세계의 프레스핏 커넥터 시장 : 재료별, 용도별 기회 분석 및 산업 예측(2023-2032년)

Press Fit Connector Market By Material (Stainless Steel, Brass), By Application (Automotive, Electronics, Data and Communication): Global Opportunity Analysis and Industry Forecast, 2023-2032

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한글목차

프레스핏 커넥터(Press Fit Connector) 시장은 2022년에 86억 달러로 평가되었으며, 2023년부터 2032년까지의 CAGR은 4.8%로 추이하며 성장할 것으로 예상되며, 2032년에는 134억 달러에 이를 것으로 추정됩니다.

프레스핏 커넥터는 전자 기기에 사용되는 연결 기술이며 기계적 압력을 사용하여 연결을 인쇄 회로 기판에 단단히 연결하기 때문에 납땜이 필요하지 않습니다.

신뢰성 있는 연결 필요성, 소형화 동향, 고속 데이터 전송 요구, 환경 배려, 재작업 능력 요구는 프레스핏 커넥터 시장 확대를 뒷받침하고 있습니다. 프레스 핏 커넥터가 다양한 분야와 응용 분야에서 널리 사용되는 이유는 이러한 요소가 복합적으로 작용하기 때문입니다.

이 연결 방법을 사용하려면 PCB의 도금된 관통 구멍에 맞는 정확한 치수와 형상의 커넥터 핀을 만들어야 합니다. 조립 시 커넥터 핀을 이 구멍에 밀어 넣으면 신호 무결성을 향출시키고 신뢰할 수 있는 전기적 성능을 보장하는 단단한 가스 연결이 형성됩니다. 고주파 용도, 소형 장치, 즉각적인 수리 및 교체가 필요한 상황과 같은 납땜이 어렵거나 불가능한 경우 프레스핏 커넥터가 사용됩니다.

보다 자동화되고 효율적인 생산 공정에 대한 요구가 증가함에 따라 시장 수요를 뒷받침하고 있습니다. 기업이 생산성을 높이고 제조 비용을 줄이기 위해 노력하면서 자동화는 중요한 전략으로 부상하고 있습니다. 자동 조립 시스템과 연동하는 프레스핏 커넥터는 이러한 추세에 자연스럽게 적합합니다. 커넥터를 미리 설계된 구멍에 정확한 힘으로 삽입하는 프레스핏 커넥터는 정밀한 특성 때문에 로봇 및 자동 기계와의 통합에 특히 적합합니다.

자동차, 가전제품, 의료 장비 등 다양한 산업 분야의 제조업체에서 일관된 품질을 유지하면서 처리량을 늘리기 위해 자동화된 생산 라인을 점점 더 많이 사용하고 있습니다. 프레스핏 커넥터는 온도 제어 및 납땜 조인트 품질 문제로 인해 자동화하기 어려울 수 있는 납땜의 복잡성 없이 빠르고 반복 가능하며 정밀한 조립을 제공함으로써 이러한 변화에 도움이 됩니다.

목차

제1장 서론

제2장 주요 요약

제3장 시장 개요

• 시장 정의 및 범위
• 주요 조사 결과
  • 영향 요인
  • 주요 투자 기회
• Porter's Five Forces 분석
• 시장 역학
  • 성장 촉진 요인
    • 자동차 섹터에 있어서 일렉트로닉스와 인포테인먼트 시스템의 채택 증가
    • 전자 시스템 및 내구성 전기 제품 수요 급증
  • 억제 요인
    • 높은 기계적 스트레스에 대한 안전성이 낮기 때문에 간헐적인 연결 및 완전한 고장이 발생하여 시장 성장이 제한
  • 기회
    • 항공우주 및 방위 분야에서 고속 데이터 전송 솔루션을 채택하면 유리한 기회를 창출

제4장 프레스핏 커넥터 시장 : 재료별

• 개요
• 스테인레스 스틸
• 황동

제5장 프레스핏 커넥터 시장 : 용도별

• 개요
• 자동차용
• 일렉트로닉스
• 데이터 통신

제6장 프레스핏 커넥터 시장 : 지역별

• 개요
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 유럽
  • 영국
  • 독일
  • 프랑스
  • 기타
• 아시아 태평양
  • 중국
  • 일본
  • 인도
  • 한국
  • 기타
• 남미
  • 남미
  • 중동
  • 아프리카

제7장 경쟁 구도

• 소개
• 주요 성공 전략
• 주요 10개사의 제품 매핑
• 경쟁 대시보드
• 경쟁 히트맵
• 주요 기업의 포지셔닝(2022년)

제8장 기업 개요

• TE Connectivity Ltd.
• Amphenol Corporation
• Fujitsu Limited
• Radiall
• HARTING Technology Group
• Japan Aviation Electronics Industry, Ltd.
• JST Mfg. Co., Ltd.
• Interplex Holdings Pte. Ltd.
• Samtec Inc.

LYJ

영문 목차

영문목차

The press fit connector market was valued at $8.6 billion in 2022 and is estimated to reach $13.4 billion by 2032, exhibiting a CAGR of 4.8% from 2023 to 2032.

A press-fit connector is a connecting technique used in electronics that does not require soldering since it uses mechanical pressure to firmly link connections to printed circuit boards.

The necessity for dependable connections, trend toward miniaturization, requirement for high-speed data transmission, environmental concerns, and demand for rework ability are driving the expansion of the press-fit connector market. The widespread use of press-fit connectors in a variety of sectors and applications is because of all these components taken together.

In order to use this connection method, connector pins must be created with precise dimensions and shapes to fit into plated through-holes on the PCB. When the connector pins are forced into these holes during assembly, a gas-tight connection is created that improves signal integrity and guarantees reliable electrical performance. In cases where soldering may be difficult or unfeasible, such as high-frequency applications, miniature devices, and circumstances requiring immediate repairs or replacements, press-fit connections are used.

The growing need for production processes that are more automated and efficient are fueling the demand in the market. Automation has emerged as an important strategy as companies work to increase productivity and lower manufacturing costs. Press-fit connections, which work with automated assembly systems, are a natural fit for this trend. Press-fit connections, where the connectors are placed with exact force into pre-designed holes, are particularly suited for integration with robots and automated machines because of their precise nature.

Automated production lines are being used more often by manufacturers in a variety of industries, such as automotive, consumer electronics, and medical equipment, to increase throughput while preserving consistent quality. By providing quick, repeatable, and precise assembly without the complications of soldering, which can be more difficult to automate due to temperature control and solder joint quality problems, press-fit connections help with this shift.

For the purpose of analysis, the press-fit connector market scope covers segmentation based on material, application, and region. The report provides information on various materials including brass and stainless steel. Furthermore, the major applications covered in the study include automotive, electronic, and data and communication. In addition, it analyzes the current market trends across different regions such as North America (U.S., Canada, and Mexico), Europe (Germany, France, UK, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The key players operating in the press-fit connector market include TE Connectivity Ltd., Amphenol Corporation, Fujitsu Limited, HARTING Technology Group, Japan Aviation Electronics Industry, Ltd., J.S.T. Mfg. Co., Ltd., Radial, Samtec Inc., and Interplex Holdings Pte. Ltd.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the press fit connector market analysis from 2022 to 2032 to identify the prevailing press fit connector market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the press fit connector market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global press fit connector market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

• Quarterly Update and* (only available with a corporate license, on listed price)
• 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
• Free Upcoming Version on the Purchase of Five and Enterprise User License.
• 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
• 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
• Free data Pack on the Five and Enterprise User License. (Excel version of the report)
• Free Updated report if the report is 6-12 months old or older.
• 24-hour priority response*
• Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

• Product Benchmarking / Product specification and applications
• Regulatory Guidelines
• Import Export Analysis/Data

Key Market Segments

By Material

• Stainless Steel
• Brass

By Application

• Automotive
• Electronics
• Data and Communication

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • UK
  • Germany
  • France
  • Rest of Europe
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of Asia-Pacific
• LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players:

• TE Connectivity Ltd.
• Amphenol Corporation
• HARTING Technology Group
• J.S.T. Mfg. Co., Ltd.
• Radiall
• Samtec Inc.
• Interplex Holdings Pte. Ltd.
• Fujitsu Limited
• Japan Aviation Electronics Industry, Ltd.

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

• 1.1. Report description
• 1.2. Key market segments
• 1.3. Key benefits to the stakeholders
• 1.4. Research methodology
  • 1.4.1. Primary research
  • 1.4.2. Secondary research
  • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

• 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

• 3.1. Market definition and scope
• 3.2. Key findings
  • 3.2.1. Top impacting factors
  • 3.2.2. Top investment pockets
• 3.3. Porter's five forces analysis
  • 3.3.1. Moderate bargaining power of suppliers
  • 3.3.2. Moderate to high threat of new entrants
  • 3.3.3. Low threat of substitutes
  • 3.3.4. Moderate to high intensity of rivalry
  • 3.3.5. Moderate to high bargaining power of buyers
• 3.4. Market dynamics
  • 3.4.1. Drivers
    • 3.4.1.1. Increase in adoption of electronics and infotainment systems in automotive sector
    • 3.4.1.2. Surge in demand for electronic systems and durable electricals is also growing
  • 3.4.2. Restraints
    • 3.4.2.1. Less secured in high mechanical stress leading to intermittent connections or complete failure restricting market growth
  • 3.4.3. Opportunities
    • 3.4.3.1. The adoption of high-speed data transfers solutions in aerospace and defense sector will create lucrative opportunities

CHAPTER 4: PRESS FIT CONNECTOR MARKET, BY MATERIAL

• 4.1. Overview
  • 4.1.1. Market size and forecast
• 4.2. Stainless Steel
  • 4.2.1. Key market trends, growth factors and opportunities
  • 4.2.2. Market size and forecast, by region
  • 4.2.3. Market share analysis by country
• 4.3. Brass
  • 4.3.1. Key market trends, growth factors and opportunities
  • 4.3.2. Market size and forecast, by region
  • 4.3.3. Market share analysis by country

CHAPTER 5: PRESS FIT CONNECTOR MARKET, BY APPLICATION

• 5.1. Overview
  • 5.1.1. Market size and forecast
• 5.2. Automotive
  • 5.2.1. Key market trends, growth factors and opportunities
  • 5.2.2. Market size and forecast, by region
  • 5.2.3. Market share analysis by country
• 5.3. Electronics
  • 5.3.1. Key market trends, growth factors and opportunities
  • 5.3.2. Market size and forecast, by region
  • 5.3.3. Market share analysis by country
• 5.4. Data and Communication
  • 5.4.1. Key market trends, growth factors and opportunities
  • 5.4.2. Market size and forecast, by region
  • 5.4.3. Market share analysis by country

CHAPTER 6: PRESS FIT CONNECTOR MARKET, BY REGION

• 6.1. Overview
  • 6.1.1. Market size and forecast By Region
• 6.2. North America
  • 6.2.1. Key market trends, growth factors and opportunities
  • 6.2.2. Market size and forecast, by Material
  • 6.2.3. Market size and forecast, by Application
  • 6.2.4. Market size and forecast, by country
    • 6.2.4.1. U.S.
    • 6.2.4.1.1. Market size and forecast, by Material
    • 6.2.4.1.2. Market size and forecast, by Application
    • 6.2.4.2. Canada
    • 6.2.4.2.1. Market size and forecast, by Material
    • 6.2.4.2.2. Market size and forecast, by Application
    • 6.2.4.3. Mexico
    • 6.2.4.3.1. Market size and forecast, by Material
    • 6.2.4.3.2. Market size and forecast, by Application
• 6.3. Europe
  • 6.3.1. Key market trends, growth factors and opportunities
  • 6.3.2. Market size and forecast, by Material
  • 6.3.3. Market size and forecast, by Application
  • 6.3.4. Market size and forecast, by country
    • 6.3.4.1. UK
    • 6.3.4.1.1. Market size and forecast, by Material
    • 6.3.4.1.2. Market size and forecast, by Application
    • 6.3.4.2. Germany
    • 6.3.4.2.1. Market size and forecast, by Material
    • 6.3.4.2.2. Market size and forecast, by Application
    • 6.3.4.3. France
    • 6.3.4.3.1. Market size and forecast, by Material
    • 6.3.4.3.2. Market size and forecast, by Application
    • 6.3.4.4. Rest of Europe
    • 6.3.4.4.1. Market size and forecast, by Material
    • 6.3.4.4.2. Market size and forecast, by Application
• 6.4. Asia-Pacific
  • 6.4.1. Key market trends, growth factors and opportunities
  • 6.4.2. Market size and forecast, by Material
  • 6.4.3. Market size and forecast, by Application
  • 6.4.4. Market size and forecast, by country
    • 6.4.4.1. China
    • 6.4.4.1.1. Market size and forecast, by Material
    • 6.4.4.1.2. Market size and forecast, by Application
    • 6.4.4.2. Japan
    • 6.4.4.2.1. Market size and forecast, by Material
    • 6.4.4.2.2. Market size and forecast, by Application
    • 6.4.4.3. India
    • 6.4.4.3.1. Market size and forecast, by Material
    • 6.4.4.3.2. Market size and forecast, by Application
    • 6.4.4.4. South Korea
    • 6.4.4.4.1. Market size and forecast, by Material
    • 6.4.4.4.2. Market size and forecast, by Application
    • 6.4.4.5. Rest of Asia-Pacific
    • 6.4.4.5.1. Market size and forecast, by Material
    • 6.4.4.5.2. Market size and forecast, by Application
• 6.5. LAMEA
  • 6.5.1. Key market trends, growth factors and opportunities
  • 6.5.2. Market size and forecast, by Material
  • 6.5.3. Market size and forecast, by Application
  • 6.5.4. Market size and forecast, by country
    • 6.5.4.1. Latin America
    • 6.5.4.1.1. Market size and forecast, by Material
    • 6.5.4.1.2. Market size and forecast, by Application
    • 6.5.4.2. Middle East
    • 6.5.4.2.1. Market size and forecast, by Material
    • 6.5.4.2.2. Market size and forecast, by Application
    • 6.5.4.3. Africa
    • 6.5.4.3.1. Market size and forecast, by Material
    • 6.5.4.3.2. Market size and forecast, by Application

CHAPTER 7: COMPETITIVE LANDSCAPE

• 7.1. Introduction
• 7.2. Top winning strategies
• 7.3. Product mapping of top 10 player
• 7.4. Competitive dashboard
• 7.5. Competitive heatmap
• 7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

• 8.1. TE Connectivity Ltd.
  • 8.1.1. Company overview
  • 8.1.2. Key executives
  • 8.1.3. Company snapshot
  • 8.1.4. Operating business segments
  • 8.1.5. Product portfolio
  • 8.1.6. Business performance
• 8.2. Amphenol Corporation
  • 8.2.1. Company overview
  • 8.2.2. Key executives
  • 8.2.3. Company snapshot
  • 8.2.4. Operating business segments
  • 8.2.5. Product portfolio
  • 8.2.6. Business performance
• 8.3. Fujitsu Limited
  • 8.3.1. Company overview
  • 8.3.2. Key executives
  • 8.3.3. Company snapshot
  • 8.3.4. Operating business segments
  • 8.3.5. Product portfolio
  • 8.3.6. Business performance
• 8.4. Radiall
  • 8.4.1. Company overview
  • 8.4.2. Key executives
  • 8.4.3. Company snapshot
  • 8.4.4. Operating business segments
  • 8.4.5. Product portfolio
• 8.5. HARTING Technology Group
  • 8.5.1. Company overview
  • 8.5.2. Key executives
  • 8.5.3. Company snapshot
  • 8.5.4. Operating business segments
  • 8.5.5. Product portfolio
  • 8.5.6. Key strategic moves and developments
• 8.6. Japan Aviation Electronics Industry, Ltd.
  • 8.6.1. Company overview
  • 8.6.2. Key executives
  • 8.6.3. Company snapshot
  • 8.6.4. Operating business segments
  • 8.6.5. Product portfolio
  • 8.6.6. Business performance
• 8.7. J.S.T. Mfg. Co., Ltd.
  • 8.7.1. Company overview
  • 8.7.2. Key executives
  • 8.7.3. Company snapshot
  • 8.7.4. Operating business segments
  • 8.7.5. Product portfolio
  • 8.7.6. Key strategic moves and developments
• 8.8. Interplex Holdings Pte. Ltd.
  • 8.8.1. Company overview
  • 8.8.2. Key executives
  • 8.8.3. Company snapshot
  • 8.8.4. Operating business segments
  • 8.8.5. Product portfolio
  • 8.8.6. Key strategic moves and developments
• 8.9. Samtec Inc.
  • 8.9.1. Company overview
  • 8.9.2. Key executives
  • 8.9.3. Company snapshot
  • 8.9.4. Operating business segments
  • 8.9.5. Product portfolio

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