세계의 본딩 와이어 시장 : 재료별, 용도별-기회 분석 및 산업 예측(2023-2032년)

Bonding Wires Market By Material (Gold, Copper, Silver, Aluminum, Others), By Application (Integrated Circuits, Transistors, Sensors, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

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한글목차

세계의 본딩 와이어 시장은 2022년에 125억 달러로 평가되었고, 2023년부터 2032년까지 3.7%의 연평균 복합 성장률(CAGR)을 보일 전망이며, 2032년에는 180억 달러에 이를 것으로 추정됩니다.

본딩 와이어는 집적 회로(IC) 칩과 외부 리드 또는 단자 간의 전기적 연결을 확립하기 위해 반도체 패키징에 사용되는 극세 전도성 필라멘트입니다. 일반적으로 금, 알루미늄, 구리 등의 재료로 만들어져 반도체 장치에서 전기 신호를 전송할 수 있습니다. 열 스트레스를 견딜 수 있도록 설계되었으며 다양한 작동 조건에서 신뢰성과 전도성을 보장합니다. 중요한 도관 역할을 하는 본딩 와이어는 IC의 다른 구성 요소를 연결하는 중요한 역할을 하여 적절한 기능과 성능을 촉진합니다. 마이크로 일렉트로닉스의 조립에 필수적인 본딩 와이어는 전자 기기 및 집적 회로의 기능과 수명에 크게 기여하고 있습니다.

자동차, 항공우주, 의료용 전자기기 등 신뢰성이 최우선으로 되는 중요한 용도에서는 본딩 와이어 솔루션의 품질과 신뢰성이 점점 중요해지고 있습니다. 시장 개척은 본딩 와이어의 내구성, 열 안정성 및 기계적 무결성을 향상시키고 까다로운 산업 표준 및 규제 요구 사항을 충족하는 연구 개발에 투자하고 시장 성장을 가속합니다. 또한, 특히 중국, 대만, 한국, 동남아시아 국가 등 아시아태평양에서 반도체 제조 시설의 지리적 확대가 본딩 와이어 수요를 촉진하고 있습니다. 새로운 반도체 공장과 조립 시설의 설립은 이러한 지역에서 반도체 패키징 솔루션 수요 증가에 대응하기 위해 본딩 와이어 제조업체에 큰 비즈니스 기회를 가져와 시장 확대를 촉진하고 있습니다.

또한 환경 규제 및 지속가능성에 대한 노력 증가가 본딩 와이어 시장에 영향을 미치고 있습니다. 제조업체는 환경에 미치는 영향을 최소화하고 규제 요건을 충족하기 위해 환경 친화적이고 지속가능한 본딩 와이어 재료 및 공정 개발을 강요합니다. 무연 본딩 와이어의 채용과 재활용 및 폐기물 감소 전략의 개척은 시장 전망을 형성하면서 견인력을 늘리고 있습니다. 그러나 본딩 와이어에 일반적으로 사용되는 금과 같은 귀금속 가격의 변동은 제조 비용에 직접 영향을 미칩니다. 원료 가격 변동은 공급망을 혼란스럽게 하고 본딩 와이어 제조업체의 수익성에 영향을 줄 수 있습니다.

반대로 본딩 와이어 시장에서는 재료 혁신 기회가 증가하고 있습니다. 연구개발은 전도성, 내열성, 신뢰성을 향상시킨 신소재의 개발에 힘을 쏟고 있습니다. 예를 들어, 구리 본딩 와이어는 기존의 금 와이어에 비해 전도성이 우수하고 비용 효과가 높기 때문에 채용이 진행되고 있습니다.

본딩 와이어 시장은 재료, 제품 유형, 본딩 공정, 최종 이용 산업, 지역별로 구분됩니다. 재료 기반에서 시장은 금, 구리, 알루미늄, 은 등으로 분류됩니다. 제품 유형별로 시장은 볼 본더, 웨지 본더, 스터드 및 범프 본더, 페그 본더로 분류됩니다. 용도별로는 미소전기기계 시스템(MEMs), 광전자 시스템, 메모리, 센서 등으로 분류됩니다. 지역별로는 북미, 유럽, 아시아태평양, LAMEA에서 조사되고 있습니다.

이해관계자를 위한 주요 이점

• 본 보고서에서는 2022년부터 2032년까지의 본딩 와이어 시장 분석 시장 부문, 현재의 동향, 추정 및 동향 분석, 역학을 정량적으로 분석하여 본딩 와이어 시장의 유력한 기회를 확인합니다.
• 시장 성장 촉진요인, 시장 성장 억제요인, 시장 기회와 관련된 정보와 함께 시장 조사를 제공합니다.
• Porter's Five Forces 분석은 이해관계자들이 이익에 중점을 둔 비즈니스 결정을 내리고 공급업체와 구매자의 네트워크를 강화할 수 있도록 구매자 및 공급업체의 잠재력을 보여줍니다.
• 본딩 와이어 시장 세분화를 자세히 분석하면 시장 기회를 파악할 수 있습니다.
• 각 지역의 주요 국가는 세계 시장에 대한 수익 공헌도에 따라 매핑됩니다.
• 시장 기업 포지셔닝은 벤치마킹을 용이하게 하고 시장 기업의 현재 위치를 명확하게 이해할 수 있습니다.
• 본 보고서에는 지역별 및 세계의 본딩 와이어 시장 동향, 주요 기업, 시장 부문, 응용 분야, 시장 성장 전략의 분석이 포함되어 있습니다.

이 보고서에서 가능한 맞춤설정(별도 비용과 일정이 필요합니다.)

• 투자 기회
• 지역별 신규 참가 기업
• 기술 동향 분석
• 제품 및 부문별 기업 시장 세분화 분석
• 주요 기업의 신제품 개발 및 제품 매트릭스
• 국가, 지역, 세계 수준의 환자 및 역학 데이터
• 규제 가이드라인
• 고객의 관심에 따른 추가 기업 프로파일
• 국가별 또는 지역별 추가 분석-시장 규모 및 예측
• 기업 프로파일의 확장 목록
• 과거 시장 데이터
• 수출입 분석 및 데이터
• 주요 기업의 상세(소재지, 연락처, 공급자 및 벤더 네트워크 등을 포함한 엑셀 형식)
• 고객, 소비자 및 원료 공급업체 목록-밸류체인 분석
• 세계, 지역 및 국가 수준에서 기업의 시장 점유율 분석
• SWOT 분석
• 수량 시장 규모 및 예측

목차

제1장 서론

제2장 주요 요약

제3장 시장 개요

• 시장 정의 및 범위
• 주요 조사 결과
  • 영향요인
  • 주요 투자 기회
• Porter's Five Forces 분석
• 시장 역학
  • 성장 촉진요인
  • 억제요인
  • 기회
• 밸류체인 분석
• 주요 규제 분석
• 특허 상황

제4장 본딩 와이어 시장 : 재료별

• 개요
• 금
• 구리
• 은
• 알루미늄
• 기타

제5장 본딩 와이어 시장 : 용도별

• 개요
• 집적회로
• 트랜지스터
• 센서
• 기타

제6장 본딩 와이어 시장 : 지역별

• 개요
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 유럽
  • 독일
  • 영국
  • 프랑스
  • 스페인
  • 이탈리아
  • 기타
• 아시아태평양
  • 중국
  • 인도
  • 일본
  • 한국
  • 호주
  • 기타
• 라틴아메리카, 중동 및 아프리카
  • 브라질
  • 사우디아라비아
  • 남아프리카
  • 기타

제7장 경쟁 구도

• 서문
• 주요 성공 전략
• 주요 10개사의 제품 매핑
• 경쟁 대시보드
• 경쟁 히트맵
• 주요 기업의 포지셔닝(2022년)

제8장 기업 프로파일

• Tanaka Holdings Co., Ltd.
• Heraeus Holding GmbH
• TATSUTA Electric Wire & Cable Co., Ltd.
• Sumitomo Metal Mining Co., Ltd.
• MK Electron Co., Ltd.
• Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
• SHINKAWA Electric Co., Ltd.
• AMETEK Electronic Components And Packaging
• TANAKA Denshi Kogyo KK
• NIPPON STEEL Chemical & Material Co., Ltd.

AJY

영문 목차

영문목차

The global bonding wire market was valued at $12.5 billion in 2022 and is estimated to reach $18.0 billion by 2032, exhibiting a CAGR of 3.7% from 2023 to 2032.

Bonding wires are ultra-fine conductive filaments utilized in semiconductor packaging to establish electrical connections between an integrated circuit (IC) chip and its external leads or terminals. Usually crafted from materials such as gold, aluminum, or copper, they enable the transmission of electrical signals within the semiconductor device. Designed to endure thermal stresses, they ensure reliability and conductivity in various operating conditions. Serving as crucial conduits, bonding wires play a pivotal role in linking disparate components of the IC, thereby facilitating proper functionality and performance. Integral to microelectronics assembly, they significantly contribute to the functionality and longevity of electronic devices and integrated circuits.

In critical applications such as automotive, aerospace, and medical electronics, where reliability is paramount, there is a growing emphasis on the quality and reliability of bonding wire solutions. Manufacturers are investing in research and development to enhance the durability, thermal stability, and mechanical integrity of bonding wires to meet stringent industry standards and regulatory requirements, thereby driving market growth. Furthermore, the geographical expansion of semiconductor manufacturing facilities, particularly in Asia-Pacific regions such as China, Taiwan, South Korea, and Southeast Asian countries, propels the demand for bonding wires. The establishment of new semiconductor fabs and assembly facilities creates significant opportunities for bonding wire suppliers to cater to the growing demand for semiconductor packaging solutions in these regions, driving market expansion.

Additionally, increasing environmental regulations and sustainability initiatives are influencing the bonding wires market. Manufacturers are under pressure to develop eco-friendly and sustainable bonding wire materials and processes to minimize environmental impact and meet regulatory requirements. The adoption of lead-free bonding wires and the development of recycling and waste reduction strategies are gaining traction, shaping the market landscape. However, fluctuations in the prices of precious metals like gold, which is commonly used in bonding wires, directly impact manufacturing costs. Volatility in raw material prices can disrupt supply chains and affect the profitability of bonding wire manufacturers.

On the contrary, there is a growing opportunity for material innovation in the bonding wires market. Research and development efforts are focused on developing new wire materials with enhanced electrical conductivity, thermal performance, and reliability. For example, the adoption of copper bonding wires is gaining traction due to their superior electrical conductivity and cost-effectiveness compared to traditional gold wires.

The bonding wires market is segmented on the basis of material, product type, bonding process, end-use industry, and region. On the basis of material, the market is categorized gold, copper, aluminum, silver, and others. By product type, the market is classified into ball bonders, wedge bonders, stud/bump bonders, and peg bonders. By application, the market is divided into micro-electro-mechanical systems (MEMs), optoelectronics systems, memory, sensors, and others. Region-wise, the market is studied across North America, Europe, Asia-Pacific, and LAMEA.

The global bonding wire market profiles leading players that include Tanaka Holdings Co., Ltd., Heraeus Holding GmbH, TATSUTA Electric Wire & Cable Co., Ltd., Sumitomo Metal Mining Co., Ltd., MK Electron Co., Ltd., Yantai Zhaojin Kanfort Precision Machinery Co., Ltd., Shinkawa Electric Co., Ltd., AMETEK Electronic Components and Packaging, TANAKA Denshi Kogyo K.K., and NIPPON STEEL Chemical & Material Co., Ltd. The global bonding wire market report provides in-depth competitive analysis as well as profiles of these major players.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the bonding wires market analysis from 2022 to 2032 to identify the prevailing bonding wires market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the bonding wires market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global bonding wires market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

• Quarterly Update and* (only available with a corporate license, on listed price)
• 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
• Free Upcoming Version on the Purchase of Five and Enterprise User License.
• 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
• 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
• Free data Pack on the Five and Enterprise User License. (Excel version of the report)
• Free Updated report if the report is 6-12 months old or older.
• 24-hour priority response*
• Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

• Investment Opportunities
• Upcoming/New Entrant by Regions
• Technology Trend Analysis
• Market share analysis of players by products/segments
• New Product Development/ Product Matrix of Key Players
• Patient/epidemiology data at country, region, global level
• Regulatory Guidelines
• Additional company profiles with specific to client's interest
• Additional country or region analysis- market size and forecast
• Expanded list for Company Profiles
• Historic market data
• Import Export Analysis/Data
• Key player details (including location, contact details, supplier/vendor network etc. in excel format)
• List of customers/consumers/raw material suppliers- value chain analysis
• Market share analysis of players at global/region/country level
• SWOT Analysis
• Volume Market Size and Forecast

Key Market Segments

By Material

• Gold
• Copper
• Silver
• Aluminum
• Others

By Application

• Integrated Circuits
• Transistors
• Sensors
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Rest of Europe
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Rest of Asia-Pacific
• LAMEA
  • Brazil
  • Saudi Arabia
  • South Africa
  • Rest of LAMEA

Key Market Players:

• Tanaka Holdings Co., Ltd.
• Heraeus Holding GmbH
• TATSUTA Electric Wire & Cable Co., Ltd.
• Sumitomo Metal Mining Co., Ltd.
• MK Electron Co., Ltd.
• Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
• SHINKAWA Electric Co., Ltd.
• AMETEK Electronic Components And Packaging
• TANAKA Denshi Kogyo K.K.
• NIPPON STEEL Chemical & Material Co., Ltd.

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

• 1.1. Report description
• 1.2. Key market segments
• 1.3. Key benefits to the stakeholders
• 1.4. Research methodology
  • 1.4.1. Primary research
  • 1.4.2. Secondary research
  • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

• 2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

• 3.1. Market definition and scope
• 3.2. Key findings
  • 3.2.1. Top impacting factors
  • 3.2.2. Top investment pockets
• 3.3. Porter's five forces analysis
• 3.4. Market dynamics
  • 3.4.1. Drivers
  • 3.4.2. Restraints
  • 3.4.3. Opportunities
• 3.5. Value Chain Analysis
• 3.6. Key Regulation Analysis
• 3.7. Patent Landscape

CHAPTER 4: BONDING WIRES MARKET, BY MATERIAL

• 4.1. Overview
  • 4.1.1. Market size and forecast
• 4.2. Gold
  • 4.2.1. Key market trends, growth factors and opportunities
  • 4.2.2. Market size and forecast, by region
  • 4.2.3. Market share analysis by country
• 4.3. Copper
  • 4.3.1. Key market trends, growth factors and opportunities
  • 4.3.2. Market size and forecast, by region
  • 4.3.3. Market share analysis by country
• 4.4. Silver
  • 4.4.1. Key market trends, growth factors and opportunities
  • 4.4.2. Market size and forecast, by region
  • 4.4.3. Market share analysis by country
• 4.5. Aluminum
  • 4.5.1. Key market trends, growth factors and opportunities
  • 4.5.2. Market size and forecast, by region
  • 4.5.3. Market share analysis by country
• 4.6. Others
  • 4.6.1. Key market trends, growth factors and opportunities
  • 4.6.2. Market size and forecast, by region
  • 4.6.3. Market share analysis by country

CHAPTER 5: BONDING WIRES MARKET, BY APPLICATION

• 5.1. Overview
  • 5.1.1. Market size and forecast
• 5.2. Integrated Circuits
  • 5.2.1. Key market trends, growth factors and opportunities
  • 5.2.2. Market size and forecast, by region
  • 5.2.3. Market share analysis by country
• 5.3. Transistors
  • 5.3.1. Key market trends, growth factors and opportunities
  • 5.3.2. Market size and forecast, by region
  • 5.3.3. Market share analysis by country
• 5.4. Sensors
  • 5.4.1. Key market trends, growth factors and opportunities
  • 5.4.2. Market size and forecast, by region
  • 5.4.3. Market share analysis by country
• 5.5. Others
  • 5.5.1. Key market trends, growth factors and opportunities
  • 5.5.2. Market size and forecast, by region
  • 5.5.3. Market share analysis by country

CHAPTER 6: BONDING WIRES MARKET, BY REGION

• 6.1. Overview
  • 6.1.1. Market size and forecast By Region
• 6.2. North America
  • 6.2.1. Key market trends, growth factors and opportunities
  • 6.2.2. Market size and forecast, by Material
  • 6.2.3. Market size and forecast, by Application
  • 6.2.4. Market size and forecast, by country
    • 6.2.4.1. U.S.
    • 6.2.4.1.1. Market size and forecast, by Material
    • 6.2.4.1.2. Market size and forecast, by Application
    • 6.2.4.2. Canada
    • 6.2.4.2.1. Market size and forecast, by Material
    • 6.2.4.2.2. Market size and forecast, by Application
    • 6.2.4.3. Mexico
    • 6.2.4.3.1. Market size and forecast, by Material
    • 6.2.4.3.2. Market size and forecast, by Application
• 6.3. Europe
  • 6.3.1. Key market trends, growth factors and opportunities
  • 6.3.2. Market size and forecast, by Material
  • 6.3.3. Market size and forecast, by Application
  • 6.3.4. Market size and forecast, by country
    • 6.3.4.1. Germany
    • 6.3.4.1.1. Market size and forecast, by Material
    • 6.3.4.1.2. Market size and forecast, by Application
    • 6.3.4.2. UK
    • 6.3.4.2.1. Market size and forecast, by Material
    • 6.3.4.2.2. Market size and forecast, by Application
    • 6.3.4.3. France
    • 6.3.4.3.1. Market size and forecast, by Material
    • 6.3.4.3.2. Market size and forecast, by Application
    • 6.3.4.4. Spain
    • 6.3.4.4.1. Market size and forecast, by Material
    • 6.3.4.4.2. Market size and forecast, by Application
    • 6.3.4.5. Italy
    • 6.3.4.5.1. Market size and forecast, by Material
    • 6.3.4.5.2. Market size and forecast, by Application
    • 6.3.4.6. Rest of Europe
    • 6.3.4.6.1. Market size and forecast, by Material
    • 6.3.4.6.2. Market size and forecast, by Application
• 6.4. Asia-Pacific
  • 6.4.1. Key market trends, growth factors and opportunities
  • 6.4.2. Market size and forecast, by Material
  • 6.4.3. Market size and forecast, by Application
  • 6.4.4. Market size and forecast, by country
    • 6.4.4.1. China
    • 6.4.4.1.1. Market size and forecast, by Material
    • 6.4.4.1.2. Market size and forecast, by Application
    • 6.4.4.2. India
    • 6.4.4.2.1. Market size and forecast, by Material
    • 6.4.4.2.2. Market size and forecast, by Application
    • 6.4.4.3. Japan
    • 6.4.4.3.1. Market size and forecast, by Material
    • 6.4.4.3.2. Market size and forecast, by Application
    • 6.4.4.4. South Korea
    • 6.4.4.4.1. Market size and forecast, by Material
    • 6.4.4.4.2. Market size and forecast, by Application
    • 6.4.4.5. Australia
    • 6.4.4.5.1. Market size and forecast, by Material
    • 6.4.4.5.2. Market size and forecast, by Application
    • 6.4.4.6. Rest of Asia-Pacific
    • 6.4.4.6.1. Market size and forecast, by Material
    • 6.4.4.6.2. Market size and forecast, by Application
• 6.5. LAMEA
  • 6.5.1. Key market trends, growth factors and opportunities
  • 6.5.2. Market size and forecast, by Material
  • 6.5.3. Market size and forecast, by Application
  • 6.5.4. Market size and forecast, by country
    • 6.5.4.1. Brazil
    • 6.5.4.1.1. Market size and forecast, by Material
    • 6.5.4.1.2. Market size and forecast, by Application
    • 6.5.4.2. Saudi Arabia
    • 6.5.4.2.1. Market size and forecast, by Material
    • 6.5.4.2.2. Market size and forecast, by Application
    • 6.5.4.3. South Africa
    • 6.5.4.3.1. Market size and forecast, by Material
    • 6.5.4.3.2. Market size and forecast, by Application
    • 6.5.4.4. Rest of LAMEA
    • 6.5.4.4.1. Market size and forecast, by Material
    • 6.5.4.4.2. Market size and forecast, by Application

CHAPTER 7: COMPETITIVE LANDSCAPE

• 7.1. Introduction
• 7.2. Top winning strategies
• 7.3. Product mapping of top 10 player
• 7.4. Competitive dashboard
• 7.5. Competitive heatmap
• 7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

• 8.1. Tanaka Holdings Co., Ltd.
  • 8.1.1. Company overview
  • 8.1.2. Key executives
  • 8.1.3. Company snapshot
  • 8.1.4. Operating business segments
  • 8.1.5. Product portfolio
  • 8.1.6. Business performance
  • 8.1.7. Key strategic moves and developments
• 8.2. Heraeus Holding GmbH
  • 8.2.1. Company overview
  • 8.2.2. Key executives
  • 8.2.3. Company snapshot
  • 8.2.4. Operating business segments
  • 8.2.5. Product portfolio
  • 8.2.6. Business performance
  • 8.2.7. Key strategic moves and developments
• 8.3. TATSUTA Electric Wire & Cable Co., Ltd.
  • 8.3.1. Company overview
  • 8.3.2. Key executives
  • 8.3.3. Company snapshot
  • 8.3.4. Operating business segments
  • 8.3.5. Product portfolio
  • 8.3.6. Business performance
  • 8.3.7. Key strategic moves and developments
• 8.4. Sumitomo Metal Mining Co., Ltd.
  • 8.4.1. Company overview
  • 8.4.2. Key executives
  • 8.4.3. Company snapshot
  • 8.4.4. Operating business segments
  • 8.4.5. Product portfolio
  • 8.4.6. Business performance
  • 8.4.7. Key strategic moves and developments
• 8.5. MK Electron Co., Ltd.
  • 8.5.1. Company overview
  • 8.5.2. Key executives
  • 8.5.3. Company snapshot
  • 8.5.4. Operating business segments
  • 8.5.5. Product portfolio
  • 8.5.6. Business performance
  • 8.5.7. Key strategic moves and developments
• 8.6. Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
  • 8.6.1. Company overview
  • 8.6.2. Key executives
  • 8.6.3. Company snapshot
  • 8.6.4. Operating business segments
  • 8.6.5. Product portfolio
  • 8.6.6. Business performance
  • 8.6.7. Key strategic moves and developments
• 8.7. SHINKAWA Electric Co., Ltd.
  • 8.7.1. Company overview
  • 8.7.2. Key executives
  • 8.7.3. Company snapshot
  • 8.7.4. Operating business segments
  • 8.7.5. Product portfolio
  • 8.7.6. Business performance
  • 8.7.7. Key strategic moves and developments
• 8.8. AMETEK Electronic Components And Packaging
  • 8.8.1. Company overview
  • 8.8.2. Key executives
  • 8.8.3. Company snapshot
  • 8.8.4. Operating business segments
  • 8.8.5. Product portfolio
  • 8.8.6. Business performance
  • 8.8.7. Key strategic moves and developments
• 8.9. TANAKA Denshi Kogyo K.K.
  • 8.9.1. Company overview
  • 8.9.2. Key executives
  • 8.9.3. Company snapshot
  • 8.9.4. Operating business segments
  • 8.9.5. Product portfolio
  • 8.9.6. Business performance
  • 8.9.7. Key strategic moves and developments
• 8.10. NIPPON STEEL Chemical & Material Co., Ltd.
  • 8.10.1. Company overview
  • 8.10.2. Key executives
  • 8.10.3. Company snapshot
  • 8.10.4. Operating business segments
  • 8.10.5. Product portfolio
  • 8.10.6. Business performance
  • 8.10.7. Key strategic moves and developments

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