한글목차

히트 싱크 시장은 2022년에 55억 달러로 평가되었고, 2023년부터 2032년까지 CAGR 7.1%로 성장할 전망이며, 2032년에는 109억 달러에 이를 것으로 추정됩니다.

히트 싱크는 가전, 산업기계, 통신 장비, 자동차 시스템 등 다양한 용도로 널리 사용됩니다. 히트 싱크은 성능 저하를 방지하고 전자 부품의 수명을 연장하고 전체 시스템의 신뢰성을 보장하는 데 매우 중요한 역할을 합니다.

노트북, 스마트폰, 데스크톱 PC 등과 같은 소비자용 전자 기기에서 히트 싱크는 프로세서 및 그래픽 카드와 같은 작동 중에 발열하기 쉬운 부품을 냉각하는 데 사용됩니다. 산업용으로는 파워 일렉트로닉스, 제조 기계, 제어 시스템의 열 관리에 필수적인 냉각 장치입니다. 자동차 업계에서는 전기 자동차(EV)의 배터리 온도 조정용으로, 또한 종래의 자동차에서는 전자제어장치의 냉각용으로서 히트 싱크가 널리 채용되고 있습니다. 히트 싱크는 통신 기기, 의료기기, LED 조명 등에도 응용되어 온도를 제어하여 최적의 성능을 유지하고 있습니다.

히트 싱크에는 다양한 유형이 있으며, 각각은 특정 용도 및 열 요구 사항에 맞게 조정됩니다.

• 액티브 히트 싱크 : 액티브 히트 싱크 : 팬 및 펌프와 같은 메커니즘을 추가하여 열 분산을 적극적으로 강화합니다.
• 패시브 히트 싱크 : 자연 대류 및 방사에만 의존하는 패시브 히트 싱크는 보다 단순한 설계를 특징으로 하며 방열 요건이 낮은 용도에 적합합니다.
• 지느러미가 있는 히트 싱크 : 표면에 지느러미와 릿지를 갖추고 방열에 사용할 수 있는 표면적을 확대하여 전반적인 냉각 효율을 향상시킵니다.
• 핀 핀 히트 싱크 : 기존의 핀이 아닌 핀과 같은 구조를 이용한 히트 싱크는 컴팩트한 공간에서 효율적인 냉각 솔루션을 제공합니다.
• 압출 히트 싱크 : 압출 가공에 의해 형성되는 이 비용 효율적인 히트 싱크는 다양한 용도에 적합하며 특정 요구 사항을 충족하는 맞춤형 설계를 제공합니다.

히트 싱크 시장은 제어 시스템에서 하이브리드 히트 싱크의 사용 급증, 전력 밀도 및 성능 요구 사항 증가, 전자 기기의 소형화에 의해 현저한 성장이 전망되고 있습니다. 또한 전기 자동차(EV) 및 배터리 열 관리, 고성능 컴퓨팅 및 데이터센터는 예측 기간 동안 시장 성장에 유리한 기회를 제공할 것으로 기대됩니다. 반대로 노이즈 발생은 히트 싱크 시장의 성장을 제한합니다.

히트 싱크 시장은 유형, 재료, 산업별, 지역별로 분석됩니다. 유형별로 시장은 활성 히트 싱크, 패시브 히트 싱크 및 하이브리드 히트 싱크로 이분됩니다. 2022년에는 패시브 히트 싱크 부문이 시장을 독점하였고 2032년까지 주요 시장 점유율을 획득할 것으로 예상됩니다. 소재별로 시장은 알루미늄과 구리로 이분됩니다. 2022년에는 알루미늄 부문이 시장을 석권하였고 2032년까지 큰 시장 점유율을 획득할 것으로 예측됩니다. 산업별로는 소비자용 전자기기, 항공우주 및 방위, IT 및 통신, 자동차, 헬스케어 등으로 이분됩니다. 2022년에는 소비자용 전자기기 부문이 시장을 독점하였고 2032년까지 주요 시장 점유율을 획득할 것으로 예측됩니다.

목차

제1장 서론

제2장 주요 요약

제3장 시장 개요

• 시장 정의 및 범위
• 주요 조사 결과
  • 영향 요인
  • 주요 투자 기회
• Porter's Five Forces 분석
• 시장 역학
  • 성장 촉진요인
    • 제어 시스템에서의 하이브리드 히트 싱크의 사용 급증
    • 전력 밀도 및 성능 요건 증가
    • 전자기기의 소형화
  • 억제요인
    • 노이즈 발생
  • 기회
    • 전기 자동차(EV) 및 배터리의 열 관리
    • 고성능 컴퓨팅 및 데이터센터

제4장 히트싱크 시장 : 유형별

• 개요
• 액티브 히트 싱크
• 패시브 히트 싱크
• 하이브리드 히트 싱크

제5장 히트 싱크 시장 : 재료별

• 개요
• 알루미늄
• 구리

제6장 히트싱크 시장 : 업계별

• 개요
• 컨슈머 및 일렉트로닉스
• 항공우주 및 방위
• IT 및 통신
• 자동차
• 헬스케어
• 기타

제7장 히트싱크 시장 : 지역별

• 개요
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 유럽
  • 영국
  • 독일
  • 프랑스
  • 기타
• 아시아태평양
  • 중국
  • 일본
  • 인도
  • 한국
  • 기타
• LAMEA
  • 라틴아메리카
  • 중동
  • 아프리카

제8장 경쟁 구도

• 서문
• 주요 성공 전략
• 주요 10개사의 제품 매핑
• 경쟁 대시보드
• 경쟁 히트맵
• 주요 기업의 포지셔닝(2022년)

제9장 기업 프로파일

• ATS
• Aavid Thermalloy, LLC
• ABL Aluminium Components Ltd
• Alpha Novatech, Inc.
• CTS Corporation
• CUI Devices
• Ohmite Mfg Co
• Crydom(Sensata Technologies)
• TE Connectivity
• Wakefield Thermal, Inc.

영문목차

According to a new report published by Allied Market Research, titled, "Heat Sink Market," The heat sink market was valued at $5.5 billion in 2022, and is estimated to reach $10.9 billion by 2032, growing at a CAGR of 7.1% from 2023 to 2032.

Heat sinks find widespread use across various applications, including consumer electronics, industrial machinery, telecommunications equipment, and automotive systems. They play a pivotal role in averting performance degradation, extending the lifespan of electronic components, and ensuring the overall reliability of systems.

In consumer electronics such as laptops, smartphones, and desktop computers, heat sinks are utilized to cool processors, graphics cards, and other components prone to heat generation during operation. In industrial settings, these cooling devices are indispensable for thermal management in power electronics, manufacturing machinery, and control systems. The automotive industry extensively employs heat sinks for electric vehicles (EVs) to regulate battery temperature and in traditional vehicles for cooling electronic control units. Heat sinks are also applied in telecommunications equipment, medical devices, and LED lighting to control temperatures and sustain optimal performance.

There exist various types of heat sinks, each tailored for specific applications and thermal requirements:

• Active Heat Sinks: These incorporate additional mechanisms like fans or pumps to actively enhance heat dissipation.
• Passive Heat Sinks: Relying solely on natural convection and radiation, passive heat sinks feature a simpler design and are well-suited for applications with lower heat dissipation requirements.
• Finned Heat Sinks: Equipped with fins or ridges on the surface, these augment the available surface area for heat dissipation, thereby improving overall cooling efficiency.
• Pin Fin Heat Sinks: Utilizing pin-like structures rather than traditional fins, these heat sinks provide efficient cooling solutions in compact spaces.
• Extruded Heat Sinks: Formed through extrusion processes, these cost-effective heat sinks are suitable for various applications, offering customizable designs to meet specific requirements.
• The heat sink market is expected to witness notable growth owing to surge in use of hybrid heat sinks in control systems, increase in power density and performance requirements and miniaturization of electronic devices. Moreover, electric vehicles (EVs) and battery thermal management and high-performance computing and data centers are expected to provide lucrative opportunities for the growth of the market during the forecast period. On the contrary, noise generation limit the growth of the heat sink market.
• The Heat sink market is analyzed by type, material, industry vertical and region. On the basis of type, the market is bifurcated into active heat sinks, passive heat sinks, hybrid heat sinks. In 2022, the passive heat sinks segment dominated the market, and it is expected to acquire a major market share by 2032. On the basis of material, the market is bifurcated into aluminum and copper. In 2022, the aluminum segment dominated the market, and it is expected to acquire a major market share by 2032. On the basis of industry vertical, the market is bifurcated into consumer electronics, aerospace and defense, it and telecommunication, automotive, healthcare, and others. In 2022, the consumer electronics segment dominated the market, and it is expected to acquire a major market share by 2032.
• On the basis of region, the Heat sinks Market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
• Competitive analysis and profiles of the major global Heat sinks market players that have been provided in the report include ATS, Aavid Thermalloy, LLC, ABL Aluminium Components Ltd, Alpha Novatech, Inc., CTS Corporation, CUI Devices, Ohmite, Sensata Technologies, TE Connectivity, and Wakefield Thermal, Inc. The key strategies adopted by the major players of the Heat sinks market is product launch.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the heat sink market analysis from 2022 to 2032 to identify the prevailing heat sink market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the heat sink market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global heat sink market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

• Quarterly Update and* (only available with a corporate license, on listed price)
• 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
• Free Upcoming Version on the Purchase of Five and Enterprise User License.
• 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
• 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
• Free data Pack on the Five and Enterprise User License. (Excel version of the report)
• Free Updated report if the report is 6-12 months old or older.
• 24-hour priority response*
• Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

• Supply Chain Analysis & Vendor Margins
• Technology Trend Analysis
• Additional country or region analysis- market size and forecast
• Key player details (including location, contact details, supplier/vendor network etc. in excel format)
• List of customers/consumers/raw material suppliers- value chain analysis

Key Market Segments

By Material

• Aluminum
• Copper

By Industry Vertical

• Consumer Electronics
• Aerospace and Defense
• IT and telecommunication
• Automotive
• Healthcare
• Others

By Type

• Active Heat Sinks
• Passive Heat Sinks
• Hybrid Heat Sinks

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • UK
  • Germany
  • France
  • Rest of Europe
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of Asia-Pacific
• LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players:

• ATS
• Aavid Thermalloy, LLC
• CTS Corporation
• CUI Devices
• Ohmite Mfg Co
• TE Connectivity
• Wakefield Thermal, Inc.
• ABL Aluminium Components Ltd
• Alpha Novatech, Inc.
• Crydom (Sensata Technologies)

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

• 1.1. Report description
• 1.2. Key market segments
• 1.3. Key benefits to the stakeholders
• 1.4. Research methodology
  • 1.4.1. Primary research
  • 1.4.2. Secondary research
  • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

• 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

• 3.1. Market definition and scope
• 3.2. Key findings
  • 3.2.1. Top impacting factors
  • 3.2.2. Top investment pockets
• 3.3. Porter's five forces analysis
  • 3.3.1. Moderate to high bargaining power of suppliers
  • 3.3.2. Low to high threat of new entrants
  • 3.3.3. Moderate to high threat of substitutes
  • 3.3.4. Low to high intensity of rivalry
  • 3.3.5. Moderate to high bargaining power of buyers
• 3.4. Market dynamics
  • 3.4.1. Drivers
    • 3.4.1.1. Surge in use of hybrid heat sinks in control systems
    • 3.4.1.2. Increase in power density and performance requirements
    • 3.4.1.3. Miniaturization of electronic devices
  • 3.4.2. Restraints
    • 3.4.2.1. Noise generation
  • 3.4.3. Opportunities
    • 3.4.3.1. Electric vehicles (EVs) and battery thermal management
    • 3.4.3.2. High-performance computing and data centers

CHAPTER 4: HEAT SINK MARKET, BY TYPE

• 4.1. Overview
  • 4.1.1. Market size and forecast
• 4.2. Active Heat Sinks
  • 4.2.1. Key market trends, growth factors and opportunities
  • 4.2.2. Market size and forecast, by region
  • 4.2.3. Market share analysis by country
• 4.3. Passive Heat Sinks
  • 4.3.1. Key market trends, growth factors and opportunities
  • 4.3.2. Market size and forecast, by region
  • 4.3.3. Market share analysis by country
• 4.4. Hybrid Heat Sinks
  • 4.4.1. Key market trends, growth factors and opportunities
  • 4.4.2. Market size and forecast, by region
  • 4.4.3. Market share analysis by country

CHAPTER 5: HEAT SINK MARKET, BY MATERIAL

• 5.1. Overview
  • 5.1.1. Market size and forecast
• 5.2. Aluminum
  • 5.2.1. Key market trends, growth factors and opportunities
  • 5.2.2. Market size and forecast, by region
  • 5.2.3. Market share analysis by country
• 5.3. Copper
  • 5.3.1. Key market trends, growth factors and opportunities
  • 5.3.2. Market size and forecast, by region
  • 5.3.3. Market share analysis by country

CHAPTER 6: HEAT SINK MARKET, BY INDUSTRY VERTICAL

• 6.1. Overview
  • 6.1.1. Market size and forecast
• 6.2. Consumer Electronics
  • 6.2.1. Key market trends, growth factors and opportunities
  • 6.2.2. Market size and forecast, by region
  • 6.2.3. Market share analysis by country
• 6.3. Aerospace and Defense
  • 6.3.1. Key market trends, growth factors and opportunities
  • 6.3.2. Market size and forecast, by region
  • 6.3.3. Market share analysis by country
• 6.4. IT and telecommunication
  • 6.4.1. Key market trends, growth factors and opportunities
  • 6.4.2. Market size and forecast, by region
  • 6.4.3. Market share analysis by country
• 6.5. Automotive
  • 6.5.1. Key market trends, growth factors and opportunities
  • 6.5.2. Market size and forecast, by region
  • 6.5.3. Market share analysis by country
• 6.6. Healthcare
  • 6.6.1. Key market trends, growth factors and opportunities
  • 6.6.2. Market size and forecast, by region
  • 6.6.3. Market share analysis by country
• 6.7. Others
  • 6.7.1. Key market trends, growth factors and opportunities
  • 6.7.2. Market size and forecast, by region
  • 6.7.3. Market share analysis by country

CHAPTER 7: HEAT SINK MARKET, BY REGION

• 7.1. Overview
  • 7.1.1. Market size and forecast By Region
• 7.2. North America
  • 7.2.1. Key market trends, growth factors and opportunities
  • 7.2.2. Market size and forecast, by Type
  • 7.2.3. Market size and forecast, by Material
  • 7.2.4. Market size and forecast, by Industry Vertical
  • 7.2.5. Market size and forecast, by country
    • 7.2.5.1. U.S.
    • 7.2.5.1.1. Market size and forecast, by Type
    • 7.2.5.1.2. Market size and forecast, by Material
    • 7.2.5.1.3. Market size and forecast, by Industry Vertical
    • 7.2.5.2. Canada
    • 7.2.5.2.1. Market size and forecast, by Type
    • 7.2.5.2.2. Market size and forecast, by Material
    • 7.2.5.2.3. Market size and forecast, by Industry Vertical
    • 7.2.5.3. Mexico
    • 7.2.5.3.1. Market size and forecast, by Type
    • 7.2.5.3.2. Market size and forecast, by Material
    • 7.2.5.3.3. Market size and forecast, by Industry Vertical
• 7.3. Europe
  • 7.3.1. Key market trends, growth factors and opportunities
  • 7.3.2. Market size and forecast, by Type
  • 7.3.3. Market size and forecast, by Material
  • 7.3.4. Market size and forecast, by Industry Vertical
  • 7.3.5. Market size and forecast, by country
    • 7.3.5.1. UK
    • 7.3.5.1.1. Market size and forecast, by Type
    • 7.3.5.1.2. Market size and forecast, by Material
    • 7.3.5.1.3. Market size and forecast, by Industry Vertical
    • 7.3.5.2. Germany
    • 7.3.5.2.1. Market size and forecast, by Type
    • 7.3.5.2.2. Market size and forecast, by Material
    • 7.3.5.2.3. Market size and forecast, by Industry Vertical
    • 7.3.5.3. France
    • 7.3.5.3.1. Market size and forecast, by Type
    • 7.3.5.3.2. Market size and forecast, by Material
    • 7.3.5.3.3. Market size and forecast, by Industry Vertical
    • 7.3.5.4. Rest of Europe
    • 7.3.5.4.1. Market size and forecast, by Type
    • 7.3.5.4.2. Market size and forecast, by Material
    • 7.3.5.4.3. Market size and forecast, by Industry Vertical
• 7.4. Asia-Pacific
  • 7.4.1. Key market trends, growth factors and opportunities
  • 7.4.2. Market size and forecast, by Type
  • 7.4.3. Market size and forecast, by Material
  • 7.4.4. Market size and forecast, by Industry Vertical
  • 7.4.5. Market size and forecast, by country
    • 7.4.5.1. China
    • 7.4.5.1.1. Market size and forecast, by Type
    • 7.4.5.1.2. Market size and forecast, by Material
    • 7.4.5.1.3. Market size and forecast, by Industry Vertical
    • 7.4.5.2. Japan
    • 7.4.5.2.1. Market size and forecast, by Type
    • 7.4.5.2.2. Market size and forecast, by Material
    • 7.4.5.2.3. Market size and forecast, by Industry Vertical
    • 7.4.5.3. India
    • 7.4.5.3.1. Market size and forecast, by Type
    • 7.4.5.3.2. Market size and forecast, by Material
    • 7.4.5.3.3. Market size and forecast, by Industry Vertical
    • 7.4.5.4. South Korea
    • 7.4.5.4.1. Market size and forecast, by Type
    • 7.4.5.4.2. Market size and forecast, by Material
    • 7.4.5.4.3. Market size and forecast, by Industry Vertical
    • 7.4.5.5. Rest of Asia-Pacific
    • 7.4.5.5.1. Market size and forecast, by Type
    • 7.4.5.5.2. Market size and forecast, by Material
    • 7.4.5.5.3. Market size and forecast, by Industry Vertical
• 7.5. LAMEA
  • 7.5.1. Key market trends, growth factors and opportunities
  • 7.5.2. Market size and forecast, by Type
  • 7.5.3. Market size and forecast, by Material
  • 7.5.4. Market size and forecast, by Industry Vertical
  • 7.5.5. Market size and forecast, by country
    • 7.5.5.1. Latin America
    • 7.5.5.1.1. Market size and forecast, by Type
    • 7.5.5.1.2. Market size and forecast, by Material
    • 7.5.5.1.3. Market size and forecast, by Industry Vertical
    • 7.5.5.2. Middle East
    • 7.5.5.2.1. Market size and forecast, by Type
    • 7.5.5.2.2. Market size and forecast, by Material
    • 7.5.5.2.3. Market size and forecast, by Industry Vertical
    • 7.5.5.3. Africa
    • 7.5.5.3.1. Market size and forecast, by Type
    • 7.5.5.3.2. Market size and forecast, by Material
    • 7.5.5.3.3. Market size and forecast, by Industry Vertical

CHAPTER 8: COMPETITIVE LANDSCAPE

• 8.1. Introduction
• 8.2. Top winning strategies
• 8.3. Product mapping of top 10 player
• 8.4. Competitive dashboard
• 8.5. Competitive heatmap
• 8.6. Top player positioning, 2022

CHAPTER 9: COMPANY PROFILES

• 9.1. ATS
  • 9.1.1. Company overview
  • 9.1.2. Key executives
  • 9.1.3. Company snapshot
  • 9.1.4. Operating business segments
  • 9.1.5. Product portfolio
  • 9.1.6. Key strategic moves and developments
• 9.2. Aavid Thermalloy, LLC
  • 9.2.1. Company overview
  • 9.2.2. Key executives
  • 9.2.3. Company snapshot
  • 9.2.4. Operating business segments
  • 9.2.5. Product portfolio
  • 9.2.6. Key strategic moves and developments
• 9.3. ABL Aluminium Components Ltd
  • 9.3.1. Company overview
  • 9.3.2. Key executives
  • 9.3.3. Company snapshot
  • 9.3.4. Operating business segments
  • 9.3.5. Product portfolio
• 9.4. Alpha Novatech, Inc.
  • 9.4.1. Company overview
  • 9.4.2. Key executives
  • 9.4.3. Company snapshot
  • 9.4.4. Operating business segments
  • 9.4.5. Product portfolio
  • 9.4.6. Key strategic moves and developments
• 9.5. CTS Corporation
  • 9.5.1. Company overview
  • 9.5.2. Key executives
  • 9.5.3. Company snapshot
  • 9.5.4. Operating business segments
  • 9.5.5. Product portfolio
  • 9.5.6. Business performance
• 9.6. CUI Devices
  • 9.6.1. Company overview
  • 9.6.2. Key executives
  • 9.6.3. Company snapshot
  • 9.6.4. Operating business segments
  • 9.6.5. Product portfolio
• 9.7. Ohmite Mfg Co
  • 9.7.1. Company overview
  • 9.7.2. Key executives
  • 9.7.3. Company snapshot
  • 9.7.4. Operating business segments
  • 9.7.5. Product portfolio
• 9.8. Crydom (Sensata Technologies)
  • 9.8.1. Company overview
  • 9.8.2. Key executives
  • 9.8.3. Company snapshot
  • 9.8.4. Operating business segments
  • 9.8.5. Product portfolio
  • 9.8.6. Business performance
• 9.9. TE Connectivity
  • 9.9.1. Company overview
  • 9.9.2. Key executives
  • 9.9.3. Company snapshot
  • 9.9.4. Operating business segments
  • 9.9.5. Product portfolio
  • 9.9.6. Business performance
• 9.10. Wakefield Thermal, Inc.
  • 9.10.1. Company overview
  • 9.10.2. Key executives
  • 9.10.3. Company snapshot
  • 9.10.4. Operating business segments
  • 9.10.5. Product portfolio