세계의 파워 일렉트로닉스 시장 : 디바이스 유형별, 재료별, 용도별, 최종 용도별 - 기회 분석과 산업 예측(2024-2033년)

Power Electronics Market By Device Type, By Material, By Application, By End Use : Global Opportunity Analysis and Industry Forecast, 2024-2033

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한글목차

파워 일렉트로닉스 시장은 2023년 418억 달러로 평가되었습니다. 2024년부터 2033년까지 연평균 5.8% 성장하여 2033년에는 717억 달러에 달할 것으로 예상됩니다.

파워 일렉트로닉스는 반도체 스위치를 기반으로 한 전기 컨버터를 이용한 전력 변환 및 제어를 다루는 분야입니다. 파워 컨버터는 크게 DC/DC 컨버터, AC/DC 컨버터, DC/AC 컨버터, AC/AC 컨버터, DC/DC 컨버터, AC/AC 컨버터의 네 가지 범주로 나뉩니다. 각 컨버터는 저항기, 커패시터, 인덕터와 같은 기본 전자 부품과 다이오드, 사이리스터, 트랜지스터와 같은 반도체 소자로 구성됩니다. 파워 일렉트로닉스는 전동화 차량 용도에서 매우 중요하며, 전력 변환을 위한 작고 효율적인 솔루션을 제공합니다. 이러한 디바이스는 전원에서 부하로의 전력 전송을 견고하고 효율적이며 컴팩트한 방식으로 관리하여 최적의 활용을 촉진합니다. 다이오드, 트랜지스터, 사이리스터와 같은 구성 요소를 사용하여 파워 일렉트로닉스는 서로 다른 형태의 전력 변환을 제어합니다. 파워 일렉트로닉스는 고속 스위칭 능력과 고효율로 인해 고전압 및 고전류 동작에 탁월합니다. 또한, 파워 일렉트로닉스는 단방향 및 양방향 에너지 흐름을 모두 관리할 수 있으며, 재생된 에너지를 전력망에 다시 공급할 수 있습니다. 이러한 디바이스는 자동차 및 에너지 절약 용도의 시스템 효율과 성능을 향상시키는 중요한 기술이 될 것으로 예상됩니다. 파워 모듈(파워 일렉트로닉스 모듈)은 파워 반도체 등 여러 개의 파워 컴포넌트를 하나의 패키지에 통합한 것으로, 개별 컴포넌트에 비해 높은 전력 밀도와 신뢰성을 제공합니다.

파워 MOSFET(금속산화막 반도체 전계효과 트랜지스터)은 전자 스위치로서 매우 낮은 저항과 고주파 스위칭으로 부하를 제어하는 중요한 역할을 합니다. 이러한 특성은 고효율 전원 공급 장치, 전기자동차 및 하이브리드 자동차, 태양광 인버터, RF 스위칭, IT 기기 전원 공급 장치 등에 활용되고 있습니다. 자동차 전자공학의 발전은 파워 일렉트로닉스 시장의 주요 촉진요인입니다. 현대 자동차는 성능, 안전성 및 효율성 향상을 위해 첨단 전자 시스템에 대한 의존도가 높아지고 있으며, 이는 첨단 파워 일렉트로닉스 부품에 대한 수요를 증가시키고 있습니다. 전기 파워트레인, 첨단운전자보조시스템(ADAS), 첨단 인포테인먼트와 같은 혁신에는 고성능 전력 변환기, 인버터, 배터리 관리 시스템이 필요합니다. 이러한 기술 발전은 자동차의 기능성을 향상시킬 뿐만 아니라, 신뢰할 수 있고 효율적인 파워 일렉트로닉스 솔루션의 필요성도 높이고 있습니다. 자동차 기술이 발전함에 따라 첨단 전력전자 부품에 대한 수요가 가속화되면서 시장 성장을 가속하고 이 분야의 기술 발전을 촉진할 것입니다. 또한 중국, 브라질, 인도와 같은 신흥국에서 SiC 기반 태양전지에 대한 수요가 급증하고 있으며, 이는 세계 시장 성장을 가속하고 있습니다.

그러나 주요 장애 요인 중 하나는 첨단 전자 장치의 복잡한 통합 프로세스입니다. 복잡한 디바이스를 설계하려면 통합을 위한 견고한 방법론, 기술력, 다양한 도구 세트가 필요하며, 디바이스 비용도 상승합니다. 이 장치의 높은 비용은 사용자가 혁신적인 신기술 장치로 전환하는 것을 억제하고 있습니다. 반면, 플러그인 전기자동차(PEV) 수요 증가와 파워 MOSFET(금속산화막 반도체 전계효과 트랜지스터)의 기술 혁신은 예측 기간 동안 파워 일렉트로닉스 시장 확대에 유리한 기회를 제공할 것으로 예상됩니다.

파워 일렉트로닉스 시장은 디바이스 유형, 재료, 용도, 최종 용도, 지역으로 구분됩니다. 디바이스 유형별로는 파워 디스크리트, 파워 모듈, 파워 IC로 분류됩니다. 재료별로는 실리콘 카바이드, 질화 갈륨, 사파이어, 기타로 분류됩니다. 용도별로는 전원 관리, 무정전전원장치(UPS), 재생에너지, 기타로 분류됩니다. 최종 용도별로는 통신, 산업, 자동차, 재생에너지, 민생/기업, 군사/국방, 에너지/전력, 기타로 세분화됩니다. 지역별로는 북미(미국, 캐나다, 멕시코), 유럽(영국, 독일, 프랑스, 프랑스, 이탈리아, 기타 유럽), 아시아태평양(중국, 일본, 인도, 한국, 기타 아시아태평양), 라틴아메리카, 중동 및 아프리카 시장 동향을 분석합니다.

이해관계자를 위한 주요 이점

• 이 보고서는 2023년부터 2033년까지의 파워 일렉트로닉스 시장 분석 시장 부문, 현재 동향, 추정 및 동향 분석, 역학을 정량적으로 분석하여 일반적인 파워 일렉트로닉스 시장 기회를 식별합니다.
• 시장 성장 촉진요인, 시장 성장 억제요인, 시장 기회와 관련된 정보와 함께 시장 조사를 제공합니다.
• Porter's Five Forces 분석은 이해 관계자가 이익 중심의 비즈니스 결정을 내리고 공급자와 구매자의 네트워크를 강화할 수 있도록 구매자와 공급자의 잠재력을 밝힙니다.
• 파워 일렉트로닉스 시장의 세분화를 자세히 분석하여 시장 기회를 파악할 수 있습니다.
• 각 지역의 주요 국가는 세계 시장에 대한 수익 기여도에 따라 매핑되어 있습니다.
• 시장 기업의 포지셔닝은 벤치마킹을 용이하게 하고 시장 기업의 현재 위치를 명확하게 이해할 수 있습니다.
• 이 보고서에는 지역 및 세계 파워 일렉트로닉스 시장 동향, 주요 기업, 시장 부문, 응용 분야, 시장 성장 전략에 대한 분석이 포함되어 있습니다.

본 보고서에서 가능한 커스터마이징(추가 비용 및 일정이 필요합니다.)

• 기업의 시장 점유율 분석 : 제품/부문별 시장 점유율 분석
• 규제 가이드라인
• SWOT 분석

목차

제1장 서론

제2장 주요 요약

제3장 시장 개요

• 시장 정의와 범위
• 주요 조사 결과
  • 영향요인
  • 주요 투자 기회
• Porter의 Five Forces 분석
• 시장 역학
  • 성장 촉진요인
  • 성장 억제요인
  • 기회

제4장 파워 일렉트로닉스 시장 : 디바이스 유형별

• 개요
• 파워 디스크리트
• 파워 모듈
• 파워 IC

제5장 파워 일렉트로닉스 시장 : 재료별

• 개요
• 탄화규소
• 질화갈륨
• 사파이어
• 기타

제6장 파워 일렉트로닉스 시장 : 용도별

• 개요
• 전력 관리
• UPS
• 재생에너지
• 기타

제7장 파워 일렉트로닉스 시장 : 최종 용도별

• 개요
• 통신용
• 산업용
• 자동차
• 가전제품
• 군 및 방위
• 에너지 및 전력
• 기타

제8장 파워 일렉트로닉스 시장 : 지역별

• 개요
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 기타
• 아시아태평양
  • 중국
  • 인도
  • 일본
  • 한국
  • 기타
• 라틴아메리카
  • 라틴아메리카
  • 중동
  • 아프리카

제9장 경쟁 구도

• 서론
• 주요 성공 전략
• 주요 10개사의 제품 매핑
• 경쟁 대시보드
• 경쟁 히트맵
• 주요 기업의 포지셔닝(2023년)

제10장 기업 개요

• ABB, Ltd
• FUJI ELECTRIC CO, LTD.
• Infineon Technologies AG
• Microsemi Corporation
• Mitsubishi Electric Corporation
• Renesas Electronics Corporation
• Rockwell Automation, Inc.
• STMicroelectronics N.V.
• Texas Instruments Incorporated
• Toshiba Corporation

LSH

영문 목차

영문목차

The power electronics market was valued at $41.8 billion in 2023 and is estimated to reach $71.7 billion by 2033, exhibiting a CAGR of 5.8% from 2024 to 2033.

Power electronics deals with the conversion and control of electric power using electric converters based on the switch of semiconductors. The power converter has four major categories such as DC/DC converters, AC/DC converters, DC/AC converters, and AC/AC converters. Each converter is composed of fundamental electronic components, including resistors, capacitors, and inductors, as well as semiconductor devices such as diodes, thyristors, and transistors. Power electronics are crucial in electrified vehicle applications, offering compact and efficient solutions for power conversion. These devices manage the transfer of power from a source to a load in a robust, efficient, and compact manner, facilitating optimal utilization. By employing components such as diodes, transistors, and thyristors, power electronics control the conversion of electric power between different forms. They excel in high-voltage and highcurrent operations due to their rapid switching capabilities and high efficiency. Additionally, power electronics can manage both unidirectional and bidirectional energy flows, allowing regenerated energy to be returned to the grid. These devices are anticipated to be key technologies for enhancing system efficiency and performance in automotive and energy-saving applications. Power modules, or power electronic modules, integrate multiple power components, such as power semiconductors, into a single package, offering higher power density and reliability compared to discrete components.

Power metal oxide semiconductor field effect transistors (MOSFETs) play a critical role as electronic switches, controlling loads with very low resistance and high-frequency switching. These attributes are leveraged in high-efficiency power supplies, electric and hybrid vehicles, photovoltaic inverters, RF switching, and IT equipment power supplies. Advancements in automotive electronics are a key driver for the power electronics market. Modern vehicles increasingly depend on sophisticated electronic systems for enhanced performance, safety, and efficiency, creating a rising demand for advanced power electronics components. Innovations such as electric powertrains, advanced driver-assistance systems (ADAS), and state-of-the-art infotainment require high-performance power converters, inverters, and battery management systems. These technological improvements not only boost vehicle functionality but also escalate the need for reliable and efficient power electronics solutions. As automotive technology evolves, the need for cutting-edge power electronics components accelerates, thus driving market growth and fostering technological advancements in the sector. Moreover, surge in demand for SiC-based photovoltaic cells in the developing countries, including China, Brazil, and India fuels the growth of the global market.

However, one of the major restraints is the complex integration process for advanced electronics devices. Designing complex devices requires robust methodology, skillsets, and different toolsets for integration, which also raises the cost of the devices. This high cost of devices restrains users from switching to new innovative technologies devices. On the contrary, rise in demand for plug-in electric vehicles (PEVs) and innovation in power metal-oxide- semiconductor field effect transistor (MOSFET) is anticipated to provide lucrative opportunities for the expansion of the power electronics market during the forecast period.

The power electronics market is segmented into device type, material, application, end use, and region. On the basis of device type, the market is classified into power discrete, power module, and power IC. By material, it is categorized into silicon carbide, gallium nitride, sapphire, and others. By application, it includes power management, uninterruptible power supply (UPS), renewable, and others. By end use, the market is fragmented into telecommunication, industrial, automotive, renewable, consumer & enterprise, military & defense, energy & power, and others. Region wise, the market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, Italy, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of AsiaPacific), and LAMEA (Latin America, Middle East, and Africa).

The key players profiled in the report include Infineon Technologies AG, Mitsubishi Electric Corporation, ABB, Ltd, FUJI ELECTRIC CO, LTD., Microsemi Corporation, Rockwell Automation, Inc., Renesas Electronics Corporation, Texas Instruments Incorporated, STMicroelectronics N.V., and Toshiba Corporation. Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, innovation, investment, new product development, and acquisition to strengthen their foothold in the power electronics industry.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the power electronics market analysis from 2023 to 2033 to identify the prevailing power electronics market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the power electronics market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global power electronics market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

• Quarterly Update and* (only available with a corporate license, on listed price)
• 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
• Free Upcoming Version on the Purchase of Five and Enterprise User License.
• 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
• 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
• Free data Pack on the Five and Enterprise User License. (Excel version of the report)
• Free Updated report if the report is 6-12 months old or older.
• 24-hour priority response*
• Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

• Market share analysis of players by products/segments
• Regulatory Guidelines
• SWOT Analysis

Key Market Segments

By Device Type

• Power Discrete
• Power Module
• Power IC

By Material

• Silicon Carbide
• Gallium Nitride
• Sapphire
• Others

By Application

• Power Management
• Uninterruptible Power Supply
• Renewable
• Others

By End Use

• Telecommunication
• Industrial
• Automotive
• Consumer Electronics
• Military and Defense
• Energy and Power
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players:

• ABB, Ltd
• FUJI ELECTRIC CO, LTD.
• Infineon Technologies AG
• Microsemi Corporation
• Mitsubishi Electric Corporation
• Renesas Electronics Corporation
• Rockwell Automation, Inc.
• STMicroelectronics N.V.
• Texas Instruments Incorporated
• Toshiba Corporation

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

• 1.1. Report description
• 1.2. Key market segments
• 1.3. Key benefits to the stakeholders
• 1.4. Research methodology
  • 1.4.1. Primary research
  • 1.4.2. Secondary research
  • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

• 2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

• 3.1. Market definition and scope
• 3.2. Key findings
  • 3.2.1. Top impacting factors
  • 3.2.2. Top investment pockets
• 3.3. Porter's five forces analysis
  • 3.3.1. Moderate bargaining power of suppliers
  • 3.3.2. Moderate threat of new entrants
  • 3.3.3. Low to moderate threat of substitutes
  • 3.3.4. Low to high intensity of rivalry
  • 3.3.5. Low to high bargaining power of buyers
• 3.4. Market dynamics
  • 3.4.1. Drivers
    • 3.4.1.1. Increase in Demand for Power Electronics Component across Various Industry Verticals
    • 3.4.1.2. Growing Investments in Smart Grid Infrastructure
    • 3.4.1.3. Rise in Integration of Power Electronics Components in Electric Vehicles
  • 3.4.2. Restraints
    • 3.4.2.1. Complexity in Integration and System Design
  • 3.4.3. Opportunities
    • 3.4.3.1. Rising Use of Renewable Energy Sources
    • 3.4.3.2. Innovation in Power Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)

CHAPTER 4: POWER ELECTRONICS MARKET, BY DEVICE TYPE

• 4.1. Overview
  • 4.1.1. Market size and forecast
• 4.2. Power Discrete
  • 4.2.1. Key market trends, growth factors and opportunities
  • 4.2.2. Market size and forecast, by region
  • 4.2.3. Market share analysis by country
• 4.3. Power Module
  • 4.3.1. Key market trends, growth factors and opportunities
  • 4.3.2. Market size and forecast, by region
  • 4.3.3. Market share analysis by country
• 4.4. Power IC
  • 4.4.1. Key market trends, growth factors and opportunities
  • 4.4.2. Market size and forecast, by region
  • 4.4.3. Market share analysis by country

CHAPTER 5: POWER ELECTRONICS MARKET, BY MATERIAL

• 5.1. Overview
  • 5.1.1. Market size and forecast
• 5.2. Silicon Carbide
  • 5.2.1. Key market trends, growth factors and opportunities
  • 5.2.2. Market size and forecast, by region
  • 5.2.3. Market share analysis by country
• 5.3. Gallium Nitride
  • 5.3.1. Key market trends, growth factors and opportunities
  • 5.3.2. Market size and forecast, by region
  • 5.3.3. Market share analysis by country
• 5.4. Sapphire
  • 5.4.1. Key market trends, growth factors and opportunities
  • 5.4.2. Market size and forecast, by region
  • 5.4.3. Market share analysis by country
• 5.5. Others
  • 5.5.1. Key market trends, growth factors and opportunities
  • 5.5.2. Market size and forecast, by region
  • 5.5.3. Market share analysis by country

CHAPTER 6: POWER ELECTRONICS MARKET, BY APPLICATION

• 6.1. Overview
  • 6.1.1. Market size and forecast
• 6.2. Power Management
  • 6.2.1. Key market trends, growth factors and opportunities
  • 6.2.2. Market size and forecast, by region
  • 6.2.3. Market share analysis by country
• 6.3. Uninterruptible Power Supply
  • 6.3.1. Key market trends, growth factors and opportunities
  • 6.3.2. Market size and forecast, by region
  • 6.3.3. Market share analysis by country
• 6.4. Renewable
  • 6.4.1. Key market trends, growth factors and opportunities
  • 6.4.2. Market size and forecast, by region
  • 6.4.3. Market share analysis by country
• 6.5. Others
  • 6.5.1. Key market trends, growth factors and opportunities
  • 6.5.2. Market size and forecast, by region
  • 6.5.3. Market share analysis by country

CHAPTER 7: POWER ELECTRONICS MARKET, BY END USE

• 7.1. Overview
  • 7.1.1. Market size and forecast
• 7.2. Telecommunication
  • 7.2.1. Key market trends, growth factors and opportunities
  • 7.2.2. Market size and forecast, by region
  • 7.2.3. Market share analysis by country
• 7.3. Industrial
  • 7.3.1. Key market trends, growth factors and opportunities
  • 7.3.2. Market size and forecast, by region
  • 7.3.3. Market share analysis by country
• 7.4. Automotive
  • 7.4.1. Key market trends, growth factors and opportunities
  • 7.4.2. Market size and forecast, by region
  • 7.4.3. Market share analysis by country
• 7.5. Consumer Electronics
  • 7.5.1. Key market trends, growth factors and opportunities
  • 7.5.2. Market size and forecast, by region
  • 7.5.3. Market share analysis by country
• 7.6. Military and Defense
  • 7.6.1. Key market trends, growth factors and opportunities
  • 7.6.2. Market size and forecast, by region
  • 7.6.3. Market share analysis by country
• 7.7. Energy and Power
  • 7.7.1. Key market trends, growth factors and opportunities
  • 7.7.2. Market size and forecast, by region
  • 7.7.3. Market share analysis by country
• 7.8. Others
  • 7.8.1. Key market trends, growth factors and opportunities
  • 7.8.2. Market size and forecast, by region
  • 7.8.3. Market share analysis by country

CHAPTER 8: POWER ELECTRONICS MARKET, BY REGION

• 8.1. Overview
  • 8.1.1. Market size and forecast By Region
• 8.2. North America
  • 8.2.1. Key market trends, growth factors and opportunities
  • 8.2.2. Market size and forecast, by Device Type
  • 8.2.3. Market size and forecast, by Material
  • 8.2.4. Market size and forecast, by Application
  • 8.2.5. Market size and forecast, by End Use
  • 8.2.6. Market size and forecast, by country
    • 8.2.6.1. U.S.
    • 8.2.6.1.1. Market size and forecast, by Device Type
    • 8.2.6.1.2. Market size and forecast, by Material
    • 8.2.6.1.3. Market size and forecast, by Application
    • 8.2.6.1.4. Market size and forecast, by End Use
    • 8.2.6.2. Canada
    • 8.2.6.2.1. Market size and forecast, by Device Type
    • 8.2.6.2.2. Market size and forecast, by Material
    • 8.2.6.2.3. Market size and forecast, by Application
    • 8.2.6.2.4. Market size and forecast, by End Use
    • 8.2.6.3. Mexico
    • 8.2.6.3.1. Market size and forecast, by Device Type
    • 8.2.6.3.2. Market size and forecast, by Material
    • 8.2.6.3.3. Market size and forecast, by Application
    • 8.2.6.3.4. Market size and forecast, by End Use
• 8.3. Europe
  • 8.3.1. Key market trends, growth factors and opportunities
  • 8.3.2. Market size and forecast, by Device Type
  • 8.3.3. Market size and forecast, by Material
  • 8.3.4. Market size and forecast, by Application
  • 8.3.5. Market size and forecast, by End Use
  • 8.3.6. Market size and forecast, by country
    • 8.3.6.1. Germany
    • 8.3.6.1.1. Market size and forecast, by Device Type
    • 8.3.6.1.2. Market size and forecast, by Material
    • 8.3.6.1.3. Market size and forecast, by Application
    • 8.3.6.1.4. Market size and forecast, by End Use
    • 8.3.6.2. France
    • 8.3.6.2.1. Market size and forecast, by Device Type
    • 8.3.6.2.2. Market size and forecast, by Material
    • 8.3.6.2.3. Market size and forecast, by Application
    • 8.3.6.2.4. Market size and forecast, by End Use
    • 8.3.6.3. UK
    • 8.3.6.3.1. Market size and forecast, by Device Type
    • 8.3.6.3.2. Market size and forecast, by Material
    • 8.3.6.3.3. Market size and forecast, by Application
    • 8.3.6.3.4. Market size and forecast, by End Use
    • 8.3.6.4. Italy
    • 8.3.6.4.1. Market size and forecast, by Device Type
    • 8.3.6.4.2. Market size and forecast, by Material
    • 8.3.6.4.3. Market size and forecast, by Application
    • 8.3.6.4.4. Market size and forecast, by End Use
    • 8.3.6.5. Rest of Europe
    • 8.3.6.5.1. Market size and forecast, by Device Type
    • 8.3.6.5.2. Market size and forecast, by Material
    • 8.3.6.5.3. Market size and forecast, by Application
    • 8.3.6.5.4. Market size and forecast, by End Use
• 8.4. Asia-Pacific
  • 8.4.1. Key market trends, growth factors and opportunities
  • 8.4.2. Market size and forecast, by Device Type
  • 8.4.3. Market size and forecast, by Material
  • 8.4.4. Market size and forecast, by Application
  • 8.4.5. Market size and forecast, by End Use
  • 8.4.6. Market size and forecast, by country
    • 8.4.6.1. China
    • 8.4.6.1.1. Market size and forecast, by Device Type
    • 8.4.6.1.2. Market size and forecast, by Material
    • 8.4.6.1.3. Market size and forecast, by Application
    • 8.4.6.1.4. Market size and forecast, by End Use
    • 8.4.6.2. India
    • 8.4.6.2.1. Market size and forecast, by Device Type
    • 8.4.6.2.2. Market size and forecast, by Material
    • 8.4.6.2.3. Market size and forecast, by Application
    • 8.4.6.2.4. Market size and forecast, by End Use
    • 8.4.6.3. Japan
    • 8.4.6.3.1. Market size and forecast, by Device Type
    • 8.4.6.3.2. Market size and forecast, by Material
    • 8.4.6.3.3. Market size and forecast, by Application
    • 8.4.6.3.4. Market size and forecast, by End Use
    • 8.4.6.4. South Korea
    • 8.4.6.4.1. Market size and forecast, by Device Type
    • 8.4.6.4.2. Market size and forecast, by Material
    • 8.4.6.4.3. Market size and forecast, by Application
    • 8.4.6.4.4. Market size and forecast, by End Use
    • 8.4.6.5. Rest of Asia-Pacific
    • 8.4.6.5.1. Market size and forecast, by Device Type
    • 8.4.6.5.2. Market size and forecast, by Material
    • 8.4.6.5.3. Market size and forecast, by Application
    • 8.4.6.5.4. Market size and forecast, by End Use
• 8.5. LAMEA
  • 8.5.1. Key market trends, growth factors and opportunities
  • 8.5.2. Market size and forecast, by Device Type
  • 8.5.3. Market size and forecast, by Material
  • 8.5.4. Market size and forecast, by Application
  • 8.5.5. Market size and forecast, by End Use
  • 8.5.6. Market size and forecast, by country
    • 8.5.6.1. Latin America
    • 8.5.6.1.1. Market size and forecast, by Device Type
    • 8.5.6.1.2. Market size and forecast, by Material
    • 8.5.6.1.3. Market size and forecast, by Application
    • 8.5.6.1.4. Market size and forecast, by End Use
    • 8.5.6.2. Middle East
    • 8.5.6.2.1. Market size and forecast, by Device Type
    • 8.5.6.2.2. Market size and forecast, by Material
    • 8.5.6.2.3. Market size and forecast, by Application
    • 8.5.6.2.4. Market size and forecast, by End Use
    • 8.5.6.3. Africa
    • 8.5.6.3.1. Market size and forecast, by Device Type
    • 8.5.6.3.2. Market size and forecast, by Material
    • 8.5.6.3.3. Market size and forecast, by Application
    • 8.5.6.3.4. Market size and forecast, by End Use

CHAPTER 9: COMPETITIVE LANDSCAPE

• 9.1. Introduction
• 9.2. Top winning strategies
• 9.3. Product mapping of top 10 player
• 9.4. Competitive dashboard
• 9.5. Competitive heatmap
• 9.6. Top player positioning, 2023

CHAPTER 10: COMPANY PROFILES

• 10.1. ABB, Ltd
  • 10.1.1. Company overview
  • 10.1.2. Key executives
  • 10.1.3. Company snapshot
  • 10.1.4. Operating business segments
  • 10.1.5. Product portfolio
  • 10.1.6. Business performance
  • 10.1.7. Key strategic moves and developments
• 10.2. FUJI ELECTRIC CO, LTD.
  • 10.2.1. Company overview
  • 10.2.2. Key executives
  • 10.2.3. Company snapshot
  • 10.2.4. Operating business segments
  • 10.2.5. Product portfolio
  • 10.2.6. Business performance
  • 10.2.7. Key strategic moves and developments
• 10.3. Infineon Technologies AG
  • 10.3.1. Company overview
  • 10.3.2. Key executives
  • 10.3.3. Company snapshot
  • 10.3.4. Operating business segments
  • 10.3.5. Product portfolio
  • 10.3.6. Business performance
  • 10.3.7. Key strategic moves and developments
• 10.4. Microsemi Corporation
  • 10.4.1. Company overview
  • 10.4.2. Key executives
  • 10.4.3. Company snapshot
  • 10.4.4. Operating business segments
  • 10.4.5. Product portfolio
  • 10.4.6. Business performance
  • 10.4.7. Key strategic moves and developments
• 10.5. Mitsubishi Electric Corporation
  • 10.5.1. Company overview
  • 10.5.2. Key executives
  • 10.5.3. Company snapshot
  • 10.5.4. Operating business segments
  • 10.5.5. Product portfolio
  • 10.5.6. Business performance
  • 10.5.7. Key strategic moves and developments
• 10.6. Renesas Electronics Corporation
  • 10.6.1. Company overview
  • 10.6.2. Key executives
  • 10.6.3. Company snapshot
  • 10.6.4. Operating business segments
  • 10.6.5. Product portfolio
  • 10.6.6. Business performance
  • 10.6.7. Key strategic moves and developments
• 10.7. Rockwell Automation, Inc.
  • 10.7.1. Company overview
  • 10.7.2. Key executives
  • 10.7.3. Company snapshot
  • 10.7.4. Operating business segments
  • 10.7.5. Product portfolio
  • 10.7.6. Business performance
• 10.8. STMicroelectronics N.V.
  • 10.8.1. Company overview
  • 10.8.2. Key executives
  • 10.8.3. Company snapshot
  • 10.8.4. Operating business segments
  • 10.8.5. Product portfolio
  • 10.8.6. Business performance
  • 10.8.7. Key strategic moves and developments
• 10.9. Texas Instruments Incorporated
  • 10.9.1. Company overview
  • 10.9.2. Key executives
  • 10.9.3. Company snapshot
  • 10.9.4. Operating business segments
  • 10.9.5. Product portfolio
  • 10.9.6. Business performance
  • 10.9.7. Key strategic moves and developments
• 10.10. Toshiba Corporation
  • 10.10.1. Company overview
  • 10.10.2. Key executives
  • 10.10.3. Company snapshot
  • 10.10.4. Operating business segments
  • 10.10.5. Product portfolio
  • 10.10.6. Business performance
  • 10.10.7. Key strategic moves and developments

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