¼¼°èÀÇ ·¹ÆÛ·±½º µðÀÚÀÎ ½ÃÀå
Reference Designs
»óǰÄÚµå : 1794684
¸®¼­Ä¡»ç : Global Industry Analysts, Inc.
¹ßÇàÀÏ : 2025³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 290 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 5,850 £Ü 8,209,000
PDF & Excel (Single User License) help
PDF & Excel º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ®ÀÇ º¹»ç ¹× ºÙ¿©³Ö±â´Â °¡´ÉÇÏÁö¸¸, Ç¥/±×·¡ÇÁ µîÀº º¹»çÇÒ ¼ö ¾ø½À´Ï´Ù. Àμâ´Â 1ȸ °¡´ÉÇϸç, Àμ⹰ÀÇ ÀÌ¿ë¹üÀ§´Â ÆÄÀÏ ÀÌ¿ë¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 17,550 £Ü 24,629,000
PDF & Excel (Global License to Company and its Fully-owned Subsidiaries) help
PDF & Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ ¹× 100% ÀÚȸ»çÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÏ½Ç ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â 1Àδç 1ȸ °¡´ÉÇϸç, Àμ⹰ÀÇ ÀÌ¿ë¹üÀ§´Â ÆÄÀÏ ÀÌ¿ë¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


Çѱ۸ñÂ÷

·¹ÆÛ·±½º µðÀÚÀÎ ¼¼°è ½ÃÀåÀº 2030³â±îÁö 466¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸Á

2024³â¿¡ 264¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ·¹ÆÛ·±½º µðÀÚÀÎ ¼¼°è ½ÃÀåÀº 2024³âºÎÅÍ 2030³â±îÁö CAGR 9.9%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 466¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ º¸°í¼­¿¡¼­ ºÐ¼®Çϰí ÀÖ´Â ºÎ¹® Áß ÇϳªÀÎ Çϵå¿þ¾î ·¹ÆÛ·±½º µðÀÚÀÎÀº CAGR 8.3%¸¦ ±â·ÏÇÏ¸ç ºÐ¼® ±â°£ Á¾·á½Ã¿¡´Â 253¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ¼ÒÇÁÆ®¿þ¾î ·¹ÆÛ·±½º µðÀÚÀÎ ºÐ¾ßÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£ µ¿¾È CAGR 12.4%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 72¾ï ´Þ·¯, Áß±¹Àº CAGR 13.3%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ ·¹ÆÛ·±½º µðÀÚÀÎ ½ÃÀåÀº 2024³â¿¡ 72¾ï ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦ ´ë±¹ÀÎ Áß±¹Àº 2030³â±îÁö 94¾ï ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, ºÐ¼® ±â°£ÀÎ 2024-2030³â CAGRÀº 13.3%¸¦ ±â·ÏÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖ°í, ºÐ¼® ±â°£ µ¿¾È CAGRÀº °¢°¢ 7.3%¿Í 8.6%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR 7.7%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ ·¹ÆÛ·±½º µðÀÚÀÎ ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

·¹ÆÛ·±½º µðÀÚÀÎÀº Çϵå¿þ¾î °³¹ß »ýŰ踦 ¾î¶»°Ô º¯È­½Ãų °ÍÀΰ¡?

·¹ÆÛ·±½º µðÀÚÀÎÀº ƯÈ÷ ½ÃÀå Ãâ½Ã ½Ã°£, ±ÔÁ¦ Áؼö, ºÎǰ ÅëÇÕÀÇ º¹À⼺ÀÌ Å« º´¸ñÇö»óÀÌ ¹ß»ýÇÏ´Â ºÐ¾ß¿¡¼­ Çϵå¿þ¾î Çõ½ÅÀÇ ÇÙ½ÉÀÌ µÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °ËÁõµÈ ¼³°è µµ¸éÀº ÀϹÝÀûÀ¸·Î ¹ÝµµÃ¼ ±â¾÷À̳ª ODM(ÁÖ¹®ÀÚ»óÇ¥ºÎÂø»ý»ê) ¾÷ü¿¡¼­ Á¦°øÇϸç, Å×½ºÆ®µÈ ȸ·Îµµ, ·¹À̾ƿô ÆÄÀÏ, BOM(Bill of Materials), Æß¿þ¾î, ½ÉÁö¾î ¼º´É º¥Ä¡¸¶Å©±îÁö Æ÷ÇԵǾî ÀÖ½À´Ï´Ù. ƯÈ÷ IoT, Â÷·®¿ë ÀüÀÚÁ¦Ç°, ¿§Áö ÄÄÇ»ÆÃ, 5G ÀÎÇÁ¶ó¿Í °°Àº ½ÅÈï ½ÃÀå¿¡¼­ OEM ¹× ODMÀÌ ÇÁ·ÎÅäŸÀÌÇÎÀ» °¡¼ÓÈ­ÇÒ ¼ö ÀÖµµ·Ï °³¹ß Áֱ⸦ ´ÜÃàÇÒ ¼ö ÀÖ´Ù´Â Á¡¿¡¼­ À¯¿ë¼ºÀÌ ÀÖ½À´Ï´Ù.

·¹ÆÛ·±½º µðÀÚÀÎÀº ½ÅÈ£ ¹«°á¼º, ¿­ °ü¸®, Àü·Â ÃÖÀûÈ­°¡ °¡Àå Áß¿äÇÑ º¹ÀâÇÑ ½Ã½ºÅÛ¿ÂĨ(SoC) ¹× È¥ÇÕ ½ÅÈ£ ȯ°æÀ» ´Ù·ê ¶§ ƯÈ÷ Áß¿äÇÕ´Ï´Ù. °³¹ßÀڴ óÀ½ºÎÅÍ ¼³°è¸¦ ½ÃÀÛÇÏ´Â °ÍÀÌ ¾Æ´Ï¶ó ÀÌ·¯ÇÑ ¼³°è¸¦ »ç¿ëÇÏ¿© ƯÁ¤ Ĩ¼Â, ¼¾¼­, ¸Þ¸ð¸® ¾ÆÅ°ÅØÃ³, Àü¿ø °ø±Þ ÀåÄ¡¿ÍÀÇ È£È¯¼ºÀ» º¸ÀåÇÕ´Ï´Ù. À̸¦ ÅëÇØ ¼³°è ¹Ýº¹À» ÁÙÀ̰í, °íÀå À§ÇèÀ» ÁÙÀ̸ç, ¾ö°ÝÇÑ Á¦Ç° Ãâ½Ã ÀÏÁ¤À» ÁؼöÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ½Å¼ÓÇÑ ¹ý±Ô »çÀü ÄÄÇöóÀ̾𽺠Å×½ºÆ®µµ Áö¿øÇϹǷΠCE, FCC, ISO 26262¿Í °°Àº ÀÚµ¿Â÷ Ç¥ÁØ ÀÎÁõ ȹµæ¿¡ ¼Ò¿äµÇ´Â Àüü ½Ã°£°ú ºñ¿ë ºÎ´ãÀ» ÁÙÀÏ ¼ö ÀÖ½À´Ï´Ù.

·¹ÆÛ·±½º µðÀÚÀÎÀÇ ÇýÅÃÀ» °¡Àå ¸¹ÀÌ ¹Þ´Â ÀÀ¿ë ºÐ¾ß¿Í »ê¾÷Àº ¹«¾ùÀΰ¡?

·¹ÆÛ·±½º µðÀÚÀÎÀÇ »ç¿ëÀº ´Ù¾çÇÑ ºÐ¾ß¿¡ °ÉÃÄ ÀÖÀ¸¸ç, °¢°¢ÀÇ ½ÃÀå ¹× ±ÔÁ¦ ¿ä°ÇÀ» ÃæÁ·½Ã۱â À§ÇØ È°¿ëµÇ°í ÀÖ½À´Ï´Ù. ¼ÒºñÀÚ °¡Àü ºÐ¾ß¿¡¼­´Â ¹«¼± Ä¿³ØÆ¼ºñƼ, Àü·Â °ü¸® IC(PMIC), µð½ºÇ÷¹ÀÌ µå¶óÀ̹öÀÇ ÅëÇÕÀÌ ÇʼöÀûÀÎ ½º¸¶Æ®Æù, ¿þ¾î·¯ºí, ½º¸¶Æ®È¨ ±â±â °³¹ßÀ» º¸´Ù ºü¸£°Ô ÁøÇàÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¾ßÀÇ OEMÀº ·¹ÆÛ·±½º µðÀÚÀÎÀ» Ȱ¿ëÇÏ¿© ¼³°è Áֱ⸦ ¾Õ´ç±â¸é¼­ ¹èÅ͸® ¼ö¸í, ½ÅÈ£ °­µµ, ¿­ ¼º´ÉÀ» ÃÖÀûÈ­Çϰí ÀÖ½À´Ï´Ù.

ÀÚµ¿Â÷ ¾÷°è¿¡¼­´Â ADAS(÷´Ü ¿îÀüÀÚ º¸Á¶ ½Ã½ºÅÛ), Àü±âÀÚµ¿Â÷(EV) ¹èÅ͸® °ü¸® ½Ã½ºÅÛ, Â÷·®¿ë ÀÎÆ÷Å×ÀÎ¸ÕÆ®(IVI), ÅÚ·¹¸Åƽ½º µî¿¡ ·¹ÆÛ·±½º µðÀÚÀÎÀÌ Æø³Ð°Ô Àû¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¼­ºê½Ã½ºÅÛÀº ¾ÈÀü ¹× EMC(ÀüÀÚÆÄ ÀûÇÕ¼º) Ç¥ÁØÀ» öÀúÈ÷ ÁؼöÇØ¾ß Çϸç, ·¹ÆÛ·±½º µðÀÚÀο¡¼­´Â »çÀü ÀÎÁõµÈ ·¹À̾ƿô°ú Å×½ºÆ®µÈ ±¸¼º¿ä¼Ò¸¦ ¼±ÅÃÇÔÀ¸·Î½á À̸¦ ÃæÁ·ÇÒ ¼ö ÀÖ½À´Ï´Ù. ¸¶Âù°¡Áö·Î, »ê¾÷ ÀÚµ¿È­ ºÐ¾ß¿¡¼­´Â ÇÁ·Î±×·¡¸Óºí ·ÎÁ÷ ÄÁÆ®·Ñ·¯(PLC), ¸ðÅÍ µå¶óÀ̹ö, ¼¾¼­, »ê¾÷¿ë Åë½Å ¸ðµâ¿¡ ·¹ÆÛ·±½º µðÀÚÀÎÀÌ Ã¤Åõǰí ÀÖ½À´Ï´Ù. ÀÇ·á±â±â °³¹ß¿¡¼­µµ ÀÎÁõ¿¡ ½Ã°£ÀÌ °É¸®±â ¶§¹®¿¡ Á¦Ç°È­°¡ Áö¿¬µÉ ¼ö ÀÖÁö¸¸, ·¹ÆÛ·±½º µðÀÚÀÎÀº Ŭ·¡½º i ¹× Ŭ·¡½º II ±â±âÀÇ FDA ¶Ç´Â EU MDR ½ÂÀΠȹµæÀ» ¾Õ´ç±â´Â µ¥ µµ¿òÀÌ µÇ°í ÀÖ½À´Ï´Ù.

·¹ÆÛ·±½º µðÀÚÀÎÀº Â÷¼¼´ë Ç÷§Æû°ú °³¹ß ¸ðµ¨À» Áö¿øÇϱâ À§ÇØ ¾î¶»°Ô ÁøÈ­Çϰí Àִ°¡?

ÃֽŠ·¹ÆÛ·±½º µðÀÚÀÎÀº ´Ü¼øÇÑ Á¤Àû ¹®¼­°¡ ¾Æ´Ï¶ó ¼ÒÇÁÆ®¿þ¾î µµ±¸, ½Ã¹Ä·¹ÀÌ¼Ç È¯°æ, Ŭ¶ó¿ìµå ±â¹Ý Çù¾÷ ÀÎÅÍÆäÀ̽º·Î Áö¿øµÇ´Â µ¿ÀûÀÌ°í ¸ðµâÈ­µÈ Ç÷§ÆûÀ¸·Î, ¼ÒÇÁÆ®¿þ¾î µµ±¸, ½Ã¹Ä·¹ÀÌ¼Ç È¯°æ, Ŭ¶ó¿ìµå ±â¹Ý Çù¾÷ ÀÎÅÍÆäÀ̽º¸¦ ÅëÇØ Áö¿øµË´Ï´Ù. ÀÓº£µðµå ½Ã½ºÅÛ°ú ¸ÖƼ ÄÚ¾î ÇÁ·Î¼¼¼­°¡ º¹ÀâÇØÁü¿¡ µû¶ó, °³¹ßÀÚµéÀº ¿£µåÅõ¿£µå µðÀÚÀÎ »ýŰ踦 ¿ä±¸Çϰí ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ Á¦Á¶¾÷ü´Â ½Ç½Ã°£ °³¹ß ŰƮ, Æß¿þ¾î ¾÷µ¥ÀÌÆ®, º¸¾È ÆÐÄ¡, ¿ø°Ý µð¹ö±ë ¹× OTA ¾÷µ¥ÀÌÆ®¸¦ À§ÇÑ Å¬¶ó¿ìµå ÅëÇÕÀ» Æ÷ÇÔÇÑ ·¹ÆÛ·±½º µðÀÚÀÎ ÆÐŰÁö·Î ´ëÀÀÇϰí ÀÖ½À´Ï´Ù.

Áß¿äÇÑ Æ®·»µå Áß Çϳª´Â ÃÖÁ¾»ç¿ëÀÚ SKU °£ÀÇ À¯¿¬ÇÑ ±¸¼ºÀ» Áö¿øÇϱâ À§ÇÑ ·¹ÆÛ·±½º µðÀÚÀÎÀÇ ¸ðµâÈ­ÀÔ´Ï´Ù. À̸¦ ÅëÇØ Çϵå¿þ¾î °³¹ßÀÚ´Â Àüü ½Ã½ºÅÛÀ» Àç¼³°èÇÏÁö ¾Ê°íµµ ¼º´É ¹× ÆûÆÑÅÍ ¿ä±¸»çÇ׿¡ µû¶ó È®ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ, AI ¹× ML °¡¼Ó±â´Â ƯÈ÷ ½º¸¶Æ® Ä«¸Þ¶ó, »ê¾÷¿ë ºñÀü ½Ã½ºÅÛ, À½¼º Á¦¾î ÀåÄ¡¿Í °°Àº ¿§Áö Ãß·Ð ¾ÖÇø®ÄÉÀ̼ÇÀ» À§ÇÑ ·¹ÆÛ·±½º ¼³°è¿¡ ÅëÇյǾî ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå¿¡ ¿¬°áµÈ ·¹ÆÛ·±½º µðÀÚÀÎÀº µ¿±âÈ­µÈ µ¥ÀÌÅÍ ¼öÁý ¹× ¾Ë°í¸®Áò ÇнÀ ·çÇÁ¸¦ ÅëÇØ °³¹ßÀÚ°¡ ¿§Áö-Åõ-Ŭ¶ó¿ìµå ¿öÅ©Ç÷ο츦 ½Å¼ÓÇÏ°Ô ±¸ÇöÇÒ ¼ö ÀÖµµ·Ï Áö¿øÇÕ´Ï´Ù.

·¹ÆÛ·±½º µðÀÚÀο¡ ¹øµé·Î Á¦°øµÇ´Â ¼ÒÇÁÆ®¿þ¾î °³¹ß ŰƮ(SDK)¿Í ¹Ìµé¿þ¾î ¶óÀ̺귯¸®´Â ¾Èµå·ÎÀ̵å, RTOS, ¸®´ª½º, À©µµ¿ì IoT µî ÀϹÝÀûÀÎ Ç÷§Æû¿¡ ´ëÀÀÇÏ´Â °ÍµéÀÌ ´Ã¾î³ª°í ÀÖ½À´Ï´Ù. ƯÈ÷ ³ó¾÷ ±â¼ú, ûÁ¤¿¡³ÊÁö ½Ã½ºÅÛ, ÀεµÀû ·Îº¿ °øÇÐÀÇ ÇÁ·ÎÅäŸÀÌÇο¡ ÁßÁ¡À» µÐ Çмú ¿¬±¸½Ç¿¡¼­ ¿ÀÇ ¼Ò½º ·¹ÆÛ·±½º µðÀÚÀεµ Á¡Á¡ ´õ Ȱ¹ßÇØÁö°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¼³°è ³ëÇÏ¿ìÀÇ ¹ÎÁÖÈ­·Î ÀÎÇØ Çϵå¿þ¾î Áý¾àÀûÀÎ ¿µ¿ª¿¡ ÁøÀÔÇÏ¿© Çõ½ÅÀ» ÀÏÀ¸Å³ ¼ö ÀÖ´Â ÀÎÀç°¡ ÀçÆíµÇ°í ÀÖ½À´Ï´Ù.

·¹ÆÛ·±½º µðÀÚÀÎ ¼¼°è ½ÃÀå ¼ºÀå ¿øµ¿·ÂÀº?

·¹ÆÛ·±½º µðÀÚÀÎ ½ÃÀåÀÇ ¼ºÀåÀº ¹ÝµµÃ¼ °ø±Þ¸Á, ÀÓº£µðµå ½Ã½ºÅÛ ¼³°è ¹æ¹ý·Ð, ¼öÁ÷Àû ¾ÖÇø®ÄÉÀÌ¼Ç ¿ä±¸»çÇ×ÀÇ ±¸Á¶Àû º¯È­·Î ÀÎÇÑ °ÍÀÔ´Ï´Ù. ÄÄÆ÷³ÍÆ®ÀÇ º¹À⼺, µðÀÚÀÎ À©µµ¿ìÀÇ Ãà¼Ò, ±â´É ÅëÇÕÀÇ ¹ßÀüÀ¸·Î ·¹ÆÛ·±½º µðÀÚÀÎÀº ÇÁ·ÎÁ§Æ®ÀÇ ¸®½ºÅ©¸¦ ÁÙÀ̰í ù ¹øÂ° °æ·Î¿¡¼­ ¼º°øÀ» º¸ÀåÇÏ´Â µ¥ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸® Àâ¾Ò½À´Ï´Ù. OEMÀÌ °³¹ß ¿À¹öÇìµå¸¦ ÁÙÀ̸鼭 Â÷º°È­µÈ Á¦Ç°À» Á¦°øÇϱâ À§ÇØ »çÀü °ËÁõµÈ ½Ã½ºÅÛ ¾ÆÅ°ÅØÃ³¿¡ ´ëÇÑ ¼ö¿ä´Â Áö¼ÓÀûÀ¸·Î Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

½º¸¶Æ® ÀÎÇÁ¶ó, ÀÚÀ²ÁÖÇà ¸ðºô¸®Æ¼, 5G Áö¿ø ¾ÖÇø®ÄÉÀ̼ÇÀÇ È®´ë´Â 5G µµÀÔÀ» ´õ¿í °¡¼ÓÈ­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÃÖÁ¾ ½ÃÀå¿¡¼­´Â ½Å¼ÓÇÑ ÇÁ·ÎÅäŸÀÌÇÎ, ¿¡³ÊÁö ÃÖÀûÈ­, ½Ç½Ã°£ ¼º´É °ËÁõ µîÀÌ ¿ä±¸µÇ¸ç, ·¹ÆÛ·±½º µðÀÚÀÎÀº ÀÌ ¸ðµç °ÍÀ» È®Àå °¡´ÉÇÑ ÇÁ·¹ÀÓ¿öÅ©¸¦ ÅëÇØ Áö¿øÇÕ´Ï´Ù. ¶ÇÇÑ, Ä¿³ØÆ¼µå µð¹ÙÀ̽ºÀÇ »çÀ̹ö º¸¾È°ú Æß¿þ¾î ³»°áÇÔ¼ºÀÌ Áß¿äÇØÁö¸é¼­ º¸¾È ºÎÆÃ, ¾Ïȣȭ ½ºÅ丮Áö, OTA ÆÐÄ¡ µî °ËÁõµÈ ·¹ÆÛ·±½º µðÀÚÀÎÀÇ ¸Å·ÂÀÌ ´õ¿í ºÎ°¢µÇ°í ÀÖ½À´Ï´Ù.

¼ÒÇÁÆ®¿þ¾î Á¤ÀÇ(Software-Defined) Çϵå¿þ¾î¿Í ¸ðµâÇü °³¹ß ŰƮ¿¡ ´ëÇÑ ±¤¹üÀ§ÇÑ Ãß¼¼´Â Ĩ Á¦Á¶¾÷ü, ¸ðµâ °ø±Þ¾÷ü, Ŭ¶ó¿ìµå ¼­ºñ½º Á¦°ø¾÷ü °£ÀÇ °­·ÂÇÑ ÆÄÆ®³Ê½ÊÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¿ÀÇ ¼Ò½º Çϵå¿þ¾î¿Í µðÁöÅÐ Æ®À©ÀÌ °è¼Ó ºÎ»óÇϰí ÀÖ´Â °¡¿îµ¥, ·¹ÆÛ·±½º µðÀÚÀÎÀº º£Å×¶û ¿£Áö´Ï¾î»Ó¸¸ ¾Æ´Ï¶ó ½ºÅ¸Æ®¾÷, Á¦Á¶¾÷ü, ÇÐ°è ¿¬±¸Àڵ鿡°Ôµµ Çõ½ÅÀ» ½ÇÇöÇÒ ¼ö ÀÖ´Â Á¸Àç°¡ µÇ°í ÀÖ½À´Ï´Ù. ÀÌó·³ ·¹ÆÛ·±½º µðÀÚÀÎ ¼¼°è ½ÃÀåÀº Áö¼ÓÀûÀÌ°í ´Ù¾çÇÑ ¼ºÀåÀ» °ÅµìÇϰí ÀÖ½À´Ï´Ù.

ºÎ¹®

Á¦Ç° À¯Çü(Çϵå¿þ¾î ·¹ÆÛ·±½º µðÀÚÀÎ, ¼ÒÇÁÆ®¿þ¾î ·¹ÆÛ·±½º µðÀÚÀÎ, ½Ã½ºÅÛ ·¹º§ ·¹ÆÛ·±½º µðÀÚÀÎ), ¾÷Á¾º°(ÀÚµ¿Â÷ ¾÷°èº°, °¡ÀüÁ¦Ç° ¾÷°èº°, »ê¾÷ ¾÷°èº°, ÇコÄÉ¾î ¾÷°èº°, Ç×°ø¿ìÁÖ ¹× ¹æÀ§ ¾÷°èº°)

Á¶»ç ´ë»ó ±â¾÷ »ç·Ê

AI ÅëÇÕ

¿ì¸®´Â °ËÁõµÈ Àü¹®°¡ ÄÁÅÙÃ÷¿Í AI ÅøÀ» ÅëÇØ ½ÃÀå Á¤º¸¿Í °æÀï Á¤º¸¸¦ Çõ½ÅÇϰí ÀÖ½À´Ï´Ù.

Global Industry Analysts´Â LLM ¹× ¾÷°è °íÀ¯ÀÇ SLMÀ» Á¶È¸ÇÏ´Â ÀϹÝÀûÀÎ ±Ô¹üÀ» µû¸£´Â ´ë½Å ºñµð¿À ±â·Ï, ºí·Î±×, °Ë»ö ¿£Áø Á¶»ç, ¹æ´ëÇÑ ¾çÀÇ ±â¾÷, Á¦Ç°/¼­ºñ½º, ½ÃÀå µ¥ÀÌÅÍ µî ¼¼°è Àü¹®°¡·ÎºÎÅÍ ¼öÁýÇÑ ÄÁÅÙÃ÷ ¸®Æ÷ÁöÅ丮¸¦ ±¸ÃàÇß½À´Ï´Ù.

°ü¼¼ ¿µÇâ °è¼ö

Global Industry Analysts´Â º»»ç ¼ÒÀçÁö, Á¦Á¶°ÅÁ¡, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±âÁØÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È­¸¦ ¿¹ÃøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ¸ÅÃâ¿ø°¡(COGS) Áõ°¡, ¼öÀͼº Ç϶ô, °ø±Þ¸Á ÀçÆí µî ¹Ì½ÃÀû, °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼­µµ ƯÈ÷ °æÀï»çµé¿¡°Ô ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¸ñÂ÷

Á¦1Àå Á¶»ç ¹æ¹ý

Á¦2Àå ÁÖ¿ä ¿ä¾à

Á¦3Àå ½ÃÀå ºÐ¼®

Á¦4Àå °æÀï

KSM
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

Global Reference Designs Market to Reach US$46.6 Billion by 2030

The global market for Reference Designs estimated at US$26.4 Billion in the year 2024, is expected to reach US$46.6 Billion by 2030, growing at a CAGR of 9.9% over the analysis period 2024-2030. Hardware Reference Designs, one of the segments analyzed in the report, is expected to record a 8.3% CAGR and reach US$25.3 Billion by the end of the analysis period. Growth in the Software Reference Designs segment is estimated at 12.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$7.2 Billion While China is Forecast to Grow at 13.3% CAGR

The Reference Designs market in the U.S. is estimated at US$7.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$9.4 Billion by the year 2030 trailing a CAGR of 13.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 7.3% and 8.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.7% CAGR.

Global Reference Designs Market - Key Trends & Drivers Summarized

How Are Reference Designs Transforming Hardware Development Ecosystems?

Reference designs have become a cornerstone of hardware innovation, especially in sectors where time-to-market, regulatory compliance, and component integration complexity pose major bottlenecks. These pre-validated blueprints-typically provided by semiconductor companies and original design manufacturers (ODMs)-include tested schematics, layout files, bills of materials (BoMs), firmware, and even performance benchmarks. Their utility lies in reducing development cycles and enabling OEMs and ODMs to accelerate prototyping, especially in fast-evolving markets like IoT, automotive electronics, edge computing, and 5G infrastructure.

Reference designs are particularly critical when working with complex system-on-chip (SoC) or mixed-signal environments, where signal integrity, thermal management, and power optimization are paramount. Rather than starting from scratch, developers use these designs to ensure compatibility with specific chipsets, sensors, memory architectures, and power supply units. This reduces design iterations, lowers failure risks, and helps meet stringent timelines for product launches. They also support rapid regulatory pre-compliance testing, thereby reducing overall time and cost burdens during certification for CE, FCC, or automotive standards like ISO 26262.

Which Application Areas and Industries Are Benefiting Most from Reference Designs?

The use of reference designs spans a wide array of sectors, each leveraging them to meet specific market or regulatory demands. In the consumer electronics sector, they facilitate faster development of smartphones, wearables, and smart home devices, where integration of wireless connectivity, power management ICs (PMICs), and display drivers is essential. OEMs in this domain rely on reference designs to ensure optimized battery life, signal strength, and thermal performance while staying ahead of design cycles.

In the automotive industry, reference designs are widely employed for advanced driver-assistance systems (ADAS), electric vehicle (EV) battery management systems, in-vehicle infotainment (IVI), and telematics. These subsystems demand robust compliance with safety and EMC (electromagnetic compatibility) standards, which reference designs address by offering pre-certified layouts and tested component selections. Similarly, the industrial automation sector utilizes reference designs for programmable logic controllers (PLCs), motor drivers, sensors, and industrial communication modules. Even in medical device development, where time-to-certification can delay commercialization, reference designs help accelerate the path to FDA or EU MDR approvals for Class I and Class II devices.

How Are Reference Designs Evolving to Support Next-Generation Platforms and Development Models?

Modern reference designs are not just static documents; they are dynamic, modular platforms supported by software tools, simulation environments, and cloud-based collaboration interfaces. With the increasing complexity of embedded systems and multi-core processors, developers now demand end-to-end design ecosystems. Semiconductor manufacturers are responding with reference design packages that include real-time development kits, firmware updates, security patches, and cloud integration for remote debugging or OTA updates.

One key trend is the modularization of reference designs to support configuration flexibility across end-user SKUs. This allows hardware developers to scale across performance or form factor requirements without needing to re-engineer the entire system. Additionally, AI and ML accelerators are now being embedded into reference designs for edge inference applications-especially in smart cameras, industrial vision systems, and voice-controlled devices. Cloud-connected reference designs enable synchronized data collection and algorithm training loops, helping developers implement edge-to-cloud workflows faster.

Software development kits (SDKs) and middleware libraries bundled with reference designs are increasingly tailored for popular platforms such as Android, RTOS, Linux, and Windows IoT. Open-source reference designs are also gaining momentum, especially in academic and research labs focused on prototyping for agriculture tech, clean energy systems, or humanitarian robotics. This democratization of design expertise is reshaping who can enter and innovate within hardware-intensive domains.

What Is Driving the Growth of the Global Reference Designs Market?

The growth in the reference designs market is driven by several structural shifts across the semiconductor supply chain, embedded system design practices, and vertical-specific application requirements. Increasing component complexity, combined with shrinking design windows and growing functional integration, has made reference designs indispensable for reducing project risk and ensuring first-pass success. As OEMs aim to deliver differentiated products while reducing development overhead, demand for pre-validated system architectures continues to rise.

The expansion of smart infrastructure, autonomous mobility, and 5G-enabled applications is further accelerating adoption. These end-markets require rapid prototyping, energy optimization, and real-time performance validation-all of which reference designs support through scalable frameworks. Additionally, growing emphasis on cybersecurity and firmware resilience in connected devices has increased the appeal of reference designs pre-tested for secure boot, encrypted storage, and OTA patching.

The broader trend toward software-defined hardware and modular development kits is fostering strong partnerships between chipmakers, module vendors, and cloud service providers. As open-source hardware and digital twins continue to gain ground, reference designs are becoming an enabler of innovation not only for seasoned engineers but also for startups, makers, and academic researchers. These converging forces point to sustained and diversified growth in the global reference designs market.

SCOPE OF STUDY:

The report analyzes the Reference Designs market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (Hardware Reference Designs, Software Reference Designs, System-level Reference Designs); Vertical (Automotive Vertical, Consumer Electronics Vertical, Industrial Vertical, Healthcare Vertical, Aerospace & Defense Vertical)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 47 Featured) -

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â