반도체 조립 및 검사 서비스 시장 : 서비스별, 패키징 솔루션별, 용도별, 지역별 - 규모, 점유율, 전망, 기회 분석(2023-2030년)
Semiconductor Assembly&Testing Services Market, By Service, By Packaging Solutions, By Application, By Region (North America, Latin America, Europe, Middle East & Africa,&Asia Pacific)- Size, Share, Outlook,&Opportunity Analysis, 2023 - 2030
상품코드
:
1350341
리서치사
:
Coherent Market Insights
발행일
:
2023년 08월
페이지 정보
:
영문
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
세계 반도체 조립 및 검사 서비스 시장은 2023년 334억 2,000만 달러로 추정 및 예측되며, 2030년에는 488억 1,000만 달러에 달할 것으로 예상되며, 예측 기간(2023-2030년)의 CAGR은 5.6%로 예측됩니다.
| 보고 범위 |
보고서 상세 |
| 기준년도 |
2022 |
2023년 시장 규모 |
334억 2,000만 달러 |
| 과거 데이터 |
2018년부터 2021년까지 |
예측 기간 |
2023-2030 |
| 예측 기간 2023-2030년 CAGR: |
5.60% |
2030년 가치 예측 |
488억 1,000만 달러 |
반도체, 마이크로 회로, 마이크로칩을 제조하기 위해서는 제조/가공 구역을 매우 정밀한 상태로 유지해야 합니다. 반도체 제조 및 가공에는 일반적으로 흡습성 부품이 사용되기 때문에 높은 습도에 매우 취약합니다. 반도체 및 집적회로를 제조하는 동안 조립 구역의 과도한 습도는 접합 공정에 악영향을 미쳐 결함을 유발할 수 있습니다. 회로선을 에칭하기 전에 감광성 고분자 화합물인 포토레지스트로 덮여 있습니다. 포토레지스트는 흡습성이 있기 때문에 수분을 흡수하여 미세한 회로선이 끊어지거나 브리징이 발생하여 회로 결함을 유발합니다.
시장 역학
기술 발전에 따른 소비자 전자기기에 대한 수요 증가는 세계 반도체 조립 및 검사 서비스 시장의 성장을 주도하고 있습니다. 휴대폰과 태블릿 PC의 높은 발전은 반도체 조립 및 검사 서비스(SATS)의 잠재적 시장 중 하나입니다. 이동성 향상과 디지털 컨텐츠의 증가는 예측 기간 동안 세계 반도체 조립 및 검사 서비스 시장의 성장을 촉진할 것으로 예상됩니다. 전자부품, 자동차 안전 시스템, 관리 시스템으로 구축된 차세대 자동차의 자동차 전자제품 수요 증가는 세계 반도체 조립 및 검사 서비스 시장의 성장을 주도하고 있습니다. 내비게이션, 하이브리드 전기 추진 요인, LED의 최신 기술 채택 증가가 이 시장의 수요를 창출하고 있습니다.
본 조사의 주요 특징
- 이 보고서는 2022년을 기준 연도로 하여 예측 기간(2023-2030년)의 세계 반도체 조립 및 검사 서비스 시장 규모와 CAGR을 상세히 분석했습니다.
- 다양한 부문에서 잠재적인 수익 기회를 파악하고, 이 시장에 대한 매력적인 투자 제안 매트릭스를 설명합니다.
- 또한 시장 촉진요인, 억제요인, 기회, 신제품 출시 및 승인, 지역별 전망, 주요 시장 기업이 채택한 경쟁 전략 등에 대한 중요한 고려 사항도 제공합니다.
- 이 보고서는 회사 개요, 실적, 제품 포트폴리오, 지리적 입지, 시장 자본, 주요 개발, 전략 및 향후 계획과 같은 매개 변수를 기반으로 세계 반도체 조립 및 검사 서비스 시장의 주요 업체를 프로파일링합니다.
- 이번 조사 대상 기업으로는 ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc.(Psi Technologies Inc.), STATS chipPAC Ltd.(JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd. 등이 포함됩니다.
- 이 보고서의 인사이트를 통해 기업의 마케팅 담당자와 경영진은 향후 제품 출시, 제품 업그레이드, 시장 확대 및 마케팅 전략에 대한 정보에 입각한 의사결정을 내릴 수 있습니다.
- 이 보고서는 투자자, 공급업체, 매니지드 서비스 제공업체, 제3자 서비스 제공업체, 유통업체, 신규 진입자, 부가가치 재판매업체 등 이 업계의 다양한 이해관계자를 대상으로 합니다.
- 이해관계자는 세계 반도체 조립 및 검사 서비스 시장 분석에 사용되는 다양한 전략 매트릭스를 통해 의사결정을 용이하게 할 수 있습니다.
목차
제1장 조사 목적과 가정
제2장 시장 개요
- 보고서 개요
- 주요 요약
- Coherent Opportunity Map(COM)
제3장 시장 역학, 규제, 동향 분석
- 시장 역학
- 소비자용 전자제품의 모빌리티와 커넥티비티에 대한 수요 증가
- SATS 프로바이더가 제공하는, 사내에서의 검사나 패키징 능력을 뛰어넘는 부가 기능
- 환율 변동
- 하이엔드·패키징·솔루션에의 높은 설비 투자
- 첨단 포장·솔루션에 대한 투자
- 규제 시나리오
- 업계 동향
- 인수합병
- 신시스템 발매/승인
- COVID-19 팬데믹의 영향
제4장 반도체 조립 및 검사 서비스 세계 시장 : 서비스별, 2018-2030년
제5장 반도체 조립 및 검사 서비스 세계 시장 : 패키징 솔루션별, 2018-2030년
- 구리 선·금선 본딩
- 구리 클립
- 플립칩
- 웨이퍼 레벨 패키징
- TSV
제6장 반도체 조립 및 검사 서비스 세계 시장 : 용도별, 2018-2030년
- 통신
- 컴퓨팅&네트워킹
- 가전제품
- 산업용
- 카일렉트로닉스
제7장 반도체 조립 및 검사 서비스 세계 시장 : 지역별, 2018-2030년
- 북미
- 시장 규모 및 예측, 2018-2030년
- 서비스별 시장 규모와 예측 및 전년비 성장률 : 2018-2030년
- 패키징 솔루션별 시장 규모 및 예측, 전년비 성장률 : 2018-2030년
- 시장 규모 및 예측, 전년비 성장률 : 용도별, 2018-2030년
- 시장 점유율 분석 : 국가별, 2023년 및 2030년(%)
- 유럽
- 아시아태평양
- 라틴아메리카
- 중동 및 아프리카
제8장 경쟁 상황
- 기업 개요
- ASE Group
- Powertech Technology Inc.
- Global Foundries Inc.
- Amkor Technology Inc.
- CORWIL Technology Corp.
- Integrated Microelectronics Inc.(Psi Technologies Inc.)
- STATS chipPAC Ltd.(JCET)
- Chipbond Technology Corporation
- Silicon Precision Industries Company Ltd.
제9장 섹션
ksm
영문 목차
The global semiconductor assembly and testing services market is estimated at US$ 33.42 Billion in 2023, and is projected to reach US$ 48.81 Billion by 2030, exhibiting a CAGR of 5.6% over the forecast period (2023-2030).
| Report Coverage |
Report Details |
| Base Year: |
2022 |
Market Size in 2023: |
US$ 33.42 Bn |
| Historical Data for: |
2018 to 2021 |
Forecast Period: |
2023 - 2030 |
| Forecast Period 2023 to 2030 CAGR: |
5.60% |
2030 Value Projection: |
US$ 48.81 Bn |
Manufacturing semiconductors, microcircuits, and microchips requires extremely precise conditions to be kept in the production/processing area. Hygroscopic components are typically employed in semiconductor manufacturing or processing, making them extremely vulnerable to high humidity levels. Excessive moisture in the assembly area during the manufacture of semiconductors and integrated circuits negatively impacts the bonding process and raises faults. Circuit lines are covered with photosensitive polymer compounds called photoresists before being etched. They absorb moisture due to their hygroscopic nature, which causes the minuscule circuit wires to be cut or bridged, resulting in circuit failure.
Market Dynamics
The ongoing demand for consumer electronics with the advancement of technology is driving growth of the global semiconductor assembly and testing services market. The high development of cell phones and tablets is one of the potential markets for semiconductor assembly and testing services (SATS). Increasing mobility and growing digital content are expected to drive growth of the global semiconductor assembly and testing services market's growth during the forecast period. Increasing demand for automotive electronics in the upcoming generation of cars built with electronic components, systems to enhance car safety, and management systems are driving growth of the global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric drivers, and LEDs creates demand for this market.
Key features of the study:
- This report provides an in-depth analysis of the global semiconductor assembly and testing services market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2023-2030), considering 2022 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
- It profiles leading players in the global semiconductor assembly and testing services market based on the following parameters - company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
- Companies covered as a part of this study are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
- Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
- The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor assembly and testing services market
Detailed Segmentation
- Global Semiconductor Assembly And Testing Services Market, By Service:
- Assembly & Packaging Services
- Testing Services
- Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions:
- Copper Wire and Gold Wire Bonding
- Copper Clip
- Flip Chip
- Wafer Level Packaging
- TSV
- Global Semiconductor Assembly And Testing Services Market, By Application:
- Communication
- Computing & Networking
- Consumer Electronics
- Industrial
- Automotive Electronics
- Global Semiconductor Assembly And Testing Services Market, By Region:
- North America
- By Country
- U.S.
- Canada
- Europe
- By Country
- Germany
- U.K.
- France
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- By Country
- China
- India
- Japan
- Australia
- South Korea
- ASEAN
- Rest of Asia Pacific
- Latin America
- By Country
- Brazil
- Mexico
- Rest of Latin America
- Middle East and Africa
- By Country/Region:
- GCC Countries
- South Africa
- Rest of Middle East and Africa
- Company Profiles
- ASE Group
- Powertech Technology Inc.
- Global Foundries Inc.
- Amkor Technology Inc.
- CORWIL Technology Corp.
- Integrated Microelectronics Inc. (Psi Technologies Inc.)
- STATS chipPAC Ltd. (JCET)
- Chipbond Technology Corporation
- Silicon Precision Industries Company Ltd.
Table of Contents
1. Research Objectives and Assumptions
- Research Objectives
- Assumptions
- Abbreviations
2. Market Purview
- Report Description
- Market Definition and Scope
- Executive Summary
- Market Snippet, By Service
- Market Snippet, By Packaging Solutions
- Market Snippet, By Application
- Market Snippet, By Region
- Coherent Opportunity Map (COM)
3. Market Dynamics, Regulations, and Trends Analysis
- Market Dynamics
- Increasing demand for mobility and connectivity in consumer electronic products
- Additional features offered by SATS providers over in-house testing and packaging capabilities
- Constant fluctuations in exchange rates
- High capital investment for high-end packaging solutions
- Investments in advanced packaging solution
- Regulatory Scenario
- Industry Trend
- Merger and Acquisitions
- New system Launch/Approvals
- Impact of COVID-19 Pandemic
4. Global Semiconductor Assembly And Testing Services Market , By Service, 2018-2030 (US$ Billion)
- Introduction
- Market Share Analysis, 2023 and 2030 (%)
- Y-o-Y Growth Analysis, 2018 - 2030
- Segment Trends
- Assembly & Packaging Services
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Testing Services
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
5. Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions, 2018-2030 (US$ Billion)
- Introduction
- Market Share Analysis, 2023 and 2030 (%)
- Y-o-Y Growth Analysis, 2018 - 2030
- Segment Trends
- Copper Wire and Gold Wire Bonding
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Copper Clip
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Flip Chip
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Wafer Level Packaging
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- TSV
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
6. Global Semiconductor Assembly And Testing Services Market, By Application, 2018-2030 (US$ Billion)
- Introduction
- Market Share Analysis, 2023 and 2030 (%)
- Y-o-Y Growth Analysis, 2018 - 2030
- Segment Trends
- Communication
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Computing & Networking
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Consumer Electronics
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Industrial
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
- Automotive Electronics
- Introduction
- Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
7. Global Semiconductor Assembly And Testing Services Market , By Region, 2018-2030 (US$ Billion)
- Introduction
- Market Share Analysis, By Region, 2023 and 2030 (%)
- North America
- Market size and Forecast,2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
- Market Share Analysis, By Country, 2023 and 2030(%)
- Europe
- Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
- Market Share Analysis, By Country, 2023 and 2030(%)
- Germany
- U.K.
- France
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
- Market Share Analysis, By Country, 2023 and 2030(%)
- China
- India
- Japan
- Australia
- South Korea
- ASEAN
- Rest Of Asia Pacific
- Latin America
- Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
- Market Share Analysis, By Country, 2023 and 2030(%)
- Brazil
- Mexico
- Rest Of Latin America
- Middle East and Africa
- Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
- Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
- Market Share Analysis, By Country, 2023 and 2030 (%)
- South Africa
- GCC Countries
- Rest of the Middle East and Africa
8. Competitive Landscape
- Company Profiles
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- Powertech Technology Inc.
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Integrated Microelectronics Inc. (Psi Technologies Inc.)
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- STATS chipPAC Ltd. (JCET)
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Chipbond Technology Corporation
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Silicon Precision Industries Company Ltd.
- Company Overview
- Product Portfolio
- Financial Performance
- Recent Developments/Updates
- Analyst Views
9. Section
- References
- Research Methodology
- About us and Sales Contact
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