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An interactive dashboard and structured market tracker that includes quarterly data on worldwide IoT eSIM modules and iSIM chipsets from 2018 to Q1 2023.
The ‘Global IoT eSIM Modules and iSIM Chipsets Market Tracker’ is a structured market sizing database of worldwide IoT eSIM modules and iSIM chipsets. This product gets updated quarterly with the most recent data.
SAMPLE VIEW
Included data:
Slice and dice the data according to your requirements.
Connectivity technologies: 2G, 3G, LTE-Cat 1,LTE Cat 1 bis, 4G, LTE-M, NB-IoT, LPWA dual mode, and 5G. Including fallback and categories for each technology
10 regions: China, North America, Western Europe, Eastern Europe, the Middle East and Africa, Latin America, Japan, India, Korea, Asia, and Other
737 unique module models and 150 unique chipset models
Full product details
Contact sales for a demo or a quote customized to your requirements
Companies mentioned:
A selection of companies mentioned in the report.
AM Telecom
ASR
Cavli Wireless
Ccfrom
Cheerzing
China Mobile
Continental Automotive
Eigencomm
Fibocom
GCT
Gosuncn
H3C
Hisilicon
Huawei
Intel
Kyocera
LG Innotek
Lierda
Longsung
Marvell
Mediatek
Meig
MobileTek
Murata
Neoway
Pycom
Qualcomm
Quectel
Rinlink
Rolling Wireless
Ruijie
SIMCom
Sequans
Sercomm
Sierra Wireless
Sony Altair
Taiyo
Yuden
Telit Cinterion
Titan
UNISOC
USR(Wenheg)
Ucloudy
Wutong
XinYi
Yuge Technology
u-blox
Table of Contents
Global IoT eSIM Modules and iSIM Chipsets Market Tracker (EXCEL)