[시장보고서]세계의 데이터센터 AI 칩 패키징 시장 예측(2024-2030년)

세계의 데이터센터 AI 칩 패키징 시장 예측(2024-2030년)

Global Data Center AI Chip Packaging Market Forecast, 2024-2030

상품코드 : 1881279

리서치사 : DIGITIMES Inc.

발행일 : 2025년 11월

페이지 정보 : 영문 131 Slides

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한글목차

샘플 요청 목록에 추가

기술 백본과 미래 플랫폼

이러한 성장의 대부분은 다음과 같은 요소에 의해 촉진됩니다.

*2.5D 패키징 : 주로 CoWoS(Chip-on-Wafer-on-Substrate)와 유사 기술이 주류를 이루고 있으며, 2030년에도 가장 큰 매출 점유율을 유지할 것으로 예측됩니다.
*3D 적층 : SoIC(System on Integrated Chips)/SoIC 유사 적층과 HBM메모리 적층 기술을 통해 첨단 집적화를 실현합니다.
신기술 : 향후 성장은 System-on-Wafer(SoW), Co-Packaged Optics(CPO), Co-Packaged Optics(CPO), 그리고CoPoS(Chip-on-Panel-on-Substrate)와 같은 하이엔드 패널 레벨 패키징과 같은 혁신적인 플랫폼에 의해 점점 더 촉진될 것으로 예측됩니다.

현재 CoWoS/CoWoS 유사 솔루션이 시장을 독점하고 있지만, 이러한 고성능 대체 기술이 성숙하고 대량 생산 단계에 도달함에 따라 전체 점유율은 점차 감소할 것으로 예측됩니다.

전략적 필수 요건: 공급망 다각화

세계 지정학적 상황과 산업 환경의 큰 변화로 인해 공급망 다변화는 첨단 패키징 산업에서 가장 중요한 전략적 초점이 되고 있습니다.

2024년 AI 가속기에서 HBM, CoWoS에 이르는 핵심 부품은 Nvidia, SK하이닉스, TSMC의 손에 집중되어 있습니다. 그러나 이 상황은 변화하고 있습니다. 국가 자급자족 정책과 중국 국내 생태계의 부상으로 새로운 기술과 공급업체가 빠르게 부상하고 있습니다. 이러한 경쟁 환경의 확대는 AI 칩과 첨단 패키징의 보다 다양하고 탄력적인 공급망을 창출할 것으로 보입니다.

대만의 지속적인 리더십

미국, 한국, 중국과의 경쟁 심화에도 불구하고 2030년까지 대만은 데이터센터 AI 칩의 첨단 패키징의 중심지로 남을 것으로 예측됩니다. 세계 최고 수준의 반도체 및 컴퓨팅 생태계를 바탕으로 대만은 칩 통합과 AI 랙 통합 모두에서 중요한 거점 역할을 할 수 있습니다. 대만 공급업체는 2030년까지 데이터센터 AI 칩 패키징 시장에서 70%의 점유율을 유지할 것으로 예측됩니다.

세계의 데이터센터 AI 칩 패키징 시장에 대해 조사분석했으며, 2030년까지의 출하량과 시장 예측, 대만 주요 기업의 매출 분석, 경쟁 구도 등을 제공하고 있습니다.

영문목차

Technological Backbone and Future Platforms

Most of this growth will be driven by:

*2.5D Packaging: Mostly dominated by CoWoS (Chip-on-Wafer-on-Substrate) and similar technologies, which will still hold the largest revenue share by 2030.
*3D Stacking: Advanced integration is achieved through SoIC (System on Integrated Chips)/SoIC-like stacking and HBM memory stacking.
*Emerging Technologies: Future growth will increasingly be driven by revolutionary platforms such as System-on-Wafer (SoW), Co-Packaged Optics (CPO), and high-end Panel-Level Packaging, such as CoPoS (Chip-on-Panel-on-Substrate) .

While CoWoS/CoWoS-like solutions currently dominate the market, their overall share will gradually decline as these high-performance alternatives mature and reach mass production.

The Strategic Imperative: Supply Chain Diversification

The major shifts in the global geopolitical and industrial landscape have made supply chain diversification the primary strategic focus for the advanced packaging industry.

In 2024, critical components-from AI accelerators to HBM and CoWoS-remain concentrated in the hands of Nvidia, SK Hynix, and TSMC. But this landscape is shifting. New technologies and suppliers are rapidly emerging, reinforced by national self-sufficiency policies and the rise of China's domestic ecosystem. This expanding competitive landscape will create a more diversified and resilient supply chain for AI chips and advanced packaging.

Taiwan's Enduring Leadership

Despite intensifying competition from the U.S., Korea, and China, Taiwan will remain the core of advanced packaging for data-center AI chips by 2030. Anchored by its world-class semiconductor and computing ecosystem, Taiwan functions as a critical hub for both chip integration and AI rack integration. Taiwanese suppliers are expected to maintain a 70% market share of AI chip packaging for data centers by 2030.

Chapter 1: Executive Summary

Chapter 2: Definition & Major Assumptions

Chapter 3: Why Advanced Packaging Matters?

Chapter 4: Global and Taiwan's Data Center AI Chip Packaging Market Forecast

4.1. Global Data Center AI Chip Shipment Forecast
4.2. Global Data Center AI Chip Packaging Market Forecast
4.3. Taiwan's Data Center AI Chip Packaging Market Forecast
4.4. Analysis and Forecast of Major Taiwanese Players' Data AI Chip Packaging Revenue

Chapter 5: Ecosystem and Market Forecast of the Data Center AI Chip Packaging Industry in Taiwan

5.1. CoWoS
5.2. System on Wafer (SoW)
5.3. SoIC
5.4. HBM Packaging

Chapter 6: Competitive Landscape in the Data Center AI Chip Packaging Market

6.1. Technology Transition for AI Chip Advanced Packaging
6.2. Competitive Landscape Among Semiconductor Segments & Companies
6.3. US-China Tension and Its Impacts on the Advanced Packaging

Chapter 7: Conclusion and findings

Table of figures

Figure 1: Growth Comparison: Semiconductor, Packaging & Testing, and AI Chip Advanced Packaging
Figure 2: Global Data Center AI Chip Advanced Packaging Revenue Forecast
Figure 3: Taiwanese Vendors' Data Center AI Chip Advanced Packaging Revenue Forecast
Figure 4: Definition: Data Center AI Chips - AI Accelerators
Figure 5: Definition: Data Center AI Chip Advanced Packaging
Figure 6: Megatrend 1: From Monolithic SoC to Chiplet Architecture
Figure 7: Megatrend 2: From 2D to 2.5D/3D/3.5D IC Packaging
Figure 8: Benefits of Advanced Packaging
Figure 9: The Walls for Data Center AI Chips
Figure 10: Advanced Packaging to Overcome The Barriers of Walls
Figure 11: Evolution of Compute Performance (Speed x Density) per Reticle From Process Node N28 to A16
Figure 12: Data Center AI Chips and Their Advanced Packaging Solutions
Figure 13: Global data center AI chip shipment forecast
Figure 14: Data Center AI Chip Shipment CAGR 2024-2030
Figure 15: Global Data Center AI GPU Shipment Forecast 2024-2030
Figure 16: Nvidia AI GPU Roadmap & Specifications
Figure 17: Data Center AI GPU Improvement: From Hopper to Rubin
Figure 18: AMD AI GPU Roadmap & Specifications
Figure 19: Global Data Center Application-specific AI Chip Shipment Forecast 2024-2030
Figure 20: Main Reasons for Adopting Custom AI Chips
Figure 21: TPU Roadmap & Specifications
Figure 22: TPU Evolution: Peak AI Inference Performance with FP8 Precision
Figure 23: TPU Evolution: Peak TFLOPS Performance per Watt
Figure 24: AWS AI Chip Roadmap & Specifications
Figure 25: The Huawei Ascend AI Chip Roadmap
Figure 26: Huawei Atlas SuperPod Roadmap and the Comparison to Nvidia Rack Systems
Figure 27: Global Data Center AI Server CPU Shipment Forecast
Figure 28: AI Server CPU Specifications
Figure 29: Global Data Center AI Networking Processor Shipment Forecast
Figure 30: Nvidia Data Center Switch Roadmap Specifications
Figure 31: Nvidia Data Center CPO Switches in 2026
Figure 32: Broadcom Tomahawk Switch Roadmap Specifications
Figure 33: GB200 NVL72 Compute Trays and Switch Trays
Figure 34: Huawei CloudMatrix 384 System
Figure 35: Forecast of 300mm Wafer Consumption for Data Center AI Accelerators
Figure 36: Forecast of Wafer Foundry Revenue for Data Center AI Accelerators
Figure 37: Number of Compute Dies per Package for Data Center High-End GPUs and Custom AI Chips 2024-2030
Figure 38: Global Data Center AI Chip Packaging Market Forecast (by Technology)
Figure 39: Global Data Center AI Chip Packaging Market Share (by Technology)
Figure 40: Taiwan Data Center AI Chip Packaging Market and Market Share Forecast
Figure 41: TSMC Data Center AI Chip Packaging Revenue and Market Share Forecast
Figure 42: TSMC's Advanced Packaging Portfolio
Figure 43: TSMC Data Center AI Chip Packaging Revenue Forecast ($B)
Figure 44: ASEH Data Center AI Chip Packaging Revenue Forecast ($M)
Figure 45: Powertech's Data Center AI Chip Packaging Revenue Forecast ($M)
Figure 46: The Data Center AI Chips Supply Chain Overview
Figure 47: CoWoS Technology Roadmap
Figure 48: Comparison of CoWoS Family
Figure 49: The Capability of TSMC CoWoS-L for Scaling-up System
Figure 50: The Comparison between CoWoS and CoPoS
Figure 51: Analysis of CoWoS Supply Chain
Figure 52: Global Data Center-related CoWoS and CoWoS-like Wafer Consumption Forecast
Figure 53: Global Data Center AI Chip CoWoS/CoPoS-type Packaging Revenue by Application
Figure 54: SoIC with Finer Bonding Pitch and Extremely High Density
Figure 55: The Performance of SoIC-X with Different Bond Pitches
Figure 56: Applications of the SoIC and Similar 3D Stacking Technologies
Figure 57: Evolution of Co-Packaged Optics(CPO)
Figure 58: Benefits of AI Accelerators from 2.5D to 3.5D Packaging
Figure 59: TSMC SoIC Capacity Forecast
Figure 60: Forecast of SoIC and SoIC-like 3D Stacking Revenue for Data Center AI Chips
Figure 61: Revenue Forecast of SoIC and SoIC-like 3D Stacking for Global Data Center AI Chips by Application
Figure 62: Comparison of SoW-P with SoW-X
Figure 63: SoW-X vs. CoWoS-L Improvement
Figure 64: The Disruptive SoW-X and the Comparison to CoWoS Evolution
Figure 65: Forecast of SoW Revenue in the Global Data Center AI Chip Market
Figure 66: HBM Roadmap Projection through 2030
Figure 67: Global HBM Packaging Revenue Forecast
Figure 68: Timelines of Data Center AI Chip Packaging
Figure 69: Implications of the Timelines
Figure 70: The Technology Transition for Data Center AI Chip Advanced Packaging
Figure 71: New Competition Toward Advanced Packaging
Figure 72: The Chip Platform Competition and Its Impact on Advanced Packaging
Figure 73: The Advanced Packaging Portfolio for Major Foundry/IDM Companies
Figure 74: TSMC Data Center AI Chip Advanced Packaging Roadmap
Figure 75: Intel Data Center/PC Advanced Packaging Roadmap
Figure 76: Samsung Data Center AI Chip Advanced Packaging Roadmap
Figure 77: The Packaging Portfolio of Chinese OSAT Vendors
Figure 78: Top 3 Foundries/IDMs' Packaging Solution Comparison
Figure 79: Emerging Competitive Landscape and Development Trends in Advanced Packaging
Figure 80: Top 5 Restrictions for China's AI Chip Development from the US Government
Figure 81: China Data Center AI Chip Supply Chain
Figure 82: China Local-made Data Center AI Accelerator Shipment Forecast
Figure 83: Comparison of the Growth Momentum of the Semiconductor Market, Packaging Market, and Data Center AI Chip Advanced Packaging Market
Figure 84: Three Main Growth Drivers for the Global Data Center AI Chip Packaging Market
Figure 85: Taiwanese Vendors' Data Center AI Chip Advanced Packaging Revenue Forecast

한글목차

기술 백본과 미래 플랫폼

전략적 필수 요건: 공급망 다각화

대만의 지속적인 리더십

목차

제1장 개요

제2장 정의와 주요 전제조건

제3장 첨단 패키징이 중요한 이유

제4장 세계와 대만의 데이터센터 AI 칩 패키징 시장 예측

제5장 대만 데이터센터 AI 칩 패키징 산업의 에코시스템과 시장 예측

제6장 데이터센터 AI 칩 패키징 시장의 경쟁 구도

제7장 결론과 조사 결과