다이싱 테이프는 반도체 제조 공정, 특히 웨이퍼를 개별 반도체 칩으로 절단하는 웨이퍼 다이싱 공정에 사용되는 특수 접착 테이프입니다. 이 테이프는 웨이퍼의 절단 공정에서 웨이퍼를 고정하고, 이후 손상 없이 개별 칩을 쉽게 떼어낼 수 있도록 설계되어 있습니다. 다이싱 테이프는 다이싱 공정에서 칩의 오염과 손상을 방지하여 반도체 칩의 무결성과 품질을 보장하는 데 매우 중요합니다. 다이싱 테이프는 크게 UV 경화형과 비 UV 경화형의 두 가지 유형이 있으며, UV 경화형은 자외선을 조사하면 접착력이 감소하고 칩을 쉽게 픽업할 수 있으며, 인기가 높아지고 있습니다. 다이싱 테이프 시장 규모는 괄목할 만한 성장세를 보이고 있으며, 연평균 성장률(CAGR)은 6.6%로 예측되고 있습니다. 이러한 성장의 원동력은 전 세계 전자 산업의 확대, 특히 더 작고 효율적인 전자기기에 대한 수요가 증가함에 따라 보다 정밀하고 효과적인 웨이퍼 다이싱 솔루션이 요구되고 있습니다. 전자기기의 소형화에 따라 더 작고 고품질의 칩 생산에 대응할 수 있는 신뢰성 있고 효율적인 다이싱 테이프에 대한 요구가 증가하고 있습니다. 또한 다이싱 기술 및 재료 과학의 발전으로 보다 강력한 접착력, 우수한 내열성, 칩 제거 용이성 등의 성능 특성을 향상시킨 보다 정교한 다이싱 테이프의 개발이 진행되고 있습니다. 또한 소비자 전자제품의 보급과 산업 분야의 확대로 인해 전자제품 제조가 성장하고 있는 신흥 지역에서 수요 증가도 이 시장의 성장 동력이 되고 있습니다.
다이싱 테이프 시장의 주요 촉진요인은 모바일 기기, 웨어러블 기기 및 기타 첨단 전자 제품에 대한 소비자 수요 증가에 힘입어 세계 전자 산업의 급속한 성장에 힘입은 것입니다. 기기의 소형화, 내부 회로의 고밀도화에 따라 정밀하고 신뢰할 수 있는 다이싱 기술의 필요성이 증가하고 있습니다. 다이싱 테이프는 웨이퍼 다이싱 공정에서 반도체 칩의 무결성과 품질을 보장하는 데 중요한 역할을 합니다. 전자기기 생산이 급증함에 따라 반도체 칩이 대량으로 필요하므로 깨끗하고 정밀하게 절단된 칩 생산을 지원하는 다이싱 테이프에 대한 수요가 증가하고 있습니다. 이러한 성장은 주요 전자기기 제조 거점이 있는 아시아 등의 지역에서 특히 두드러지게 나타나고 있습니다.
다이싱 테이프 시장의 기회는 반도체 공정의 기술 발전에 있습니다. 칩이 소형화되고 용도가 복잡해짐에 따라 제조업체들은 절단 공정에서 오염과 손상을 최소화할 수 있는 다이싱 솔루션을 요구하고 있습니다. 더 높은 접착력, 더 나은 내열성, 더 쉬운 칩 이형성을 제공하는 테이프 소재의 혁신은 매우 중요합니다. 예를 들어 UV 경화형 다이싱 테이프의 개발로 자외선을 조사하면 접착력이 감소하여 가공 후 칩 픽업이 매우 쉬워졌습니다. 이 기능은 정밀도가 가장 중요한 마이크로 전자 부품 제조에 특히 유용합니다.
세계의 다이싱 테이프 시장에 대해 조사했으며, 시장의 개요와 두께별, 제품별, 기재별, 코팅 유형별, 용도별, 지역별 동향 및 시장에 참여하는 기업의 개요 등을 제공하고 있습니다.
목차
제1장 서문
제2장 개요
제3장 다이싱 테이프 시장 : 경쟁 분석
제4장 다이싱 테이프 시장 : 거시 분석과 시장 역학
서론
세계의 다이싱 테이프 시장가치(2023-2033년)
시장 역학
촉진요인과 억제요인의 영향 분석
시소 분석
Porter's Five Forces 모델
PESTEL 분석
제5장 다이싱 테이프 시장 : 두께별(2023-2033년)
시장 개요
성장과 매출 분석 : 2024년 대 2033년
시장 세분화
제6장 다이싱 테이프 시장 : 제품별(2023-2033년)
시장 개요
성장과 매출 분석 : 2024년 대 2033년
시장 세분화
제7장 다이싱 테이프 시장 : 기재별(2023-2033년)
시장 개요
성장과 매출 분석 : 2024년 대 2033년
시장 세분화
제8장 다이싱 테이프 시장, 코팅 유형별(2023-2033년)
시장 개요
성장과 매출 분석 : 2024년 대 2033년
시장 세분화
제9장 다이싱 테이프 시장 : 용도별(2023-2033년)
시장 개요
성장과 매출 분석 : 2024년 대 2033년
시장 세분화
제10장 북미의 다이싱 테이프 시장(2023-2033년)
제11장 영국 및 EU 다이싱 테이프 시장(2023-2033년)
제12장 아시아태평양다이싱 테이프 시장(2023-2033년)
제13장 라틴아메리카다이싱 테이프 시장(2023-2033년)
제14장 중동·아프리카다이싱 테이프 시장(2023-2033년)
제15장 기업 개요
Nitto Denko Corp
Mitsui Chemicals Inc.
Sumitomo Bakelite Co. Ltd.
AI Technology Inc.
LINTEC Corporation
Denka Company Limited
Ultron Systems Inc.
Pantech Tape Co. Ltd.
QES GROUP BERHAD
Nippon Pulse Motor Taiwan
Loadpoint Limited.
Daest Coating India Pvt. Ltd.
Shenzhen Xinst Technology Co. Ltd
Solar Plus Company
KSA
영문 목차
영문목차
Dicing tapes are specialized adhesive tapes used in the semiconductor manufacturing process, particularly during the wafer dicing phase, which involves cutting a wafer into individual semiconductor chips. These tapes are designed to hold the wafer in place during the cutting process, and then subsequently allow for the easy release of individual chips without causing damage. Dicing tapes are crucial for ensuring the integrity and quality of semiconductor chips as they prevent the chips from being contaminated or damaged during the dicing process. They come in two main types: UV-curable and non-UV curable, with UV-curable tapes becoming more popular due to their ability to lose adhesiveness when exposed to UV light, making chip pickup easier. The dicing tapes market is experiencing significant growth with a projected Compound Annual Growth Rate (CAGR) of 6.6%. This growth is driven by the expanding global electronics industry, particularly the increasing demand for smaller and more efficient electronic devices, which require more precise and effective wafer dicing solutions. As electronic devices become more compact, the need for reliable and efficient dicing tapes that can support the production of smaller, high-quality chips increases. Additionally, advancements in dicing technology and materials science are leading to the development of more sophisticated dicing tapes that offer improved performance characteristics such as stronger adhesion, better heat resistance, and easier chip removal. The market is also benefiting from the rising demand in emerging regions where electronics manufacturing is growing due to increasing consumer electronics adoption and expanding industrial sectors.
Expansion of the Global Electronics Industry
A primary driver for the dicing tapes market is the rapid expansion of the global electronics industry, fueled by the growing consumer demand for mobile devices, wearables, and other advanced electronic products. As these devices become increasingly compact and their internal circuits more densely packed, the need for precise and reliable dicing technologies escalates. Dicing tapes play a crucial role in ensuring the integrity and quality of semiconductor chips during the wafer dicing process. The surge in production of electronic devices requires high volumes of semiconductor chips, which in turn drives demand for dicing tapes that can support the production of clean, accurately cut chips. This growth is particularly pronounced in regions like Asia, where major electronics manufacturing hubs are located.
Technological Advancements in Semiconductor Processing
An opportunity within the dicing tapes market lies in the ongoing technological advancements in semiconductor processing. As chips become smaller and their applications more complex, manufacturers seek dicing solutions that minimize contamination and damage during the cutting process. Innovations in tape materials that offer higher adhesion, better heat resistance, and easier chip release are crucial. For instance, the development of UV-curable dicing tapes, which lose adhesion when exposed to UV light, allows for much easier post-process chip pickup. This capability is particularly beneficial in the production of microelectronic components, where precision is paramount.
High Cost of Advanced Dicing Technologies
A significant restraint in the dicing tapes market is the high cost associated with advanced dicing technologies. While manufacturers are eager to adopt the latest innovations in dicing tapes that promise cleaner cuts and minimal chip damage, the cost of these advanced materials can be prohibitive, especially for smaller manufacturers or those in emerging markets. This cost barrier can slow the adoption of newer, more efficient dicing tapes, particularly in regions where cost constraints are tighter. Moreover, the ongoing need for manufacturers to balance cost with performance continues to challenge the market's growth.
Stringent Quality Standards and Environmental Regulations
One major challenge facing the dicing tapes market is adhering to stringent quality standards and environmental regulations. As the electronics industry moves towards greener production methods, dicing tape manufacturers must also innovate to produce environmentally friendly materials that do not compromise the performance or quality of the semiconductor dicing process. Complying with international standards for electronic waste and hazardous substances is vital, but integrating these requirements into the production of dicing tapes can be complex and costly. Manufacturers must continually evolve their product lines to meet both the technical and regulatory demands of the market, which can strain resources and slow down the development of new products.
Market Segmentation by Thickness
In the dicing tapes market, thickness categories include Below 85 Micron, 85-125 Micron, 126-150 Micron, and Above 150 Micron. The 85-125 Micron segment is expected to witness the highest Compound Annual Growth Rate (CAGR) due to its optimal balance of strength and flexibility, making it suitable for a wide range of semiconductor dicing applications. This thickness range provides adequate support for the wafers during the dicing process, minimizing breakage while still allowing for the precision required for smaller chips. On the revenue front, the Below 85 Micron segment currently generates the highest revenue. This segment's dominance is attributed to its widespread use in manufacturing smaller and thinner semiconductor chips, which are increasingly demanded in compact electronic devices. The thinner tapes offer superior conformability and surface contact, which is critical for achieving high-quality cuts in delicate and intricate dicing operations.
Market Segmentation by Product
Regarding product types, the dicing tapes market is segmented into UV Curable Dicing Type and Non UV Curable Dicing Type. The UV Curable Dicing Type is projected to have the highest CAGR, as these tapes provide significant advantages in terms of reducing total process time and improving the ease of chip pick-up post-dicing. UV curable tapes become less adhesive when exposed to UV light, simplifying the chip removal process without damaging the chips. This feature is particularly valuable in the production of high-density semiconductor devices where precision is paramount. Despite the growing popularity of UV curable tapes, Non UV Curable Dicing Type tapes continue to account for the highest revenue share in the market. Their long-standing presence in the industry, combined with their cost-effectiveness and reliability for general dicing needs, keeps them in a leading position in terms of sales volume, particularly in markets where the adoption of newer technologies is slower.
Geographic Segment
The dicing tapes market exhibits significant geographic diversity, reflecting varying trends across different regions. Asia Pacific is experiencing the highest Compound Annual Growth Rate (CAGR), driven by the robust electronics manufacturing sector in countries such as South Korea, China, Japan, and Taiwan. These countries host major semiconductor production facilities where dicing tapes are extensively used. The demand in Asia Pacific is fueled by continuous advancements in consumer electronics, automotive electronics, and telecommunications, all of which require sophisticated semiconductor components. In 2024, North America generated the highest revenue in the dicing tapes market, supported by the presence of leading semiconductor companies and a strong technological infrastructure. This region benefits from advanced manufacturing techniques and a steady investment in research and development activities related to semiconductor processes.
Competitive Trends and Key Strategies
In 2024, the competitive landscape of the dicing tapes market was dominated by major players such as Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems, Inc., Pantech Tape Co. Ltd., QES GROUP BERHAD, Nippon Pulse Motor Taiwan, Loadpoint Limited, Daest Coating India Pvt. Ltd., Shenzhen Xinst Technology Co. Ltd., and Solar Plus Company. These companies focused heavily on technological innovation and strategic expansions to enhance their market positions. Nitto Denko Corp and LINTEC Corporation, in particular, leveraged their extensive R&D capabilities to develop innovative dicing tape solutions that offer superior performance in terms of adhesion and ease of chip removal. Mitsui Chemicals and Sumitomo Bakelite emphasized improving the environmental sustainability of their products, aiming to reduce the ecological impact associated with semiconductor manufacturing.
Historical & Forecast Period
This study report represents an analysis of each segment from 2023 to 2033 considering 2024 as the base year. Compounded Annual Growth Rate (CAGR) for each of the respective segments estimated for the forecast period of 2025 to 2033.
The current report comprises quantitative market estimations for each micro market for every geographical region and qualitative market analysis such as micro and macro environment analysis, market trends, competitive intelligence, segment analysis, porters five force model, top winning strategies, top investment markets, emerging trends & technological analysis, case studies, strategic conclusions and recommendations and other key market insights.
Research Methodology
The complete research study was conducted in three phases, namely: secondary research, primary research, and expert panel review. The key data points that enable the estimation of Dicing Tapes market are as follows:
Research and development budgets of manufacturers and government spending
Revenues of key companies in the market segment
Number of end users & consumption volume, price, and value.
Geographical revenues generated by countries considered in the report
Micro and macro environment factors that are currently influencing the Dicing Tapes market and their expected impact during the forecast period.
Market forecast was performed through proprietary software that analyzes various qualitative and quantitative factors. Growth rate and CAGR were estimated through intensive secondary and primary research. Data triangulation across various data points provides accuracy across various analyzed market segments in the report. Application of both top-down and bottom-up approach for validation of market estimation assures logical, methodical, and mathematical consistency of the quantitative data.
Market Segmentation
Thickness
Below 85 Micron
85-125 Micron
126-150 Micron
Above 150 Micron
Product
UV Curable Dicing Type
Non UV Curable Dicing Type
Backing Material
PVC
PET
PO
Others (EVA, etc.)
Coating Type
Single Sided
Double Sided
Application
Wafer Dicing
Package Dicing
Others (Glass, Ceramics)
Region Segment (2023-2033; US$ Million)
North America
U.S.
Canada
Rest of North America
UK and European Union
UK
Germany
Spain
Italy
France
Rest of Europe
Asia Pacific
China
Japan
India
Australia
South Korea
Rest of Asia Pacific
Latin America
Brazil
Mexico
Rest of Latin America
Middle East and Africa
GCC
Africa
Rest of Middle East and Africa
Key questions answered in this report
What are the key micro and macro environmental factors that are impacting the growth of Dicing Tapes market?
What are the key investment pockets concerning product segments and geographies currently and during the forecast period?
Estimated forecast and market projections up to 2033.
Which segment accounts for the fastest CAGR during the forecast period?
Which market segment holds a larger market share and why?
Are low and middle-income economies investing in the Dicing Tapes market?
Which is the largest regional market for Dicing Tapes market?
What are the market trends and dynamics in emerging markets such as Asia Pacific, Latin America, and Middle East & Africa?
Which are the key trends driving Dicing Tapes market growth?
Who are the key competitors and what are their key strategies to enhance their market presence in the Dicing Tapes market worldwide?
Table of Contents
1. Preface
1.1. Report Description
1.1.1. Purpose of the Report
1.1.2. Target Audience
1.1.3. Key Offerings
1.2. Market Segmentation
1.3. Research Methodology
1.3.1. Phase I - Secondary Research
1.3.2. Phase II - Primary Research
1.3.3. Phase III - Expert Panel Review
1.3.4. Assumptions
1.3.5. Approach Adopted
2. Executive Summary
2.1. Market Snapshot: Global Dicing Tapes Market
2.2. Global Dicing Tapes Market, By Thickness, 2024 (US$ Million)
2.3. Global Dicing Tapes Market, By Product, 2024 (US$ Million)
2.4. Global Dicing Tapes Market, By Backing Material, 2024 (US$ Million)
2.5. Global Dicing Tapes Market, By Coating Type, 2024 (US$ Million)
2.6. Global Dicing Tapes Market, By Application, 2024 (US$ Million)
2.7. Global Dicing Tapes Market, By Geography, 2024 (US$ Million)
2.8. Attractive Investment Proposition by Geography, 2024
3. Dicing Tapes Market: Competitive Analysis
3.1. Market Positioning of Key Dicing Tapes Market Vendors
3.2. Strategies Adopted by Dicing Tapes Market Vendors
