리서치사:Market Glass, Inc. (Formerly Global Industry Analysts, Inc.)
발행일:2024년 04월
페이지 정보:영문 452 Pages
라이선스 & 가격 (부가세 별도)
한글목차
반도체 및 IC 패키징 재료 세계 시장, 2030년에는 728억 달러에 이를 전망
2023년에 334억 달러로 추정되는 반도체 및 IC 패키징 재료 세계 시장은 2023년부터 2030년까지 CAGR 10.2%로 성장하여 2030년에는 728억 달러에 달할 것으로 예측됩니다. 이 보고서에서 분석한 부문 중 하나인 유기 기판은 CAGR 11.1%를 기록하고, 분석기간 종료까지 220억 달러에 달할 것으로 예상됩니다. 본딩 와이어 부문의 성장은 향후 8년간 CAGR이 12%로 추정됩니다.
미국 시장은 21억 달러, 중국은 CAGR 11.9%로 성장 예측
미국의 반도체 및 IC 패키징 재료 시장은 2023년에는 21억 달러가 될 것으로 추정됩니다. 세계 2위 경제 대국인 중국은 2030년까지 176억 달러의 시장 규모에 달할 것으로 예측되며, 분석기간 2023년부터 2030년까지 CAGR은 11.9%입니다. 기타 주목할 만한 지리적 시장으로는 일본과 캐나다가 있고, 각각 2023년부터 2030년까지 8.9%와 5.7%의 성장이 예측됩니다. 유럽에서는 독일이 CAGR 약 7.7%로 성장할 것으로 예측됩니다.
2024년에 새롭게 선보이는 흥미로운 보고서 기능 소개
인플루언서 참여 통계에 대한 풀 액세스
디지털 아카이브와 "MarketGlass" 조사 플랫폼에 무료로 액세스할 수 있습니다. MarketGlass 플랫폼은 전 세계 전문가들의 창의성과 시장 지식을 통합적이고 협력적으로 발휘할 수 있도록 지원합니다. 당사의 최첨단 도구는 시장 진입자의 프라이버시와 신원을 보호하면서 세계적 수준의 시장 전망을 제공합니다. 보고서의 수치, 통계 및 시장 설명은 이 분야의 전문가와 영향력 있는 사람들이 공유한 완전히 선별된 인사이트를 기반으로 합니다.
실시간 데이터 시뮬레이터 도구와 맞춤형 보고서 작성 기능을 갖춘 인터랙티브 설문 조사에 참여할 수 있습니다.
기업 간 스마트한 의견 교환을 위한 피어 콜라보레이션 및 인터랙티브 플랫폼에 대한 풀 클라이언트 액세스
1년간 무료 보고서 업데이트
주요 기업의 세계 시장 점유율을 포함한 경쟁 커버리지
여러 지역에 걸친 기업의 시장 입지 분석(호조/활발/틈새/마이너)
전문가/인플루언서 인터뷰, 팟캐스트, 언론 발표, 행사 기조연설 유튜브 영상에 대한 접근성
2024년 세계 경제에서 기대할 수 있는 것들
통화 긴축과 이에 따른 금리 상승으로 인한 지정학적, 경제적 불안정성이 2024년에도 격변의 시기를 만들어 낼 것으로 보입니다. 중동의 적대 행위와 점점 더 잦아지는 기후 재해 등 여러 요인들이 경기 회복에 대한 압력을 계속 가할 것으로 보입니다. 위험요인이 있는 반면, 디플레이션의 조짐이 강해지고, 완고한 인플레이션에 대한 불안감이 완화되고, 공급망이 정상화되고, 에너지 비용의 변동에도 불구하고 물가가 완만하게 상승하는 등 몇 가지 긍정적인 요소도 나타나고 있습니다. 인도와 미국을 비롯한 G21 국가들의 선거는 자본의 흐름과 투자 전략에 영향을 미칠 수 있습니다. 인도가 세계 투자처로 주목받고 있는 가운데, 미국에 기반을 둔 하이테크 기업들은 역동적인 인재와 자본 생태계에 힘입어 계속 우위를 점할 것으로 보입니다. 실리콘밸리를 비롯한 하이테크 기회는 국내 경제가 둔화되긴 했지만 여전히 견고하고 규제 환경이 잘 정비되어 있어 높은 성장 잠재력을 추구하는 투자자들에게 여전히 매력적일 것으로 보입니다. 유럽은 긴축정책과 경기침체 리스크와의 싸움이 계속되고 있지만, 영국은 2024년 경기침체 리스크가 가장 높은 국가로 전망이 가장 어둡습니다. 중국은 정부 지출과 개인 소비 개선에 힘입어 성장세를 이어갈 것으로 예상되는 와일드카드가 될 것입니다. 불안정한 환경은 투자자와 기업 모두에게 기회와 도전을 동시에 가져다 줄 것으로 보입니다. 변동성을 성장의 촉매제로 받아들이고, 민첩한 투자 판단과 전략적 선견지명이 생존을 위한 핵심 요소라는 점은 변함이 없습니다.
조사 대상 기업 사례
BASF SE
3M Company
Analog Devices, Inc.
Amkor Technology, Inc.
ams AG
Atotech Deutschland GmbH
Canatu Oy
Adtech Ceramics
Carsem(M) Sdn. Bhd.
Ceramtec GmbH
Chaozhou Three-Circle(Group) Co., Ltd.
AMETEK Electronic Components & Packaging
Chipbond Technology Corporation
California Fine Wire Co.
Amtech Microelectronics, Inc.
목차
제1장 조사 방법
제2장 주요 요약
시장 개요
주요 기업
시장 동향과 성장 촉진요인
세계 시장 전망
제3장 시장 분석
미국
캐나다
일본
중국
유럽
프랑스
독일
이탈리아
영국
기타 유럽
아시아태평양
한국
대만
기타 아시아태평양
세계 기타 지역
제4장 경쟁
KSM
영문 목차
영문목차
Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030
The global market for Semiconductor and IC Packaging Materials estimated at US$33.4 Billion in the year 2023, is expected to reach US$72.8 Billion by 2030, growing at a CAGR of 10.2% over the period 2023-2030. Organic Substrates, one of the segments analyzed in the report, is expected to record 11.1% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 12% CAGR for the next 8-year period.
The U.S. Market is Estimated at $2.1 Billion, While China is Forecast to Grow at 11.9% CAGR
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$2.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 8.9% and 5.7% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 7.7% CAGR.
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Full access to influencer engagement stats
Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
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Competitor coverage with global market shares of major players
Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes
What to Expect from the Global Economy in 2024
Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.
As "Digitalization of Everything" Creeps Through Every Facet of Modern Life, Semiconductors the Lifeblood of the Whole Concept Becomes the Most Chased After Commodity
The Semiconductor Decade is on its Way Guided by the Digitalization Wave: Digital Transformation (DX) Spending of Business Practices, Products & Organization (In US$ Billion) for Years 2021 Through 2025
Digital Transformation Across Networking & Communications, Data Processing, Industrial, Consumer Electronics, Automotive, Aerospace, Healthcare, Retail, Media & Entertainment Shapes a Robust Semiconductor Industry Vital to the Continued Evolution of Human Civilization: Global Semiconductor Industry (In US$ Billion) for Years 2022, 2024, 2026, 2028, and 2030
What's Ahead for Businesses & Markets?
Competition
Semiconductor and IC Packaging Materials - Global Key Competitors Percentage Market Share in 2023 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
As Global Chip Shortage Continues, It is Time to Review the Implications for Semiconductor Materials & Consumables
Rising Semiconductor Demand, Favorable Regulations & Robust Demand for Advanced Packaging Drives Growth of Packaging Materials
Roust Outlook for Semiconductor Advanced Packaging Technologies to Brighten Opportunities in the Upstream Packaging Materials Market: Global Semiconductor Advanced Packaging Market by Technology (In US$ Million) for Years 2022, 2024, and 2026
Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2022, 2024, 2026 & 2028
Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Market Growth
Growing Focus on AI Chip Development & Production Opens a Parallel Growth Avenue for Chip Packaging Materials: Global Market for AI Chips (In US$ Billion) for Years 2022, 2024, 2026, 2028 and 2030
Vehicle Electronification & Autonomous Driving to Bring the Automotive Industry Into the Spotlight as One of the Fastest Growing End-Uses Sector
The Exciting Journey Towards Autonomous Driving is Littered with Opportunities for Automotive Semiconductors: Global Autonomous Vehicle Sales (In Units) for Years 2022, 2024 & 2026
3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
Development New Packaging Technologies Bodes Well for Market Growth
IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
Growing Ecosystem of IoT Devices Bodes Well for IoT Hardware Including ICs/Chips & Modules: Global Number of IoT Connected Devices (In Billion) for Years 2015, 2017, 2019, 2021, 2023, and 2025
Connected Aircraft to Drive the Aerospace End-Use Industry's Appetite for Semiconductor Chips & Packaging Materials
Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Generation Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2021, 2025 & 2029
A Quick Review of Key Market Challenges
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Semiconductor and IC Packaging Materials Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 3: World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 4: World 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
TABLE 5: World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 6: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 7: World 16-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 9: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 10: World 16-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 11: World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 12: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 13: World 16-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 15: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 16: World 16-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 17: World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 18: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 19: World 16-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 21: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 22: World 16-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 23: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 24: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 25: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 27: World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 28: World 16-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 29: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 30: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 31: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
III. MARKET ANALYSIS
UNITED STATES
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
TABLE 38: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 39: USA Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 40: USA 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 41: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 42: USA Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 43: USA 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
CANADA
TABLE 44: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 45: Canada Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 46: Canada 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 47: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 48: Canada Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 49: Canada 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
JAPAN
TABLE 50: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 51: Japan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 52: Japan 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 53: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 54: Japan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 55: Japan 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
CHINA
TABLE 56: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 57: China Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 58: China 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 59: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 60: China Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 61: China 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
EUROPE
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
TABLE 62: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 63: Europe Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 64: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
TABLE 65: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 66: Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 67: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 68: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 69: Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 70: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
FRANCE
TABLE 71: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 72: France Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 73: France 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 74: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 75: France Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 76: France 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
GERMANY
TABLE 77: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 78: Germany Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 79: Germany 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 80: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 81: Germany Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 82: Germany 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
ITALY
TABLE 83: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 84: Italy Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 85: Italy 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 86: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 87: Italy Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 88: Italy 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
UNITED KINGDOM
TABLE 89: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 90: UK Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 91: UK 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 92: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 93: UK Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 94: UK 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF EUROPE
TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 96: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 97: Rest of Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 99: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 100: Rest of Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
ASIA-PACIFIC
Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 102: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 103: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 105: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 106: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 108: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 109: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
SOUTH KOREA
TABLE 110: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 111: South Korea Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 112: South Korea 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 113: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 114: South Korea Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 115: South Korea 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
TAIWAN
TABLE 116: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 117: Taiwan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 118: Taiwan 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 119: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 120: Taiwan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 121: Taiwan 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF ASIA-PACIFIC
TABLE 122: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 123: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 124: Rest of Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 125: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 126: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 127: Rest of Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
REST OF WORLD
TABLE 128: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 129: Rest of World Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 130: Rest of World 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
TABLE 131: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 132: Rest of World Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 133: Rest of World 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
