리서치사:Market Glass, Inc. (Formerly Global Industry Analysts, Inc.)
발행일:2024년 04월
페이지 정보:영문 338 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계의 3D TSV 디바이스 시장은 2030년까지 277억 달러에 달할 전망
2023년에 71억 달러로 추정되는 세계의 3D TSV 디바이스 시장은 2023-2030년 18.5%의 CAGR로 성장하며, 2030년에는 277억 달러에 달할 것으로 예측됩니다. 3D TSV 디바이스 리포트에서 분석한 부문의 하나인 메모리는 CAGR 17.9%를 기록하며, 분석 기간 종료까지 80억 달러에 달할 것으로 예측됩니다. MEMS 분야의 성장은 향후 8년간 CAGR이 19.5%로 예측됩니다.
미국 시장은 11억 달러로 추정, 중국은 CAGR 21.6%로 성장 예측
미국의 3D TSV 디바이스 시장은 2023년에는 11억 달러로 추정됩니다. 세계 2위의 경제대국인 중국은 2023-2030년의 분석 기간에 CAGR 21.6%로 추이하며, 2030년까지 84억 달러의 시장 규모에 달할 것으로 예측되고 있습니다. 기타 주목할 만한 지역 시장으로는 일본과 캐나다가 있으며, 각각 2023-2030년 14%와 15.4%의 성장이 예측됩니다. 유럽에서는 독일이 CAGR 약 14.1%로 성장할 것으로 예측되고 있습니다.
2024년을 향한 익사이팅한 신리포트 기능 소개
인플루언서 관여 통계에 대한 풀 액세스
디지털 아카이브와 'MarketGlass' 조사 플랫폼에 무료로 액세스하세요. Global Industry Analysts, Inc.의 독자적인 MarketGlass 플랫폼은 전 세계 전문가의 창조성과 시장 지식을 통합적 및 협업적으로 발산할 수 있습니다. Global Industry Analysts, Inc.의 최첨단 툴은 시장 참여 기업의 프라이버시와 ID를 보호하면서 세계 클래스의 시장 전망을 가져옵니다. 리포트의 수치, 통계, 시장에 관한 설명은 이 분야의 전문가 및 영향력 있는 사람들에 의해 공유된, 완전하게 엄선된 인사이트에 기반하고 있습니다.
실시간 데이터 시뮬레이터 툴 및 맞춤형 리포트 작성 기능을 갖춘 인터랙티브 앙케이트에 참가할 수 있습니다.
기업간 스마트한 의견교환을 위한 피어 협업·인터랙티브 플랫폼에 대한 풀 클라이언트 액세스
1년간의 무료 리포트 업데이트
주요 기업의 세계 시장 점유율을 포함한 경쟁 커버리지
복수 지역에 걸친 기업의 시장 입지 분석(호조/활발/니치/마이너)
전문가/인플루언서 인터뷰, 팟캐스트, 보도 발표, 이벤트 기조 강연의 YouTube 비디오에 대한 액세스
2024년 세계 경제에 기대하는 것
금융긴축과 이에 따른 금리 상승에 의해 발생하는 지정학적, 경제적 불안정성이 2024년 격동의 상황을 조성할 것입니다. 중동에서의 적대 행위 및 더욱 더 빈발하는 기후 재해 등 몇개의 요인이 회복 경로에 계속 압력을 가할 것입니다. 리스크의 한편에서 디스인플레이션의 징후가 강해지고, 완고한 인플레이션에 대한 불안이 완화되고, 공급망이 정상화하고, 에너지 비용의 변동에도 불구하고 물가가 완만해지는 등 몇개의 긍정적인 요소도 구체화하고 있습니다. 인도 및 미국을 비롯한 G21 국가의 선거는 자본 흐름 및 투자 전략에 영향을 미칠 가능성이 있습니다. 인도가 세계 투자처로서 주목받는 한편, 미국을 기반으로 하는 하이테크 기업은 재능과 자본의 역동적인 에코시스템에 의해 지원되어 앞으로도 우위를 유지할 것입니다. 실리콘밸리를 비롯한 하이테크 기회는 국내 경제가 감속하고 있다고는 해도 안정적이고, 규제 환경도 정비되어 있으므로 고성장 가능성을 요구하는 투자자에게 계속 매력적입니다. 유럽은 금융긴축정책과 경기후퇴 리스크와의 싸움이 계속되나, 영국은 전망이 가장 어려우며, 2024년 경기후퇴 리스크가 가장 높습니다. 중국은 정부지출과 개인소비의 개선에 힘입어 성장이 기대되며 계속 와일드 카드로 남아 있습니다. 불안정한 환경은 투자자에게도 기업에도 기회와 과제 둘 다 제공할 것입니다. 성장에 대한 촉매로서 변동성을 수용하고 민첩성과 전략적 선견성을 가지고 투자 판단을 시행하는 것이 생존을 위해 여전히 중요할 것입니다.
조사 대상 기업의 예
IBM Corporation
Dai Nippon Printing Co., Ltd.
Amkor Technology, Inc.
ASM Pacific Technology Ltd.
Globalfoundries, Inc.
Himax Technologies, Inc.
ASE Technology Holding Co., Ltd.
FRT GmbH
GS Nanotech
GalaxyCore Inc.
Gpixel, Inc.
Heliotis AG
Hill Technical Sales Corporation
CORIAL
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
목차
제1장 조사 방법
제2장 주요 요약
시장 개요
주요 기업
시장 동향과 촉진요인
제품의 개요
세계 시장의 전망
제3장 시장 분석
미국
캐나다
일본
중국
유럽
프랑스
독일
이탈리아
영국
기타 유럽
아시아태평양
세계의 기타 지역
제4장 경쟁
KSA
영문 목차
영문목차
Global 3D TSV Devices Market to Reach $27.7 Billion by 2030
The global market for 3D TSV Devices estimated at US$7.1 Billion in the year 2023, is expected to reach US$27.7 Billion by 2030, growing at a CAGR of 18.5% over the period 2023-2030. 3D TSV Devices Memory, one of the segments analyzed in the report, is expected to record 17.9% CAGR and reach US$8 Billion by the end of the analysis period. Growth in the MEMS segment is estimated at 19.5% CAGR for the next 8-year period.
The U.S. Market is Estimated at $1.1 Billion, While China is Forecast to Grow at 21.6% CAGR
The 3D TSV Devices market in the U.S. is estimated at US$1.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$8.4 Billion by the year 2030 trailing a CAGR of 21.6% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 14% and 15.4% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 14.1% CAGR.
Introducing Our Exciting New Report Features for 2024
Full access to influencer engagement stats
Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
Complimentary report updates for one year
Competitor coverage with global market shares of major players
Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes
What to Expect from the Global Economy in 2024
Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.
Select Competitors (Total 68 Featured) -
IBM Corporation
Dai Nippon Printing Co., Ltd.
Amkor Technology, Inc.
ASM Pacific Technology Ltd.
Globalfoundries, Inc.
Himax Technologies, Inc.
ASE Technology Holding Co., Ltd.
FRT GmbH
GS Nanotech
GalaxyCore Inc.
Gpixel, Inc.
Heliotis AG
Hill Technical Sales Corporation
CORIAL
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
TABLE OF CONTENTS
I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
3D TSV Devices - Global Key Competitors Percentage Market Share in 2023 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
A Prelude to 3D TVS
Comparison of 3D TSV with Other 3D IC Integration Technologies: A Snapshot
Global Market Prospects & Outlook
Regional Analysis
Competitive Scenario
Foundries Stay Ahead in 3D TSV Device Manufacturing
IDMs Include 3D TSV Technology in their Wafer Processing Units
OSAT Companies Vie for Place in 3D TSV Landscape
Advantages & Limitations for Foundries, IDMs, and OSATs Operating in 3D TSV Landscape: A Snapshot
Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
3D TSV Devices Market Strongly Influenced by Trends in Consumer Electronics Sector
Post Pandemic Recovery in CE Sector to Augment Prospects
Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
A Review of Key CE Products Driving Adoption of 3D TSV Technology
Smartphones
Tablet PCs
Uptrend in 3D IC Technology Augments Business Case
Fast Evolving 3D IC Technology to Spur Demand
Digital Transformation Drive to Steer Future Growth of 3D TSV Market
Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
IoT Ecosystem to Rev Up Opportunities for 3D TSV Devices
Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
AI Hardware: Potential New Growth Avenue
Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
Automobile Electronification Trends Widen the Addressable Market
Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
Post COVID Recovery to Revive Opportunities in Aerospace Sector
Sustained High Growth in ICT Sector Augurs Well
Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices
Key Benefits Driving Adoption of Cloud Services of Large, Medium and Small Businesses
Growing Performance Requirements of Modern Data Centers to Extend Opportunities for 3D TSV Devices
Data Center Traffic Trends: A Complementary Review
3D TSV Gaining Traction in DRAM Memory Sector
A Review of Next-Generation TSV-based DRAM Memory Solutions
Mobile DRAM - LPDDR3 Vs. Wide IO
Growing Market for MEMS to Fuel Market Expansion
Wearable Devices to Extend High-Quality Opportunities
3D TSV Devices Sense large Opportunities in CMOS Image Sensors Vertical
Use of CMOS Image Sensor (CIS) by Sector & Device/Equipment
Imaging & Optoelectronics: An Important End-Use Segment for 3D TSV
3D TSV Sees Growth in Advanced LED Packaging
3D WLCSP: A Mature 3D TSV Segment
DRIE Bosch Process Gaining Prominence in TSV Implementation
System-Level Exploration and 3D Floorplanning Technique Enhance Performance of 3D IC Devices
Demand for Innovative Databases and Wireless Routing Augment Market Demand
Issues
PRODUCT OVERVIEW
An Insight into Through-Silicon Via (TSV)
An Introduction to Through-silicon via (TSV) Devices
Benefits of 3D TSV Devices
Historical Timeline
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 2: World Historic Review for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 3: World 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2024 & 2030
TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 5: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 6: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 7: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 8: World Historic Review for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 9: World 15-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 10: World Recent Past, Current & Future Analysis for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 11: World Historic Review for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 12: World 15-Year Perspective for CMOS Image Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 13: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 14: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 15: World 15-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 16: World Recent Past, Current & Future Analysis for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 17: World Historic Review for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 18: World 15-Year Perspective for Advanced LED Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 19: World Recent Past, Current & Future Analysis for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 20: World Historic Review for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 21: World 15-Year Perspective for Other Products by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 22: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 23: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 24: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 25: World Recent Past, Current & Future Analysis for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 26: World Historic Review for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 27: World 15-Year Perspective for Information & Communication Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 28: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 29: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 30: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 31: World Recent Past, Current & Future Analysis for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 32: World Historic Review for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 33: World 15-Year Perspective for Military, Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 34: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 35: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 36: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
TABLE 37: World 3D TSV Devices Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
III. MARKET ANALYSIS
UNITED STATES
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
Demand for Performance-Rich Consumer Electronics Puts Focus on 3D TSV Devices
Demand for MEMS Technologies in Mobile & Automotive Sector to Create Opportunities for 3D TSV Devices
TABLE 38: USA Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 39: USA Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 40: USA 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 41: USA Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 42: USA Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 43: USA 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
CANADA
TABLE 44: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 45: Canada Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 46: Canada 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 47: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 48: Canada Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 49: Canada 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
JAPAN
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
Market Overview
TABLE 50: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 51: Japan Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 52: Japan 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 53: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 54: Japan Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 55: Japan 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
CHINA
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
Market Overview
TABLE 56: China Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 57: China Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 58: China 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 59: China Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 60: China Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 61: China 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
EUROPE
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
TABLE 62: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
TABLE 63: Europe Historic Review for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 64: Europe 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2024 & 2030
TABLE 65: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 66: Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 67: Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 68: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 69: Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 70: Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
FRANCE
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
TABLE 71: France Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 72: France Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 73: France 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 74: France Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 75: France Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 76: France 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
GERMANY
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
TABLE 77: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 78: Germany Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 79: Germany 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 80: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 81: Germany Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 82: Germany 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
ITALY
TABLE 83: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 84: Italy Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 85: Italy 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 86: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 87: Italy Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 88: Italy 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
UNITED KINGDOM
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
TABLE 89: UK Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 90: UK Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 91: UK 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 92: UK Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 93: UK Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 94: UK 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
REST OF EUROPE
TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 96: Rest of Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 97: Rest of Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 99: Rest of Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 100: Rest of Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
ASIA-PACIFIC
3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
South Korea
Taiwan
TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 102: Asia-Pacific Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 103: Asia-Pacific 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 105: Asia-Pacific Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 106: Asia-Pacific 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
REST OF WORLD
TABLE 107: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 108: Rest of World Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 109: Rest of World 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
TABLE 110: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
TABLE 111: Rest of World Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
TABLE 112: Rest of World 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
