 2¾ï 7,540¸¸ ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖ°í, ºÐ¼® ±â°£ µ¿¾È CAGRÀº °¢°¢ 16.1%¿Í 15.7%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR ¾à 13.4%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ ½º¸¶Æ®Æù ½Ã½ºÅÛ ¿Â Ĩ(SoC) ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

SoC°¡ Çö´ë ½º¸¶Æ®ÆùÀÇ ±â¼úÀû ±Ù°£ÀÌ µÇ´Â ÀÌÀ¯´Â ¹«¾ùÀϱî?

SoC(System on Chip) ±â¼úÀº CPU, GPU, ¸Þ¸ð¸® ÄÁÆ®·Ñ·¯, ¸ðµ©, ISP, NPU µî ¿©·¯ ÇÙ½É ºÎǰÀ» ÇϳªÀÇ ½Ç¸®ÄÜ ±âÆÇ¿¡ ÅëÇÕÇÏ¿© Ãֽнº¸¶Æ®Æù Áß¾Ó Ã³¸®ÀÇ ÇÙ½ÉÀ» Çü¼ºÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °í¹Ðµµ ÁýÀûÈ­·Î ÀÎÇØ, SoC´Â ½º¸¶Æ®ÆùÀÇ ¼º´É ¹× È¿À²¼º¿¡ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸® Àâ¾ÒÀ¸¸ç, žÀç ¸éÀûÀÇ ÃÖ¼ÒÈ­, Àü·Â ¼ÒºñÀÇ °¨¼Ò, ó¸® ¼ÓµµÀÇ ´ëÆøÀûÀÎ Çâ»ó µîÀ» ½ÇÇöÇß½À´Ï´Ù. SoC ¸ðµ¨Àº ´Ù¸¥ ±â´É¿¡ °³º° ĨÀ» »ç¿ëÇÏ´Â ´ë½Å ´õ ±ä¹ÐÇÑ »óÈ£¿¬°á¼º, ´õ ºü¸¥ µ¥ÀÌÅÍ ±³È¯, Áö¿¬ ½Ã°£ °¨¼Ò¸¦ °¡´ÉÇÏ°Ô Çϸç, ¸ð¹ÙÀÏ ±â±âÀÇ ÄÄÆÑÆ®ÇÏ°í ¹èÅ͸® Á¦¾àÀÌ ÀÖ´Â ¾ÆÅ°ÅØÃ³¿¡ ¿Ïº®ÇÏ°Ô ºÎÇÕÇÕ´Ï´Ù.

Ãֽнº¸¶Æ®Æù¿ë SoC´Â ÀÏ¹Ý ÄÄÇ»ÆÃ»Ó¸¸ ¾Æ´Ï¶ó ¿Âµð¹ÙÀ̽º AI Ãß·Ð, ÃʰíÇØ»óµµ À̹ÌÁö ó¸®, 5G ¿¬°á, ½Ç½Ã°£ °ÔÀÓ ·»´õ¸µ°ú °°Àº Ư¼öÇÑ ÀÛ¾÷¿¡µµ ´ëÀÀÇÕ´Ï´Ù. Ä÷ÄÄ, ¾ÖÇÃ, ¹Ìµð¾îÅØ, »ï¼º µî ½ÃÀåÀÇ ÁÖ¿ä ±â¾÷µéÀº ÃÖ÷´Ü °øÁ¤ ³ëµå¸¦ äÅÃÇϰí, ´õ ¸¹Àº Äھ ÅëÇÕÇϰí, Àü¿ë °¡¼Ó±â¸¦ ÅëÇÕÇÏ¿© SoCÀÇ ¼º´ÉÀ» Áö¼ÓÀûÀ¸·Î Çâ»ó½Ã۰í ÀÖ½À´Ï´Ù. ÀÌ Ä¨µéÀº ÇÁ¸®¹Ì¾ö ±â±âÀÇ Ç÷¡±×½Ê ¼º´ÉÀ̳ª º¸±ÞÇü ÈÞ´ëÀüÈ­ÀÇ ºñ¿ë È¿À²¼º µî ¿ëµµº° ¿ä±¸»çÇ×À» ¿°µÎ¿¡ µÎ°í ¼³°èµÇ¾ú½À´Ï´Ù. ½º¸¶Æ®ÆùÀÌ ¿¬»ê ó¸® ´É·ÂÀÌ ³ôÀº ´Ü¸»±â·Î ÁøÈ­ÇÔ¿¡ µû¶ó SoC ¼³°è´Â Á¡Á¡ ´õ º¹ÀâÇØÁö°í ¾ÖÇø®ÄÉÀ̼ǿ¡ ÃÖÀûÈ­µÇ¾î °¡°í ÀÖ½À´Ï´Ù.

¾î¶² ±â¼ú Çõ½ÅÀÌ ½º¸¶Æ®ÆùÀÇ SoC ±â´ÉÀ» À籸¼ºÇϰí Àִ°¡?

ÃÖ÷´Ü ÇÁ·Î¼¼½º ³ëµå¿Í ¾ÆÅ°ÅØÃ³ Çõ½ÅÀÌ SoC ¹ßÀüÀÇ ÁÖ¿ä ¿øµ¿·ÂÀÔ´Ï´Ù. Á¦Á¶ ±â¼úÀÌ 7nm¿¡¼­ 5nm, ±×¸®°í ÇöÀç 3nm·Î ³Ñ¾î°¡¸é¼­ Á¦Á¶¾÷üµéÀº ´õ ¸¹Àº Æ®·£Áö½ºÅ͸¦ ´õ ÀÛÀº ´ÙÀÌ¿¡ ´õ ¸¹Àº Æ®·£Áö½ºÅ͸¦ Áý¾î³ÖÀ» ¼ö ÀÖ°Ô µÇ¾ú°í, ¿­ Ãâ·ÂÀ» ³·Ã߸鼭 ó¸® ´É·ÂÀ» Çâ»ó½Ãų ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù. ÀÌ·¯ÇÑ ¾ÆÅ°ÅØÃ³¸¦ ÅëÇØ °í¼º´É°ú Àü·Â È¿À²¿¡ ÃÖÀûÈ­µÈ À̱âÁ¾ ±¸¼º(big.LITTLE ¾ÆÅ°ÅØÃ³ µî)ÀÇ ¿ÁŸÄÚ¾î ¶Ç´Â µ¥Ä«ÄÚ¾î CPU¸¦ °³¹ßÇÒ ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù. NPU(Neural Processing Unit)·Î ´ëÇ¥µÇ´Â SoC ³» AI ¿£ÁøÀº À½¼º ÀνÄ, Àå¸é °¨Áö, Ŭ¶ó¿ìµå¿¡ ÀÇÁ¸ÇÏÁö ¾Ê´Â ¾ð¾î ¹ø¿ª µîÀÇ ÀÛ¾÷À» À§ÇÑ Ç¥ÁØ ÄÄÆ÷³ÍÆ®ÀÔ´Ï´Ù.

¶Ç ´Ù¸¥ Å« ¹ßÀüÀº ½Ç½Ã°£ ·¹ÀÌ Æ®·¹À̽Ì, °íÁÖ»çÀ² µð½ºÇ÷¹ÀÌ Áö¿ø, °í±Þ ½¦À̵ùÀÌ °¡´ÉÇÑ °í±Þ GPU ÅëÇÕÀÔ´Ï´Ù. ÀÌ·¯ÇÑ ±â´É °­È­´Â ÄÜ¼Ö±Þ ¸ð¹ÙÀÏ °ÔÀÓ°ú ¸ôÀÔÇü ¸ÖƼ¹Ìµð¾î °æÇèÀ» Áö¿øÇÕ´Ï´Ù. À̹ÌÁö ½ÅÈ£ ÇÁ·Î¼¼¼­(ISP)´Â ¸ÖƼ ·»Áî Ä«¸Þ¶ó ¾î·¹ÀÌ, 8K ºñµð¿À ³ìÈ­ ¹× °è»ê »çÁø ±â¼úÀ» °ü¸®Çϱâ À§ÇØ ÁøÈ­Çϰí ÀÖ½À´Ï´Ù. ISP´Â ÇöÀç ½Ç½Ã°£ HDR, AI ±â¹Ý ³ëÀÌÁî °¨¼Ò, ¾ó±¼ ÀÎ½Ä ±â´É °­È­¸¦ Áö¿øÇϰí ÀÖ½À´Ï´Ù.

¿¬°á¼º Ãø¸é¿¡¼­ 5G ¸ðµ©(ÅëÇÕÇü ¶Ç´Â °³º°Çü)Àº Ãֽнº¸¶Æ®Æù¿¡¼­ 6GHz ÀÌÇÏ ´ë¿ª°ú ¹Ð¸®¹ÌÅÍÆÄ ´ë¿ªÀ» ±¸ÇöÇÏ´Â µ¥ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸® Àâ¾Ò½À´Ï´Ù. SoC¿¡ ³»ÀåµÈ Wi-Fi 6/6E ¹× Bluetooth 5.3 ¸ðµâÀº °í󸮷®, ÀúÁö¿¬ ¹«¼± Åë½ÅÀ» Áö¿øÇÕ´Ï´Ù. Àü¿ø °ü¸® ÀåÄ¡¿Í º¸¾È ÀÎŬ·ÎÀú´Â ¾ÈÀüÇÑ »ýüÀÎ½Ä Ã³¸®¿Í ¿¡³ÊÁö È¿À²ÀûÀÎ ÀÛµ¿À» À§ÇØ °­È­µÈ Àü¿ø °ü¸® ÀåÄ¡¿Í º¸¾È ÀÎŬ·ÎÀú¸¦ °®Ãß°í ÀÖ½À´Ï´Ù. SoCÀÇ ¿ªÇÒÀº ÇÁ·Î¼¼½Ì¿¡ ±¹ÇѵÇÁö ¾Ê°í, ¿­, Àü·Â, Ä¿³ØÆ¼ºñƼ µî ´Ù¾çÇÑ ¿µ¿ª¿¡¼­ ¿£µåÅõ¿£µå ¼º´É ÃÖÀûÈ­¸¦ °ü¸®ÇÒ ¼ö ÀÖµµ·Ï È®ÀåµÇ°í ÀÖ½À´Ï´Ù.

SoC ½ÃÀåÀÇ ¼ºÀåÀ» ÁÖµµÇÏ´Â µð¹ÙÀ̽º ºÎ¹®°ú Áö¿ªÀº?

½º¸¶Æ®Æù¿ë SoCÀÇ ÁÖ¿ä ¼ö¿ä´Â °í¼º´É ¹× Áß±ÞÇü ±â±â ºÎ¹®¿¡¼­ ¹ß»ýÇÏÁö¸¸, º¸±ÞÇü ½º¸¶Æ®Æùµµ Å« ºñÁßÀ» Â÷ÁöÇϰí ÀÖ½À´Ï´Ù. Apple, Samsung, Xiaomi¿Í °°Àº ºê·£µåÀÇ Ç÷¡±×½Ê ±â±â´Â °í±Þ Á¦Á¶, GPU/ISP °­È­, 5G ÅëÇÕÀ» °®Ãá ÇÁ¸®¹Ì¾ö SoC¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÁÖµµÇϰí ÀÖ½À´Ï´Ù. ¾ÖÇÃÀÇ Bionic ½Ã¸®Áî, Ä÷ÄÄÀÇ Snapdragon 8 Gen ½Ã¸®Áî, »ï¼ºÀÇ Exynos 2200Àº ÀÌ ºÎ¹®ÀÇ ÃÖ÷´ÜÀ» ´ëÇ¥ÇÕ´Ï´Ù. ¹Ý´ë·Î MediaTekÀÇ Dimensity ½Ã¸®Áî¿Í Helio ½Ã¸®Áî´Â ³·Àº Àü·Â ¼Òºñ¿Í ºñ¿ë ¼öÁØ¿¡¼­ °ÔÀÓ°ú »çÁø ÃÔ¿µÀ» Áö¿øÇÏ´Â ¼º´É È¿À²ÀÌ ³ôÀº ĨÀ¸·Î Áß±ÞÇü ¹× Àú°¡Çü ´Ü¸»±â¿¡ ´ëÀÀÇϰí ÀÖ½À´Ï´Ù.

Àεµ, µ¿³²¾Æ½Ã¾Æ, ¾ÆÇÁ¸®Ä« µî ½ÅÈï ½ÃÀå¿¡¼­´Â ÁßÀú°¡ ¹× Àú°¡Çü ½º¸¶Æ®Æù¿¡ ´ëÇÑ ¼ö¿ä°¡ °­¼¼¸¦ º¸ÀÌ¸ç ºñ¿ë È¿À²ÀûÀÎ SoC ÃâÇÏ·®À» ´Ã¸®°í ÀÖ½À´Ï´Ù. ÀÌµé ½ÃÀå¿¡¼­´Â MediaTek, UNISOC, Ä÷ÄÄÀÇ º¸±ÞÇü Ĩ¼ÂÀÌ ÁÖ·ù¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. ¹Ý¸é, ºÏ¹Ì, À¯·´, ³²¹Ì, ÀϺ» µî ½ÅÈï±¹ ½ÃÀå¿¡¼­´Â ÷´Ü SoC¸¦ äÅÃÇÑ °í¼º´É ½º¸¶Æ®ÆùÀÌ ÁÖ·ù¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. Áß±¹°ú Çѱ¹¿¡¼­´Â Á¢ÀÌ½Ä ½º¸¶Æ®Æù°ú °ÔÀÓ Á᫐ ½º¸¶Æ®ÆùÀÇ ÀαⰡ ³ô¾ÆÁö¸é¼­ GPU¿Í ¿­ È¿À²ÀÌ ³ôÀº SoC ¼³°è¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

ƯÈ÷ ÀÚü Ĩ¼ÂÀ» º¸À¯ÇÏÁö ¾ÊÀº OEM Á¦Á¶¾÷üÀÇ °æ¿ì, µð¹ÙÀ̽ºÀÇ Â÷º°È­´Â Á¡Á¡ ´õ SoCÀÇ ¼º´É¿¡ ÀÇÁ¸Çϰí ÀÖ½À´Ï´Ù. µû¶ó¼­ SoC °ø±Þ¾÷üµéÀº ¾ÐÃàµÈ °³¹ß ÁÖ±â·Î ¿î¿µµÇ´Â µð¹ÙÀ̽º Á¦Á¶¾÷üµé¿¡°Ô ´õ ºü¸£°í, ´õ ÁýÀûÈ­µÈ, ¾ÖÇø®ÄÉÀ̼ǿ¡ ƯȭµÈ ½Ç¸®ÄÜÀ» Á¦°øÇØ¾ß Çϸç, ÀÌ´Â SoC °ø±Þ¾÷üµé¿¡°Ô Å« µµÀüÀÌ µÇ°í ÀÖ½À´Ï´Ù. Áõ°­Çö½Ç(XR) µð¹ÙÀ̽º¿Í ¸ð¹ÙÀÏ ÆÛ½ºÆ® AI ¿öÅ©·ÎµåÀÇ ÁøÈ­´Â »ç¿ë »ç·Ê¿¡ °ü°è¾øÀÌ °­·ÂÇÑ ½º¸¶Æ®Æù¿ë SoC¿¡ ´ëÇÑ ÀÇÁ¸µµ¸¦ ´õ¿í ½ÉÈ­½Ãų °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

¼¼°è ½º¸¶Æ®Æù SoC ½ÃÀå È®´ëÀÇ ¿øµ¿·ÂÀº?

¼¼°è ½º¸¶Æ®Æù SoC ½ÃÀåÀÇ ¼ºÀåÀº ¸ð¹ÙÀÏ AI ±â´É¿¡ ´ëÇÑ ¼ö¿ä ±ÞÁõ, 5G È®»ê °¡¼ÓÈ­, ½º¸¶Æ®Æù µðÀÚÀÎ ¼ö·Å, °í±Þ À̹ÌÁö ó¸® ¹× °ÔÀÓ °æÇè¿¡ ´ëÇÑ ¼ÒºñÀÚ ¼ö¿ä µî ¿©·¯ °¡Áö ¿äÀο¡ ÀÇÇØ ÁÖµµµÇ°í ÀÖ½À´Ï´Ù. »ç¿ëÀÚ°¡ ±â±â¿¡¼­ º¸´Ù ¿øÈ°ÇÑ ¸ÖƼŽºÅ·, Áö´ÉÇü Ä«¸Þ¶ó ±â´É, ½Ç½Ã°£ ¾ð¾î 󸮸¦ ¿ä±¸ÇÔ¿¡ µû¶ó OEMÀº ±â±â¿¡¼­ ÀÌ·¯ÇÑ ±â´ÉÀ» Áö¿øÇÏ´Â Á¡Á¡ ´õ °­·ÂÇÑ SoC·Î ´«À» µ¹¸®°í ÀÖ½À´Ï´Ù. NPU¿Í ISPÀÇ ÅëÇÕÀº ´õ ÀÌ»ó »çÄ¡½º·¯¿î ±â´ÉÀÌ ¾Æ´Ï¶ó °æÀï·Â ÀÖ´Â ½º¸¶Æ®ÆùÀÇ ±âº» ¿ä°ÇÀÌ µÇ¾ú½À´Ï´Ù.

Àü ¼¼°è°¡ 5G·Î ÀüȯÇÏ´Â °Íµµ Áß¿äÇÑ ¼ºÀå ÃËÁø¿äÀÎÀÔ´Ï´Ù. ÅëÇÕÇü 5G ¸ðµ©Àº BOM(Bill of Materials) ºñ¿ëÀ» Àý°¨Çϰí Àü·Â È¿À²À» Çâ»ó½Ã۸ç Áß±Þ ¹× °í±Þ SoCÀÇ Ç¥ÁØÀÌ µÇ°í ÀÖ½À´Ï´Ù. Áß±¹, Çѱ¹, ¹Ì±¹, ¹Ì±¹, À¯·´ ÀϺΠÁö¿ª µî¿¡¼­´Â 5G ÀÎÇÁ¶ó¸¦ Àû±ØÀûÀ¸·Î µµÀÔÇϰí ÀÖÀ¸¸ç, OEMÀÌ 300´Þ·¯ ÀÌÇÏ ºÎ¹®¿¡¼­µµ ȣȯ °¡´ÉÇÑ ÈÞ´ëÆùÀ» Á¦°øÇϵµ·Ï Àå·ÁÇϰí ÀÖ½À´Ï´Ù. ÀÌ ¶§¹®¿¡ 5G, AI, À̹ÌÁö ó¸®, ¸ÖƼ¹Ìµð¾î¸¦ Á¡Á¡ ´õ ÄÄÆÑÆ®ÇÑ ÆÐŰÁö¿¡ ÅëÇÕÇÑ SoC¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

¶ÇÇÑ, ARM ±â¹Ý ¾ÆÅ°ÅØÃ³, ¸ÖƼ ÄÚ¾î ±¸¼º, AI Áö¿øÀÇ Ã¤ÅÃÀº Ĩ º¥´õ¿Í OEM ¸ðµÎ¿¡¼­ ±â¼ú Çõ½ÅÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. TSMC, »ï¼º°ú °°Àº ÆÄ¿îµå¸® ¾÷ü, ARM, Imagination°ú °°Àº IP º¥´õ, SoC ºê·£µå °£ÀÇ ¾÷°è Á¦ÈÞ´Â ½ÃÀå Ãâ½Ã ½Ã°£À» ¾Õ´ç±â°í ÀÖ½À´Ï´Ù. Á¦Á¶ ºñ¿ë°ú ¿¬±¸°³¹ß ºñ¿ëÀÌ »ó½ÂÇÏ´Â °¡¿îµ¥, Â÷¼¼´ë ¾ÆÅ°ÅØÃ³¿¡ ´ëÇÑ ÅõÀÚ¸¦ Áö¼ÓÇÒ ¼ö ÀÖ´Â ¼Ò¼öÀÇ À¯·Â ¾÷ü¸¦ Áß½ÉÀ¸·Î ½ÃÀå ÀçÆíÀÌ ÁøÇàµÇ°í ÀÖ½À´Ï´Ù. ¸ð¹ÙÀÏ ÄÄÇ»ÆÃÀÌ Á¡Á¡ ´õ °­·ÂÇØÁö°í ÀÚÀ²ÀûÀÌ°í ´Ù±â´ÉÈ­µÊ¿¡ µû¶ó ÀÌ·¯ÇÑ Ãß¼¼´Â SoCÀÇ ÁøÈ­¸¦ °è¼Ó Çü¼ºÇÒ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

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Global Smartphone System on Chip (SoC) Market to Reach US$1.8 Billion by 2030

The global market for Smartphone System on Chip (SoC) estimated at US$662.3 Million in the year 2024, is expected to reach US$1.8 Billion by 2030, growing at a CAGR of 17.9% over the analysis period 2024-2030. Dual Core SoC, one of the segments analyzed in the report, is expected to record a 15.3% CAGR and reach US$750.0 Million by the end of the analysis period. Growth in the Quad Core SoC segment is estimated at 20.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$174.1 Million While China is Forecast to Grow at 17.0% CAGR

The Smartphone System on Chip (SoC) market in the U.S. is estimated at US$174.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$275.4 Million by the year 2030 trailing a CAGR of 17.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.1% and 15.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 13.4% CAGR.

Global Smartphone System On Chip (SoC) Market - Key Trends & Drivers Summarized

What Makes SoCs the Technological Backbone of Modern Smartphones?

System on Chip (SoC) technology forms the central processing nucleus of modern smartphones by integrating multiple essential components-CPU, GPU, memory controller, modem, ISP, NPU, and more-onto a single silicon substrate. This high-density integration minimizes footprint, reduces power consumption, and significantly improves processing speed, making SoCs critical to the performance and efficiency of smartphones. Instead of using discrete chips for different functions, the SoC model allows for tighter interconnectivity, faster data exchange, and reduced latency, aligning perfectly with the compact and battery-constrained architecture of mobile devices.

Contemporary smartphone SoCs not only power general computing but also handle specialized tasks such as on-device AI inference, ultra-high-resolution image processing, 5G connectivity, and real-time gaming rendering. Major players in the market-including Qualcomm, Apple, MediaTek, and Samsung-continuously push SoC capabilities by adopting leading-edge process nodes, integrating more cores, and embedding dedicated accelerators. These chips are designed with application-specific requirements in mind, whether it-s flagship performance in premium devices or cost-efficiency in entry-level phones. As smartphones evolve into computational powerhouses, SoC designs are becoming increasingly complex and application-optimized.

Which Technology Innovations Are Reshaping Smartphone SoC Capabilities?

Cutting-edge process nodes and architecture innovation are primary drivers of SoC advancement. The shift from 7nm to 5nm and now 3nm manufacturing technology has allowed manufacturers to pack more transistors into smaller dies, increasing processing power while lowering thermal output. These nodes are enabling the development of octa-core or deca-core CPUs with heterogeneous configurations (e.g., big.LITTLE architecture), optimized for both high performance and power efficiency. AI engines within SoCs, typically represented by Neural Processing Units (NPUs), are now standard components for tasks such as voice recognition, scene detection, and language translation without cloud dependency.

Another major development is the integration of advanced GPUs capable of real-time ray tracing, high refresh rate display support, and advanced shading. These enhancements support console-grade mobile gaming and immersive multimedia experiences. Image Signal Processors (ISPs) are evolving to manage multi-lens camera arrays, 8K video recording, and computational photography techniques. ISPs now support real-time HDR, AI-based noise reduction, and facial recognition enhancements.

On the connectivity front, 5G modems-either integrated or discrete-have become essential for enabling sub-6GHz and mmWave bands in modern smartphones. Wi-Fi 6/6E and Bluetooth 5.3 modules embedded in SoCs support high-throughput, low-latency wireless communication. Power management units and security enclaves are being enhanced to enable secure biometric processing and energy-efficient operation. The role of SoCs is expanding beyond processing; they now manage end-to-end performance optimization across thermal, power, and connectivity domains.

Which Device Segments and Regions Are Fueling SoC Market Growth?

The primary demand for smartphone SoCs comes from high-performance and mid-range device segments, with entry-level smartphones also contributing significant volume. Flagship devices from brands like Apple, Samsung, and Xiaomi drive demand for premium SoCs with advanced fabrication, GPU/ISP enhancements, and 5G integration. Apple-s Bionic series, Qualcomm-s Snapdragon 8 Gen series, and Samsung-s Exynos 2200 represent the bleeding edge of this segment. Conversely, MediaTek-s Dimensity and Helio series cater to mid-range and budget devices with performance-efficient chips that support gaming and photography at lower power and cost levels.

Emerging markets such as India, Southeast Asia, and Africa are showing robust demand for mid- and low-end smartphones, fueling shipment volume for cost-effective SoCs. In these markets, MediaTek, UNISOC, and entry-tier Qualcomm chipsets dominate. Meanwhile, developed markets in North America, Europe, South Korea, and Japan are key adopters of high-performance smartphones that rely on advanced SoCs. The rising popularity of foldable smartphones and gaming-centric phones in China and South Korea is pushing demand for GPUs and thermal-efficient SoC designs.

Device differentiation is increasingly reliant on SoC performance, particularly for OEMs who lack proprietary chipsets. This has created a high-stakes market for SoC suppliers who are expected to deliver faster, more integrated, and application-specific silicon to device manufacturers operating under compressed development cycles. The evolution of extended reality (XR) devices and mobile-first AI workloads will only deepen the reliance on powerful smartphone SoCs across use cases.

What Drives the Expansion of the Smartphone SoC Market Globally?

The growth in the global smartphone SoC market is driven by several factors, including the surging demand for mobile AI capabilities, accelerated 5G rollouts, smartphone design convergence, and consumer demand for advanced imaging and gaming experiences. As users seek smoother multitasking, intelligent camera features, and real-time language processing on their devices, OEMs are turning to increasingly powerful SoCs that support these capabilities on-device. The integration of NPUs and ISP advancements are no longer luxury features-they are baseline requirements in competitive smartphones.

The global transition to 5G is another significant growth driver. Integrated 5G modems are becoming standard in mid- and high-end SoCs, reducing BOM (bill of materials) costs and improving power efficiency. Regions such as China, South Korea, the U.S., and parts of Europe have embraced 5G infrastructure aggressively, pushing OEMs to offer compatible phones even in sub-$300 segments. This fuels demand for SoCs that combine 5G, AI, imaging, and multimedia in increasingly compact packages.

Further, the adoption of ARM-based architectures, multi-core configurations, and AI-enablement is spurring innovation across both chip vendors and OEMs. Industry partnerships between foundries (like TSMC and Samsung), IP vendors (such as ARM and Imagination), and SoC brands are accelerating time-to-market. As fabrication and R&D costs rise, the market is witnessing a consolidation around few dominant players capable of sustained investment in next-gen architectures. These trends will continue to shape SoC evolution as mobile computing becomes ever more powerful, autonomous, and multifunctional.

SCOPE OF STUDY:

The report analyzes the Smartphone System on Chip (SoC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Core Type (Dual Core SoC, Quad Core SoC, Octa Core SoC, Other Core Types); Operating System (Android Operating System, iOS Operating System, Windows Operating System)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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