세계의 그린 및 지속가능한 일렉트로닉스 제조 시장(2024-2034년)

The Global Market for Green and Sustainable Electronics Manufacturing 2024-2034

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한글목차

전자 산업은 지난 수십 년 동안 큰 성장세를 보였고, 전자기기는 현대인의 생활에 없어서는 안 될 필수품이 되었습니다. 그러나 이러한 성장은 높은 에너지 소비, 자원 고갈, 전자폐기물(e-waste) 등 환경에 심각한 영향을 미치고 있습니다. 유엔에 따르면, 전자 폐기물은 전 세계에서 가장 빠르게 증가하고 있으며, 가장 위험한 폐기물 흐름이 되고 있습니다. 이에 따라 전자제품 제조를 보다 지속가능하고 친환경적으로 만들어야 할 필요성이 대두되고 있으며, 전자산업의 환경적 발자국을 줄이기 위한 접근법으로 '그린 일렉트로닉스(Green Electronics)'가 부상하고 있습니다.

지속가능한 PCB 설계의 개발은 최근 몇 년 동안 녹색 제조 추진의 일환으로 성장하고 있습니다. 전통적인 PCB 제조는 환경에 유해한 구리, 에폭시 수지, 유리 섬유 및 물을 사용하는 에너지 집약적이고 배출량이 많은 공정에 의존하고 있습니다. 재활용 기술은 효율이 낮고 번거로운 공정을 포함합니다.

재활용이 용이한 신소재가 활용되고 있으며, 생분해성 폴리머와 종이 PCB가 PCB 제조에 사용되고 있습니다. 기존 서브트랙티브 방식이나 잉크젯/레이저 인쇄와 같은 적층 제조를 위한 친환경 에칭제 사용도 증가하고 있습니다. 적층 공법을 사용하면 제조 시 에너지 소비를 기존 대비 5분의 1로 줄일 수 있습니다. 다양한 셀룰로오스, 목질계 재료, 바이오플라스틱, 바이오 복합재료 등 지속가능하고 인쇄 가능한 기판 재료가 개발되고 있습니다.

본 보고서는 세계의 그린 및 지속가능한 일렉트로닉스 제조 시장을 조사 분석하여 PCB, IC, 배터리, 조립, 전자기기 공급망에서 산업 동향, 촉진요인, 과제, 접근 방식, 기술, 재료, 공정, 주요 기업 등의 정보를 제공합니다.

목차

제1장 서론

• 그린 일렉트로닉스 제조
• 지속가능한 일렉트로닉스 촉진요인
• 일렉트로닉스 제조 환경에 대한 영향
  • 전자폐기물 생성
  • 탄소 배출
  • 자원 활용
  • 폐기물 최소화
  • 공급망에 대한 영향
• 지속가능한 일렉트로닉스에 의한 새로운 기회
• 규칙
  • 인증
• 지속가능한 일렉트로닉스로의 전력 공급(바이오 기반 전지)
• 사출 성형 전자부품의 바이오플라스틱

제2장 그린 일렉트로닉스 제조

• 기존 일렉트로닉스 제조
• 그린 일렉트로닉스 제조의 이점
• 그린 일렉트로닉스 제조 채용의 과제
• 접근법
  • 클로즈드 루프 제조
  • 디지털 매뉴팩처링
  • 재생에너지 이용
  • 에너지 효율
  • 재료 효율
  • 지속가능한 케미스트리
  • 재이용 재료
  • 바이오 기반 재료
• 공급망 그린화
  • 중점 분야
  • 주요 일렉트로닉스 브랜드에 의한 지속가능성 활동
  • 주요 과제
  • 디지털 기술 활용
• 지속가능한 PCB 제조
  • 기존 PCB 제조
  • PCB 동향
  • 지속가능성과 퍼포먼스 조화
  • 지속가능한 공급망
  • PCB 제조의 지속가능성
  • 지속가능성을 향한 PCB 설계
  • 재료
  • 기판
  • 일렉트로닉스 제조의 지속가능한 패터닝과 메탈라이제이션
  • 컴포넌트의 지속가능한 부착과 통합
• 지속가능한 IC
  • IC 제조
  • 지속가능한 IC 제조
  • 웨이퍼 생산
  • 산화 방법
  • 패터닝, 도핑
  • 메탈라이제이션
• EOL
  • 유해 폐기물
  • 배출
  • 물 사용
  • 재활용
  • 그린 인증

제3장 세계 시장과 매출(2018-)

• 세계의 PCB 제조 산업
  • PCB 매출
• 지속가능한 PCB
• 지속가능한 IC

제4장 기업 개요(기업 44개사 프로파일)

제5장 조사 방법

제6장 참고 재료

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영문 목차

영문목차

The electronics industry has witnessed massive growth over the past few decades, with electronic devices becoming an integral part of modern life. However, this growth has also led to significant environmental impacts, including high energy consumption, resource depletion, and electronic waste (e-waste). According to the UN, waste electronics is the fastest growing and most hazardous waste stream globally. This has resulted in an increasing need to make electronics manufacturing more sustainable and environmentally friendly, leading to the emergence of "green electronics" as an approach to reducing the electronics industry's environmental footprint.

Development of sustainable printed circuit board (PCB) designs has grown recently as part of the push for green manufacturing. Traditional PCB manufacturing relies on energy intensive and high-emission processes that involve copper, epoxy resin, glass fiber, and water that are harmful to the environment. Recycling techniques have low efficiency and include laborious processes.

New materials are being utilized that are easily recyclable, and biodegradable polymers and paper PCBs are used in PCB manufacturing. Environmentally friendly etchants for existing subtractive processes and additive manufacturing such as inkjet and laser printing is also increasingly utilized. By employing additive methods, energy consumption during manufacturing can be even five times less than with conventional methods. Sustainable and printable substrate materials including different cellulose and wood-based materials, bioplastics, and biocomposites have been developed.

The Global Market for Green and Sustainable Electronics Manufacturing 2024-2034 provides a comprehensive analysis of the global green electronics manufacturing industry. The report covers industry trends, drivers, challenges, approaches, technologies, materials, processes, and leading companies across printed circuit boards (PCBs), integrated circuits (ICs), batteries, assembly, and the electronics supply chain. Market revenues and forecasts are provided for sustainable PCBs and ICs, segmented by substrate and process types, through 2034.

The report profiles 40+ innovative companies offering greener materials, chemistries, equipment and manufacturing services enabling the transition to more circular, lower carbon electronics. Multiple tables summarize key manufacturers, processes, materials, and sustainability strategies for green electronics.

Analysis is provided on trends in renewables, additive processes, biobased and recycled materials, toxicity reduction, supply chain transparency, e-waste recovery, and life cycle optimization to minimize electronics' environmental footprint. The report helps electronics OEMs, PCBs, ICs, EMS companies and suppliers benchmark sustainability efforts and identify new opportunities.

Report contents include:

• Overview of green electronics manufacturing and drivers for sustainability such as e-waste reduction, lower emissions, and resource efficiency.

• Analysis of environmental impacts like carbon emissions, water usage, and waste.

• Regulations and certifications promoting sustainable electronics.

• Powering electronics through renewable batteries.

• Use of bioplastics for injection molded parts.

• Comparison of conventional vs sustainable manufacturing approaches.

• Analysis of strategies including renewable energy, materials efficiency, sustainable chemistry, recycled materials, and supply chain management.

• Sustainable PCB manufacturing including materials, substrates, patterning, component attachment.

• Sustainable integrated circuits manufacturing.

• End-of-life considerations for electronics.

• Global PCB market size and forecast 2018-2034.

• Sustainable PCB and IC revenue forecasts segmented by technology type.

• Profiles of 40+ companies providing green materials, equipment, and manufacturing services. Companies profiled include DP Patterning, Elephantech, Infineon Technologies, Jiva Materials, Samsung, Syenta, and Tactotek. Additional information on bio-based battery, conductive ink, green & lead-free solder and halogen-free FR4 companies.

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Green electronics manufacturing
• 1.2. Drivers for sustainable electronics
• 1.3. Environmental Impacts of Electronics Manufacturing
  • 1.3.1. E-Waste Generation
  • 1.3.2. Carbon Emissions
  • 1.3.3. Resource Utilization
  • 1.3.4. Waste Minimization
  • 1.3.5. Supply Chain Impacts
• 1.4. New opportunities from sustainable electronics
• 1.5. Regulations
  • 1.5.1. Certifications
• 1.6. Powering sustainable electronics (Bio-based batteries)
• 1.7. Bioplastics in injection moulded electronics parts

2. GREEN ELECTRONICS MANUFACTURING

• 2.1. Conventional electronics manufacturing
• 2.2. Benefits of Green Electronics manufacturing
• 2.3. Challenges in adopting Green Electronics manufacturing
• 2.4. Approaches
  • 2.4.1. Closed-Loop Manufacturing
  • 2.4.2. Digital Manufacturing
    • 2.4.2.1. Advanced robotics & automation
    • 2.4.2.2. AI & machine learning analytics
    • 2.4.2.3. Internet of Things (IoT)
    • 2.4.2.4. Additive manufacturing
    • 2.4.2.5. Virtual prototyping
    • 2.4.2.6. Blockchain-enabled supply chain traceability
  • 2.4.3. Renewable Energy Usage
  • 2.4.4. Energy Efficiency
  • 2.4.5. Materials Efficiency
  • 2.4.6. Sustainable Chemistry
  • 2.4.7. Recycled Materials
    • 2.4.7.1. Advanced chemical recycling
  • 2.4.8. Bio-Based Materials
• 2.5. Greening the Supply Chain
  • 2.5.1. Key focus areas
  • 2.5.2. Sustainability activities from major electronics brands
  • 2.5.3. Key challenges
  • 2.5.4. Use of digital technologies
• 2.6. SUSTAINABLE PRINTED CIRCUIT BOARD (PCB) MANUFACTURING
  • 2.6.1. Conventional PCB manufacturing
  • 2.6.2. Trends in PCBs
    • 2.6.2.1. High-Speed PCBs
    • 2.6.2.2. Flexible PCBs
    • 2.6.2.3. 3D Printed PCBs
    • 2.6.2.4. Sustainable PCBs
  • 2.6.3. Reconciling sustainability with performance
  • 2.6.4. Sustainable supply chains
  • 2.6.5. Sustainability in PCB manufacturing
    • 2.6.5.1. Sustainable cleaning of PCBs
  • 2.6.6. Design of PCBs for sustainability
    • 2.6.6.1. Rigid
    • 2.6.6.2. Flexible
    • 2.6.6.3. Additive manufacturing
    • 2.6.6.4. In-mold elctronics (IME)
  • 2.6.7. Materials
    • 2.6.7.1. Metal cores
    • 2.6.7.2. Recycled laminates
    • 2.6.7.3. Conductive inks
    • 2.6.7.4. Green and lead-free solder
    • 2.6.7.5. Biodegradable substrates
      • 2.6.7.5.1. Bacterial Cellulose
      • 2.6.7.5.2. Mycelium
      • 2.6.7.5.3. Lignin
      • 2.6.7.5.4. Cellulose Nanofibers
      • 2.6.7.5.5. Soy Protein
      • 2.6.7.5.6. Algae
      • 2.6.7.5.7. PHAs
    • 2.6.7.6. Biobased inks
  • 2.6.8. Substrates
    • 2.6.8.1. Halogen-free FR4
      • 2.6.8.1.1. FR4 limitations
      • 2.6.8.1.2. FR4 alternatives
      • 2.6.8.1.3. Bio-Polyimide
    • 2.6.8.2. Metal-core PCBs
    • 2.6.8.3. Biobased PCBs
      • 2.6.8.3.1. Flexible (bio) polyimide PCBs
      • 2.6.8.3.2. Recent commercial activity
    • 2.6.8.4. Paper-based PCBs
    • 2.6.8.5. PCBs without solder mask
    • 2.6.8.6. Thinner dielectrics
    • 2.6.8.7. Recycled plastic substrates
    • 2.6.8.8. Flexible substrates
  • 2.6.9. Sustainable patterning and metallization in electronics manufacturing
    • 2.6.9.1. Introduction
    • 2.6.9.2. Issues with sustainability
    • 2.6.9.3. Regeneration and reuse of etching chemicals
    • 2.6.9.4. Transition from Wet to Dry phase patterning
    • 2.6.9.5. Print-and-plate
    • 2.6.9.6. Approaches
      • 2.6.9.6.1. Direct Printed Electronics
      • 2.6.9.6.2. Photonic Sintering
      • 2.6.9.6.3. Biometallization
      • 2.6.9.6.4. Plating Resist Alternatives
      • 2.6.9.6.5. Laser-Induced Forward Transfer
      • 2.6.9.6.6. Electrohydrodynamic Printing
      • 2.6.9.6.7. Electrically conductive adhesives (ECAs
      • 2.6.9.6.8. Green electroless plating
      • 2.6.9.6.9. Smart Masking
      • 2.6.9.6.10. Component Integration
      • 2.6.9.6.11. Bio-inspired material deposition
      • 2.6.9.6.12. Multi-material jetting
      • 2.6.9.6.13. Vacuumless deposition
      • 2.6.9.6.14. Upcycling waste streams
  • 2.6.10. Sustainable attachment and integration of components
    • 2.6.10.1. Conventional component attachment materials
    • 2.6.10.2. Materials
      • 2.6.10.2.1. Conductive adhesives
      • 2.6.10.2.2. Biodegradable adhesives
      • 2.6.10.2.3. Magnets
      • 2.6.10.2.4. Bio-based solders
      • 2.6.10.2.5. Bio-derived solders
      • 2.6.10.2.6. Recycled plastics
      • 2.6.10.2.7. Nano adhesives
      • 2.6.10.2.8. Shape memory polymers
      • 2.6.10.2.9. Photo-reversible polymers
      • 2.6.10.2.10. Conductive biopolymers
    • 2.6.10.3. Processes
      • 2.6.10.3.1. Traditional thermal processing methods
      • 2.6.10.3.2. Low temperature solder
      • 2.6.10.3.3. Reflow soldering
      • 2.6.10.3.4. Induction soldering
      • 2.6.10.3.5. UV curing
      • 2.6.10.3.6. Near-infrared (NIR) radiation curing
      • 2.6.10.3.7. Photonic sintering/curing
      • 2.6.10.3.8. Component embedding
      • 2.6.10.3.9. Hybrid integration
• 2.7. SUSTAINABLE INTEGRATED CIRCUITS (IC)
  • 2.7.1. IC manufacturing
  • 2.7.2. Sustainable IC manufacturing
  • 2.7.3. Wafer production
    • 2.7.3.1. Silicon
    • 2.7.3.2. Gallium nitride ICs
    • 2.7.3.3. Flexible ICs
    • 2.7.3.4. Fully printed organic ICs
  • 2.7.4. Oxidation methods
    • 2.7.4.1. Sustainable oxidation
    • 2.7.4.2. Metal oxides
    • 2.7.4.3. Recycling
    • 2.7.4.4. Thin gate oxide layers
  • 2.7.5. Patterning and doping
    • 2.7.5.1. Processes
      • 2.7.5.1.1. Wet etching
      • 2.7.5.1.2. Dry plasma etching
      • 2.7.5.1.3. Lift-off patterning
      • 2.7.5.1.4. Surface doping
  • 2.7.6. Metallization
    • 2.7.6.1. Evaporation
    • 2.7.6.2. Plating
    • 2.7.6.3. Printing
      • 2.7.6.3.1. Printed metal gates for organic thin film transistors
    • 2.7.6.4. Physical vapour deposition (PVD)
• 2.8. End of life
  • 2.8.1. Hazardous waste
  • 2.8.2. Emissions
  • 2.8.3. Water Usage
  • 2.8.4. Recycling
    • 2.8.4.1. Mechanical recycling
    • 2.8.4.2. Electro-Mechanical Separation
    • 2.8.4.3. Chemical Recycling
    • 2.8.4.4. Electrochemical Processes
    • 2.8.4.5. Thermal Recycling
  • 2.8.5. Green Certification

3. GLOBAL MARKET AND REVENUES 2018-

• 3.1. Global PCB manufacturing industry
  • 3.1.1. PCB revenues
• 3.2. Sustainable PCBs
• 3.3. Sustainable ICs

4. COMPANY PROFILES (44 company profiles)

5. RESEARCH METHODOLOGY

• 5.1. Objectives of This Report

6. REFERENCES

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