리서치사:Market Glass, Inc. (Formerly Global Industry Analysts, Inc.)
발행일:2024년 04월
페이지 정보:영문 488 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계의 반도체 첨단 패키징 시장은 2030년까지 680억 달러에 도달
2023년에 384억 달러로 추정되는 세계의 반도체 첨단 패키징 시장은 2023-2030년 CAGR 7.4%로 성장하며, 2030년에는 680억 달러에 달할 것으로 예측됩니다. 본 리포트에서 분석한 부문의 하나인 플립칩 패키징은 CAGR 7%를 기록하며, 분석 기간 종료까지 491억 달러에 달할 것으로 예측됩니다. 2.5D/3D 패키징 부문의 성장은 향후 8년간 CAGR이 9.6%로 추정됩니다.
미국 시장은 35억 달러, 중국은 CAGR 8.5%로 성장할 것으로 예측
미국의 반도체 첨단 패키징 시장은 2023년에는 35억 달러로 추정됩니다. 세계 2위의 경제대국인 중국은 2023-2030년의 분석 기간에 CAGR 8.5%로 추이하며, 2030년까지 예측 시장 규모는 199억 달러에 달할 것으로 예측됩니다. 기타 주목할 만한 지역 시장으로는 일본과 캐나다가 있으며, 각각 2023-2030년 5.2%와 6.1%의 성장이 예측됩니다. 유럽에서는 독일이 CAGR 약 5.4%로 성장할 것으로 예측되고 있습니다.
2024년을 향한 익사이팅한 신리포트 기능 소개
인플루언서 관여 통계에 대한 풀 액세스
디지털 아카이브와 'MarketGlass' 조사 플랫폼에 무료로 액세스하세요. Global Industry Analysts, Inc.의 독자적인 MarketGlass 플랫폼은 전 세계 전문가의 창조성과 시장 지식을 통합적 및 협업적으로 발산할 수 있습니다. Global Industry Analysts, Inc.의 최첨단 툴은 시장 참여 기업의 프라이버시와 ID를 보호하면서 세계 클래스의 시장 전망을 가져옵니다. 리포트의 수치, 통계, 시장에 관한 설명은 이 분야의 전문가 및 영향력 있는 사람들에 의해 공유된, 완전하게 엄선된 인사이트에 기반하고 있습니다.
실시간 데이터 시뮬레이터 툴 및 맞춤형 리포트 작성 기능을 갖춘 인터랙티브 앙케이트에 참가할 수 있습니다.
기업간 스마트한 의견교환을 위한 피어 협업·인터랙티브 플랫폼에 대한 풀 클라이언트 액세스
1년간의 무료 리포트 업데이트
주요 기업의 세계 시장 점유율을 포함한 경쟁 커버리지
복수 지역에 걸친 기업의 시장 입지 분석(호조/활발/니치/마이너)
전문가/인플루언서 인터뷰, 팟캐스트, 프레스 발표, 이벤트 기조 강연의 YouTube 비디오에 대한 액세스
2024년 세계 경제에 기대하는 것
금융긴축과 이에 따른 금리 상승에 의해 발생하는 지정학적, 경제적 불안정성이 2024년 격동의 상황을 조성할 것입니다. 중동에서의 적대 행위 및 더욱 더 빈발하는 기후 재해 등 몇개의 요인이 회복 경로에 계속 압력을 가할 것입니다. 리스크의 한편에서 디스인플레이션의 징후가 강해지고, 완고한 인플레이션에 대한 불안이 완화되고, 공급망이 정상화하고, 에너지 비용의 변동에도 불구하고 물가가 완만해지는 등 몇개의 긍정적인 요소도 구체화하고 있습니다. 인도 및 미국을 비롯한 G21 국가의 선거는 자본 흐름 및 투자 전략에 영향을 미칠 가능성이 있습니다. 인도가 세계 투자처로서 주목받는 한편, 미국을 기반으로 하는 하이테크 기업은 재능과 자본의 역동적인 에코시스템에 의해 지원되어 계속 우위를 유지할 것입니다. 실리콘밸리를 비롯한 하이테크 기회는 국내 경제가 감속하고 있다고는 해도 안정적이고, 규제 환경도 정비되어 있으므로 고성장 가능성을 요구하는 투자자에게 계속 매력적입니다. 유럽은 금융긴축정책과 경기후퇴 리스크와의 싸움이 계속되나, 영국은 전망이 가장 어려우며, 2024년 경기후퇴 리스크가 가장 높습니다. 중국은 정부지출과 개인소비의 개선에 힘입어 성장이 기대되며 계속 와일드 카드로 남아 있습니다. 불안정한 환경은 투자자에게도 기업에도 기회와 과제 둘 다 제공할 것입니다. 성장에 대한 촉매로서 변동성을 수용하고 투자 판단 시행에서 민첩성과 전략적 선견성은 생존을 위해 여전히 중요할 것입니다.
조사 대상 기업의 예
Advanced Micro Devices, Inc.
Applied Materials, Inc.
Avery Dennison Corporation
Amkor Technology, Inc.
Advantest Corporation
Brewer Science, Inc.
American Semiconductor, Inc.
ASM Pacific Technology Ltd.
ASE Technology Holding Co., Ltd.
AT & S Austria Technologie & Systemtechnik AG
BE Semiconductor Industries N.V.
Amtech Microelectronics, Inc.
APSTL
Boschman Technologies
ASE Korea
목차
제1장 조사 방법
제2장 주요 요약
시장 개요
주요 기업
시장 동향과 촉진요인
세계 시장의 전망
제3장 시장 분석
미국
캐나다
일본
중국
유럽
프랑스
독일
이탈리아
영국
기타 유럽
아시아태평양
한국
대만
기타 아시아태평양
세계의 기타 지역
제4장 경쟁
KSA
영문 목차
영문목차
Global Semiconductor Advanced Packaging Market to Reach $68 Billion by 2030
The global market for Semiconductor Advanced Packaging estimated at US$38.4 Billion in the year 2023, is expected to reach US$68 Billion by 2030, growing at a CAGR of 7.4% over the period 2023-2030. Flip Chip Packaging, one of the segments analyzed in the report, is expected to record 7% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5D/3D Packaging segment is estimated at 9.6% CAGR for the next 8-year period.
The U.S. Market is Estimated at $3.5 Billion, While China is Forecast to Grow at 8.5% CAGR
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.5 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 8.5% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.2% and 6.1% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR.
Introducing Our Exciting New Report Features for 2024
Full access to influencer engagement stats
Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
Complimentary report updates for one year
Competitor coverage with global market shares of major players
Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes
What to Expect from the Global Economy in 2024
Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.
Select Competitors (Total 109 Featured) -
Advanced Micro Devices, Inc.
Applied Materials, Inc.
Avery Dennison Corporation
Amkor Technology, Inc.
Advantest Corporation
Brewer Science, Inc.
American Semiconductor, Inc.
ASM Pacific Technology Ltd.
ASE Technology Holding Co., Ltd.
AT & S Austria Technologie & Systemtechnik AG
BE Semiconductor Industries N.V.
Amtech Microelectronics, Inc.
APSTL
Boschman Technologies
ASE Korea
TABLE OF CONTENTS
I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Competitive Scenario
Semiconductor Supply Chain Transitions at Various Levels
Financial Performances of Packaging Suppliers Reveals New Growth Players
Implications of Chiplets & Related Designs for Advanced Packaging
Solving Lithography Challenges
Warped Wafer Processing
UBM/RDL and PR Strip Challenges
UBM/RDL Etch
Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
Vulnerabilities for WBG Power Semiconductors
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 2: World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 3: World 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
TABLE 4: World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 5: World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 6: World 16-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 7: World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 8: World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 9: World 16-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 10: World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 11: World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 12: World 16-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 13: World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 14: World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 15: World 16-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 18: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 19: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 20: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 21: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 22: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 23: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 24: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 25: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 26: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 27: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 29: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 30: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 31: World Semiconductor Advanced Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
III. MARKET ANALYSIS
UNITED STATES
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
TABLE 32: USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 33: USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 34: USA 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 35: USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 36: USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 37: USA 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
CANADA
TABLE 38: Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 39: Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 40: Canada 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 41: Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 42: Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 43: Canada 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
JAPAN
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
TABLE 44: Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 45: Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 46: Japan 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 47: Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 48: Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 49: Japan 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
CHINA
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
TABLE 50: China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 51: China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 52: China 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 53: China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 54: China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 55: China 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
EUROPE
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
TABLE 56: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 57: Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 58: Europe 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
TABLE 59: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 60: Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 61: Europe 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 62: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 63: Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 64: Europe 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
FRANCE
TABLE 65: France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 66: France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 67: France 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 68: France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 69: France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 70: France 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
GERMANY
TABLE 71: Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 72: Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 73: Germany 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 74: Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 75: Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 76: Germany 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
ITALY
TABLE 77: Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 78: Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 79: Italy 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 80: Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 81: Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 82: Italy 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
UNITED KINGDOM
TABLE 83: UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 84: UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 85: UK 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 86: UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 87: UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 88: UK 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF EUROPE
TABLE 89: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 90: Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 91: Rest of Europe 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 93: Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 94: Rest of Europe 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
ASIA-PACIFIC
Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
TABLE 95: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 96: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 97: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 99: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 100: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 102: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 103: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
SOUTH KOREA
TABLE 104: South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 105: South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 106: South Korea 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 107: South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 108: South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 109: South Korea 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
TAIWAN
TABLE 110: Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 111: Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 112: Taiwan 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 113: Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 114: Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 115: Taiwan 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF ASIA-PACIFIC
TABLE 116: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 117: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 118: Rest of Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 119: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 120: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 121: Rest of Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF WORLD
TABLE 122: Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 123: Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 124: Rest of World 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
TABLE 125: Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 126: Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 127: Rest of World 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
